scholarly journals The Curing Rheokinetics of Epoxyphosphazene Binders

Materials ◽  
2020 ◽  
Vol 13 (24) ◽  
pp. 5685
Author(s):  
Natalia V. Bornosuz ◽  
Irina Yu. Gorbunova ◽  
Vyacheslav V. Kireev ◽  
Denis V. Onuchin ◽  
Mikhail L. Kerber ◽  
...  
Keyword(s):  
Molecular Mass ◽  
Network Formation ◽  
High Density ◽  
Curing Process ◽  
Mass Growth ◽  
Modifying Additives ◽  
Rotational Viscometry ◽  
Epoxy Amine ◽  
Linear Chains ◽  
Viscosity Increase

The influence of epoxyphosphazene-modifying additives on the features of the hot curing process of epoxy-amine composition was studied by the rotational viscometry method. The modification caused an acceleration of the curing process, changed rheokinetics of viscosity increase, especially the stage molecular mass growth of linear chains became almost twice shorter for composition with 30% modifier than for unmodified one. We suggest the reason for these changes is the polyfunctionality of epoxyphosphazene, which finally results in high-density network formation. In cold curing process the bulkiness of epoxyphosphazene molecule and the lack of heat for its motion results in incomplete cure. Thus, in order to cope with these difficulties hot curing systems were proposed and studied.

scholarly journals Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3853
Author(s):  
Bilen Emek Abali ◽  
Michele Zecchini ◽  
Gilda Daissè ◽  
Ivana Czabany ◽  
Wolfgang Gindl-Altmutter ◽  
...  
Keyword(s):  
Inverse Analysis ◽  
Building Materials ◽  
Cure Kinetics ◽  
Accurate Estimation ◽  
Curing Process ◽  
Degree Of Cure ◽  
Material Parameters ◽  
Epoxy Amine ◽  
Thermosetting Polymers ◽  
Material Equation

Thermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature necessary for a fast and complete curing. As material properties depend on the degree of cure, its accurate estimation is of paramount interest and the main objective in this work. Thus, we develop an approach for modeling the curing process for epoxy based thermosetting polymers. Specifically, we perform experiments and demonstrate an inverse analysis for determining parameters in the curing model. By using calorimetry measurements and implementing an inverse analysis algorithm by using open-source packages, we obtain 10 material parameters describing the curing process. We present the methodology for two commercial, epoxy based products, where a statistical analysis provides independence of material parameters leading to the conclusion that the material equation is adequately describing the material response.

scholarly journals How to add a five-membered ring to polycyclic aromatic hydrocarbons (PAHs) – molecular mass growth of the 2-naphthyl radical (C10H7) to benzindenes (C13H10) as a case study

2019 ◽  
Vol 21 (30) ◽  
pp. 16737-16750 ◽  
Author(s):  
Long Zhao ◽  
Matthew Prendergast ◽  
Ralf I. Kaiser ◽  
Bo Xu ◽  
Utuq Ablikim ◽  
...  
Keyword(s):  
Polycyclic Aromatic Hydrocarbons ◽  
Molecular Mass ◽  
Aromatic Hydrocarbons ◽  
Membered Ring ◽  
Growth Processes ◽  
Mass Growth ◽  
Aryl Radicals ◽  
Polycyclic Aromatic

The reaction of aryl radicals with allene/methylacetylene leads to five-membered ring addition in PAH growth processes.

Mesoscopic Heterogeneity in the Curing Process of an Epoxy–Amine System

2019 ◽  
Vol 52 (5) ◽  
pp. 2075-2082 ◽  
Author(s):  
Mika Aoki ◽  
Atsuomi Shundo ◽  
Riichi Kuwahara ◽  
Satoru Yamamoto ◽  
Keiji Tanaka
Keyword(s):  
Curing Process ◽  
Epoxy Amine ◽  
Amine System

Epoxy-Aromatic Diamine Kinetics. 2. Influence on Epoxy-Amine Network Formation

1995 ◽  
Vol 28 (23) ◽  
pp. 7608-7611 ◽  
Author(s):  
E. Girard-Reydet ◽  
C. C. Riccardi ◽  
H. Sautereau ◽  
J. P. Pascault
Keyword(s):  
Network Formation ◽  
Aromatic Diamine ◽  
Epoxy Amine

Entropy-driven segregation in epoxy-amine systems at a copper interface

Soft Matter ◽  
2021 ◽  
Author(s):  
Satoru Yamamoto ◽  
Keiji Tanaka
Keyword(s):  
Curing Process ◽  
Epoxy Amine

Smaller molecules were preferentially segregated at the interface regardless of the epoxy and amine, and this segregation remained after the curing process.

Effect of the size of inclusions on structural organization and deformation behavior of high-density filled polyethylene with different molecular mass

1988 ◽  
Vol 23 (4) ◽  
pp. 419-425 ◽  
Author(s):  
V. A. Topolkaraev ◽  
Yu. M. Tovmasyan ◽  
I. L. Dubnikova ◽  
A. I. Petrosyan ◽  
I. N. Meshkova ◽  
...  
Keyword(s):  
Molecular Mass ◽  
Deformation Behavior ◽  
Structural Organization ◽  
High Density
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