scholarly journals Polarization Parameters and Scaling Matter—How Processing Environment and Shape Factor Influence Electroactive Nanocomposite Characteristics

2020 ◽  
Vol 4 (3) ◽  
pp. 141
Author(s):  
S. Banerjee ◽  
K. A. Cook-Chennault
Keyword(s):  
Thick Film ◽  
Shape Factor ◽  
Piezoelectric Materials ◽  
Sol Gel ◽  
Dielectric Materials ◽  
Scaling Effects ◽  
Electromechanical Properties ◽  
Electrical Voltage ◽  
Film Bulk ◽  
Polarization Temperature

Polymeric-ceramic smart nanocomposite piezoelectric and dielectric materials are of interest due to their superior mechanical flexibility and ability to leverage characteristics of constituent materials. A great deal of work has centered on development of processes for manufacturing 0–3 continuity composite piezoelectric materials that vary in scale ranging from bulk, thick and thin film to nanostructured films. Less is known about how material scaling effects the effectiveness of polarization and electromechanical properties. This study elucidates how polarization parameters: contact versus corona, temperature and electrical voltage field influence the piezoelectric and dielectric properties of samples as a function of their shape factor, i.e., bulk versus thick film. Bulk and thick film samples were prepared via sol gel/cast-mold and sol gel/spin coat deposition, for fabrication of bulk and thick films, respectively. It was found that corona polarization was more effective for both bulk and thick film processes and that polarization temperature produced higher normalized changes in samples. Although higher electric field voltages could be achieved with thicker samples, film samples responded the most to coupled increases in temperature and electrical voltage than bulk samples.

Mechanical and electromechanical properties of PZT sol-gel thin films measured by nanoindentation

2001 ◽  
Vol 41 (1-4) ◽  
pp. 53-62 ◽  
Author(s):  
M. Algueró ◽  
A. J. Bushby ◽  
P. Hvizdoscar ◽  
M. J. Reece ◽  
R. W. Whatmore ◽  
...  
Keyword(s):  
Thin Films ◽  
Sol Gel ◽  
Electromechanical Properties

Sol–gel-derived thick-film conductometric biosensor for urea determination in serum

2000 ◽  
Vol 404 (2) ◽  
pp. 195-203 ◽  
Author(s):  
Won-Yong Lee ◽  
Seung-Ryeol Kim ◽  
Tae-Han Kim ◽  
Kang Shin Lee ◽  
Min-Chol Shin ◽  
...  
Keyword(s):  
Thick Film ◽  
Sol Gel ◽  
Urea Determination ◽  
Conductometric Biosensor

scholarly journals Formation of PZT Thick Film Single Elements Using EHDA Deposition

2009 ◽  
Vol 628-629 ◽  
pp. 405-410 ◽  
Author(s):  
Da Zhi Wang ◽  
R.A. Dorey
Keyword(s):  
Thick Film ◽  
Relative Permittivity ◽  
Ultrasonic Transducer ◽  
Sol Gel ◽  
Etching Process ◽  
Single Element ◽  
Electrohydrodynamic Atomization ◽  
Fringe Effect ◽  
Pzt Thick Film

In this paper, electrohydrodynamic atomization combined with a polymeric micromoulding technique was used to form PZT single element devices using a PZT sol-gel slurry without an etching process. The PZT single element device was initially designed to work as a piezoelectric ultrasonic transducer consisting of a circular or a square of various sizes, which was produced and used to evaluate the process. The resulting PZT device had a homogenous microstructure. It was observed that the relative permittivity of the circular and square single element devices was especially high at small size due to the fringe effect. The results show that the radius and width of the PZT single circular and square element devices with a thickness of 15µm should be bigger than 400µm in order to reduce the fringe effect.

scholarly journals Transferred PMN-PT Thick Film on Conductive Silver Epoxy

Materials ◽  
2018 ◽  
Vol 11 (9) ◽  
pp. 1621 ◽  
Author(s):  
Tao Zhang ◽  
Jun Ou-Yang ◽  
Xiaofei Yang ◽  
Benpeng Zhu
Keyword(s):  
Thick Film ◽  
Silicon Substrate ◽  
Chemical Method ◽  
Piezoelectric Properties ◽  
Sol Gel ◽  
Wet Chemical Method ◽  
Chemical Route ◽  
Wet Chemical ◽  
Silver Epoxy ◽  
Ferroelectric And Piezoelectric Properties

Approximately 25 μm Pb(Mg1/3Nb2/3)O3–PbTiO3 (PMN-PT) thick film was synthesized based on a sol-gel/composite route. The obtained PMN-PT thick film was successfully transferred from the Silicon substrate to the conductive silver epoxy using a novel wet chemical method. The mechanism of this damage free transfer was explored and analyzed. Compared with the film on Silicon substrate, the transferred one exhibited superior dielectric, ferroelectric and piezoelectric properties. These promising results indicate that transferred PMN-PT thick film possesses the capability for piezoelectric device application, especially for ultrasound transducer fabrication. Most importantly, this chemical route opens a new path for transfer of thick film.

The Variable Super-Capacitor with Nano-Diamond Film Electrode

2016 ◽  
Vol 852 ◽  
pp. 939-942 ◽  
Author(s):  
Xiu Xia Zhang ◽  
Jun Xia Wen ◽  
Rong Fan ◽  
Dao Jie Jiang ◽  
Xiu Li Lou ◽  
...  
Keyword(s):  
Melting Point ◽  
Thick Film ◽  
Glass Powder ◽  
Sol Gel ◽  
Film Electrode ◽  
Super Capacitor ◽  
Capacitor Plate ◽  
Good Thermal Stability ◽  
Low Dielectric ◽  
Insulation Thickness

nanoDiamond was mixed with ethylic cellulose and other Material to form to paste. A series of sol-gel nanoDiamond film with different proportions were designed test intentionally. nanoDiamond film was fabricated on Aluminum substrates using two-steps sintering process. The moving terminal of the variable super-capacitor was the shaft which throughout each of monolithic capacitor plate. The low melting point glass powder possesses giant permittivity, low dielectric loss, good thermal stability and dielectric constant in a wide temperature range which applied very broad prospects in microelectronics. The low melting point glass powder was mixed with carboxymethyl cellulose and deionized water to paste. The low melting point glass powder insulation thick-film was fixed on nanoDiamond film .In this paper, the insulation thick-film preparation: sintering at 578K to 588K and keeping 11.5 h to 12.5 h. A variable super-capacitor was designed based on nanoDiamond film electrode and low melting point glass powder insulation thick. Insulation thickness was prepared on uniform nanodiamond film to increase insulation super-capacitor between the two plates.

Research Development of Preparation Technology of BaTiO3 Nano-Power

2014 ◽  
Vol 809-810 ◽  
pp. 17-25
Author(s):  
Ming Chao Che ◽  
Jie Chen
Keyword(s):  
Barium Titanate ◽  
Piezoelectric Materials ◽  
Ceramic Materials ◽  
Dielectric Materials ◽  
Ferroelectric Materials ◽  
Preparation Technology ◽  
Developing Trend ◽  
Important Direction ◽  
Dielectric Ceramics ◽  
Synthesis Of Barium Titanate

Barium titanate (BaTiO3) used a strong dielectric materials, piezoelectric materials and ferroelectric materials, which is a kind of important electronic ceramic materials. With the miniaturization of electronic components, miniaturization, thin layer, nanosized barium titanate powder become an inevitable developing trend of barium titanate dielectric ceramics material. Some recent new progress for synthesis of barium titanate at home and abroad are summarized, the commentaries are made on the preparation process about advantages or disadvantages. Meanwhile, the analysis is made on the developing trend. Supercritical fluid extraction method have simple process, high extraction efficiency, no organic solvent residual, products of good quality, no environmental pollution, and so on. Research of BaTiO3nanopower may become an important direction of the field in the future.

Improving Stitch Bond on Hybrid Thick Film Substrate using Stand-Off Stitch Wire Bond Technique

2015 ◽  
Vol 2015 (1) ◽  
pp. 000425-000429 ◽  
Author(s):  
Richard C. Garcia
Keyword(s):  
Thick Film ◽  
Dielectric Materials ◽  
Glass Frit ◽  
Ceramic Substrate ◽  
Wire Bond ◽  
Design Requirements ◽  
The Wire ◽  
Film Substrate ◽  
Pull Tests ◽  
Associated Variables

Thick film technology is based on a paste containing glass frit that is screen printed and fused at high temperature onto various ceramic substrate materials. Softening or melting this glassy frit forms a cohesive layer, binding the conductors, resistors or dielectric materials to the ceramic. The dynamics of the printing process and inherent number of associated variables negatively impact the uniformity of the fired surface on a micro scale, which can lead to variation in the wire bonding process. Other processes associated with thick film substrate fabrication can cause problems as well. Laser trimming is used to adjust the value of printed resistors to meet design requirements. This ablation of printed resistors by high–powered pulse laser leaves a halo of debris and contamination on the ceramic substrate, which can cause wire bond lifting. In this paper, we will demonstrate a way to eliminate these problems using a bonding technique called Stand- Off Stitch bonding (SOS). This wire bond type is formed by first placing a ball bump at the second bond, or stitch, location on the thick film substrate, and then forming a normal wire that terminates on that bump. This places two ball bumps at each end of the wire, similar to a security bond. However, the ball bump is located under the stitch instead of on top. This SOS wire bond technique is compliant with the MIL-STD- 883 for a compound bond, where one bond is placed on top of another bond. With the gold bump placed on top of the gold thick film pad, the bump acts as a foundation for the stitch bond, providing a wider contact area and clean bond surface to secure a reliable stitch bond interconnect. With this change, an abrupt improvement to the resultant destruct wire pull tests can be achieved, promoting a robust, controlled process for wire bond interconnects.

FLEXOELECTRIC COMPOSITE — A NEW PROSPECT FOR LEAD-FREE PIEZOELECTRICS

2010 ◽  
Vol 03 (01) ◽  
pp. 79-81 ◽  
Author(s):  
BAOJIN CHU ◽  
WENYI ZHU ◽  
NAN LI ◽  
L. ERIC CROSS
Keyword(s):  
Piezoelectric Properties ◽  
Piezoelectric Materials ◽  
Physical Phenomenon ◽  
Mechanical Strain ◽  
Dielectric Materials ◽  
Electric Polarization ◽  
Lead Free ◽  
Piezoelectric Response ◽  
Bst Ceramics ◽  
Better Than

Flexoelectricity describes the physical phenomenon of the generation of electric polarization from mechanical strain gradient in solid insulators. In common dielectric materials, the flexoelectric coefficient is trivially small ~10-10 C/m. In Ba(Sr,Ti)O 3 (BST) ceramics, flexoelectric coefficient up to 10-4 C/m was observed. Such high coefficient makes it possible to design high piezoelectric response flexoelectric composites. In this letter, we will demonstrate that the newly designed flexoelectric composites could have piezoelectric properties better than conventional piezoelectric materials.

Electromechanical properties and defect chemistry of high-temperature piezoelectric materials

Ionics ◽  
2008 ◽  
Vol 15 (2) ◽  
pp. 157-161 ◽  
Author(s):  
Michal Schulz ◽  
Jan Sauerwald ◽  
Denny Richter ◽  
Holger Fritze
Keyword(s):  
High Temperature ◽  
Piezoelectric Materials ◽  
Defect Chemistry ◽  
Electromechanical Properties
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