scholarly journals Application of Polarization Coulomb Field Scattering to a Physics-Based Compact Model for AlGaN/GaN HFETs with I–V Characteristics

Electronics ◽  
2020 ◽  
Vol 9 (10) ◽  
pp. 1719
Author(s):  
Yongxiong Yang ◽  
Yuanjie Lv ◽  
Zhaojun Lin ◽  
Guangyuan Jiang ◽  
Yang Liu
Keyword(s):  
Electron Mobility ◽  
Coulomb Field ◽  
Compact Model ◽  
Gate Length ◽  
Gate Bias ◽  
Output Current ◽  
Polarization Coulomb Field Scattering ◽  
Current Voltage ◽  
Lower Ratio

A physics-based model for the output current–voltage (I–V) characteristics of AlGaN/GaN HFETs is developed based on AlGaAs/GaAs HFETs. It is demonstrated that Polarization Coulomb Field (PCF) scattering greatly influences channel electron mobility. With different gate biases, channel electron mobility is varied by PCF scattering. Furthermore, a more negative gate bias and a lower ratio of lg/lsd (gate length/source-drain space) of the device causes the PCF scattering to have stronger influence on channel electron mobility. This work is the first to apply PCF scattering to a physics-based model for AlGaN/GaN HFETs with I–V characteristics and the results indicate that PCF scattering is essential for a physics-based model to identify I–V characteristics of AlGaN/GaN HFETs.

Development of 8 mΩ-cm2, 1.8 kV 4H-SiC DMOSFETs

2006 ◽  
Vol 527-529 ◽  
pp. 1261-1264 ◽  
Author(s):  
Sei Hyung Ryu ◽  
Sumi Krishnaswami ◽  
Brett A. Hull ◽  
Bradley Heath ◽  
Mrinal K. Das ◽  
...  
Keyword(s):  
Threshold Voltage ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Gate Length ◽  
Gate Bias ◽  
Low Loss ◽  
Layer Resistance ◽  
Switching Characteristics ◽  
Mos Gate ◽  
Drift Layer

8 mΩ-cm2, 1.8 kV power DMOSFETs in 4H-SiC are presented in this paper. A 0.5 μm long MOS gate length was used to minimize the MOS channel resistance. The DMOSFETs were able to block 1.8 kV with the gate shorted to the source. At room temperature, a specific onresistance of 8 mΩ-cm2 was measured with a gate bias of 15 V. At 150 oC, the specific onresistance increased to 9.6 mΩ-cm2. The increase in drift layer resistance due to a decrease in bulk electron mobility was partly cancelled out by the negative shift in MOS threshold voltage at elevated temperatures. The device demonstrated extremely fast, low loss switching characteristics. A significant improvement in converter efficiency was observed when the 4H-SiC DMOSFET was used instead of an 800 V silicon superjunction MOSFET in a simple boost converter configuration.

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