scholarly journals Quadrilateral Micro-Hole Array Machining on Invar Thin Film: Wet Etching and Electrochemical Fusion Machining

Materials ◽  
2018 ◽  
Vol 11 (1) ◽  
pp. 160 ◽  
Author(s):  
Woong-Kirl Choi ◽  
Seong-Hyun Kim ◽  
Seung-Geon Choi ◽  
Eun-Sang Lee
Keyword(s):  
Thin Film ◽  
Wet Etching ◽  
Hole Array ◽  
Micro Hole

Thin-film solar cells with InGaAs/GaAsP multiple quantum wells and a rear surface etched with light trapping micro-hole array

2015 ◽  
Vol 54 (8S1) ◽  
pp. 08KA13 ◽  
Author(s):  
Kentaroh Watanabe ◽  
Tomoyuki Inoue ◽  
Hassanet Sodabanlu ◽  
Masakazu Sugiyama ◽  
Yoshiaki Nakano
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Quantum Wells ◽  
Light Trapping ◽  
Rear Surface ◽  
Thin Film Solar Cells ◽  
Multiple Quantum Wells ◽  
Hole Array ◽  
Multiple Quantum ◽  
Micro Hole

Integrated Mixing/Reaction Micro Flow Cell for Chemical and Biochemical Applications

1999 ◽  
Author(s):  
Ryosuke Nakamura ◽  
Shuichi Shoji ◽  
Akira Yotsumoto
Keyword(s):  
Thin Film ◽  
Temperature Control ◽  
Temperature Sensor ◽  
Flow Cell ◽  
Reaction Chamber ◽  
Hole Array ◽  
Porous Si ◽  
Micro Flow ◽  
Junction Diode ◽  
Micro Reactor

Abstract An integrated mixing/reaction micro flow cell which consists of a sample/reagent mixing channel, a visible port and a reaction chamber was designed, fabricated and tested. A micro cone hole array of macro porous Si was employed for reagent injection part. A visible light transparent PDMS slab was used as the visible port. A Ti-Pt thin film heater and a p-n junction diode temperature sensor were integrated on the reaction chamber to realize feedback temperature control. Uniform mixing and precise temperature control were realized by the fabricated micro flow cell. The striate and simple microchannel structure of the micro flow cell is suitable for multiplexed micro reactor for chemical and biochemical applications.

Key Technology of Microelectrode Array Fabrication by Ultrasonic Enhanced Micro-EDM

2007 ◽  
Author(s):  
Guanxin Chi ◽  
Weiliang Zeng ◽  
Desheng Dong ◽  
Zhenlong Wang
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Microelectrode Array ◽  
Electrical Discharge Machining ◽  
Short Circuit ◽  
High Price ◽  
Hole Array ◽  
Micro Edm ◽  
Plane Plate ◽  
Micro Hole

Micro electrical discharge machining (EDM), enhanced with ultrasonic vibration, is explored and assessed as a new technology for developing microelectrode array, for microelectrode array fabricated by LIGA has shortcomings such as complex technology and high price. Based on the mechanism of micro-EDM, micro-hole array discharges to fabricate microelectrode array by reverse copying. In the process of reverse copying, the thicker rod electrode can’t rotate, resulting in electric arc and short-circuit easily, so it is necessary to add ultrasonic vibration on the plane plate electrode. According to the technology, a set of micro-EDM system is designed and developed. On the machining system, influence of ultrasonic vibration is analysed from the way of vibration mechanics through theoretical analysis and experimental observation. Compared with machining without ultrasonic vibration, single discharging energy decreases 1/2, discharge frequency improves three times, machining efficiency increases two times and better surface quality is achieved. Finally, 5×5 arrays of microelectrode and microhole made by these microelectrode arrays are got, the diameter of single electrode is less than 30μm and height-to-width aspect ratio is more than 8, moreover these arrays of microelectrode and micro-hole have very good surface quality.

P-67: Wet Etching of Gallium Indium Zinc Oxide (GIZO) Semiconductor for Thin Film Transistor Application

2008 ◽  
Vol 39 (1) ◽  
pp. 1439 ◽  
Author(s):  
Jong Hyun Seo ◽  
Sang-Hyuk Lee ◽  
Bo-Hyun Seo ◽  
Jae-Hong Jeon ◽  
HeeHwan Choe ◽  
...  
Keyword(s):  
Thin Film ◽  
Zinc Oxide ◽  
Thin Film Transistor ◽  
Wet Etching ◽  
Indium Zinc Oxide

scholarly journals Vortex States of Exfoliated Bi2Sr2CaCu2O8+y Thin Films with and without Micro-Hole Array

2013 ◽  
Vol 45 ◽  
pp. 125-128
Author(s):  
S. Ooi ◽  
T. Mochiku ◽  
M. Tachiki ◽  
K. Hirata
Keyword(s):  
Thin Films ◽  
Hole Array ◽  
Vortex States ◽  
Micro Hole

Analysis of Wet Etching Characteristics of a-IGZO Thin Film

2012 ◽  
Vol 476-478 ◽  
pp. 2339-2343
Author(s):  
Long Long Chen ◽  
Xi Feng Li ◽  
Ji Feng Shi ◽  
Hao Zhang ◽  
Chun Ya Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Oxalic Acid ◽  
Glass Substrate ◽  
Etching Rate ◽  
Rf Sputtering ◽  
Wet Etching ◽  
Type Structure ◽  
Taper Angle ◽  
Amorphous Ingazno

Amorphous InGaZnO (a-IGZO) films are deposited on the glass substrate by RF sputtering and the influence of wet etching of a-IGZO films, etching rate, over etching features and TFT structure chose are investigated. The results show that Oxalic acid is best chose for IGZO film etching for side etching is about 0.1um , etching rate is 7.42 A/s which is easy to control and taper angle is acute. The traditional G-I-D type structure has been confirmed is not fit for the condition where the IGZO based TFT manufacture. G-D-I structure is tested and can be used in the TFT array manufacture.

Microelectrode Array Fabrication by Micro-WEDM

2009 ◽  
Vol 69-70 ◽  
pp. 79-82 ◽  
Author(s):  
Yu Kui Wang ◽  
Zhen Long Wang ◽  
Mao Sheng Li ◽  
Wei Liang Zeng ◽  
M.H. Weng
Keyword(s):  
Microelectrode Array ◽  
Electrode Array ◽  
Machining Process ◽  
Hole Array ◽  
Micro Edm ◽  
Peak Current ◽  
Micro Hole ◽  
Discharge Duration ◽  
Micro Wedm ◽  
Array Fabrication

In the paper, in order to overcome machining limits in throughput and precision because of positioning error and tool wear of a single tool electrode, a method for the microelectrode array fabrication by micro-WEDM is described and assessed. Characteristics of the microelectrode array fabrication by micro-WEDM, such as machining open voltage, pulse peak current, discharge duration and servo feed rate so on, are investigated through a series of experiments. A 10 10 squared electrode array is machined by micro-WEDM and the width of each squared electrode is about 40µm. The microelectrode array with good quality is obtained by applying decreased open voltage and peak current, increased discharge duration and optimized machining speed. Then micro hole-array is processed by applying obtained electrode array in micro-EDM method. The diameter of each squared hole in the array is about 50 µm due to appropriate control strategy that per micro pulse energy is decreased and periodic jump-down is applied during the machining process. Experiments have demonstrated that the combination process of microelectrode array fabricated by micro-WEDM and micro-hole array done by micro-EDM is a novel method of process which makes it more feasible and efficient to fabricate microelectrode array and high-density hole-array.

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