scholarly journals Switching Characteristics and Mechanism Using Al2O3 Interfacial Layer in Al/Cu/GdOx/Al2O3/TiN Memristor

Electronics ◽  
2020 ◽  
Vol 9 (9) ◽  
pp. 1466
Author(s):  
Chiao-Fan Chiu ◽  
Sreekanth Ginnaram ◽  
Asim Senapati ◽  
Yi-Pin Chen ◽  
Siddheswar Maikap
Keyword(s):  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Interfacial Layer ◽  
Stable State ◽  
Schematic Model ◽  
Bipolar Resistive Switching ◽  
Al2o3 Layer ◽  
X Ray ◽  
Resistance State ◽  
Switching Characteristics

Resistive switching characteristics by using the Al2O3 interfacial layer in an Al/Cu/GdOx/Al2O3/TiN memristor have been enhanced as compared to the Al/Cu/GdOx/TiN structure owing to the insertion of Al2O3 layer for the first time. Polycrystalline grain, chemical composition, and surface roughness of defective GdOx film have been investigated by transmission electron microscope (TEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and atomic force microscopy (AFM). For bipolar resistive switching (BRS) characteristics, the conduction mechanism of high resistance state (HRS) is a space-charge limited current for the Al/Cu/GdOx/TiN device while the Al/Cu/GdOx/Al2O3/TiN device shows Schottky emission. However, both devices show Ohmic at a low resistance state (LRS). After the device has been SET, the Cu filament evidences by both TEM and elemental mapping. Oxygen-rich at the Cu/GdOx interface and Al2O3 layer are confirmed by energy dispersive X-ray spectroscopy (EDS) line profile. The Al/Cu/GdOx/Al2O3/TiN memristor has lower RESET current, higher speed operation of 100 ns, long read pulse endurance of >109 cycles, good data retention, and the memristor with a large resistance ratio of >105 is operated at a low current of 1.5 µA. The complementary resistive switching (CRS) characteristics of the Al/Cu/GdOx/Al2O3/TiN memristor show also a low current operation as compared to the Al/Cu/GdOx/TiN device (300 µA vs. 3.1 mA). The transport mechanism is the Cu ion migration and it shows Ohmic at low field and hopping at high field regions. A larger hopping distance of 1.82 nm at the Cu/GdOx interface is obtained as compared to a hopping distance of 1.14 nm in the Al2O3 layer owing to a larger Cu filament length at the Cu/GdOx interface than the Al2O3 layer. Similarly, the CRS mechanism is explained by using the schematic model. The CRS characteristics show a stable state with long endurance of >1000 cycles at a pulse width of 1 µs owing to the insertion of Al2O3 interfacial layer in the Al/Cu/GdOx/Al2O3/TiN structure.

scholarly journals Resistive Switching Characteristics of Li-Doped ZnO Thin Films Based on Magnetron Sputtering

Materials ◽  
2019 ◽  
Vol 12 (8) ◽  
pp. 1282 ◽  
Author(s):  
Zhao ◽  
Li ◽  
Ai ◽  
Wen
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Lattice Structure ◽  
Zno Thin Films ◽  
Bipolar Resistive Switching ◽  
X Ray ◽  
Doped Zno ◽  
Switching Characteristics

A kind of devices Pt/Ag/ZnO:Li/Pt/Ti with high resistive switching behaviors were prepared on a SiO2/Si substrate by using magnetron sputtering method and mask technology, composed of a bottom electrode (BE) of Pt/Ti, a resistive switching layer of ZnO:Li thin film and a top electrode (TE) of Pt/Ag. To determine the crystal lattice structure and the Li-doped concentration in the resulted ZnO thin films, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) tests were carried out. Resistive switching behaviors of the devices with different thicknesses of Li-doped ZnO thin films were studied at different set and reset voltages based on analog and digital resistive switching characteristics. At room temperature, the fabricated devices represent stable bipolar resistive switching behaviors with a low set voltage, a high switching current ratio and a long retention up to 104 s. In addition, the device can sustain an excellent endurance more than 103 cycles at an applied pulse voltage. The mechanism on how the thicknesses of the Li-doped ZnO thin films affect the resistive switching behaviors was investigated by installing conduction mechanism models. This study provides a new strategy for fabricating the resistive random access memory (ReRAM) device used in practice.

Two modes of bipolar resistive switching characteristics in asymmetric TaOx-based ReRAM cells

MRS Advances ◽  
2019 ◽  
Vol 4 (48) ◽  
pp. 2601-2607
Author(s):  
Toshiki Miyatani ◽  
Yusuke Nishi ◽  
Tsunenobu Kimoto
Keyword(s):  
Resistive Switching ◽  
High Resistance State ◽  
Opposite Polarity ◽  
Electrical Characteristics ◽  
Forming Process ◽  
Initial State ◽  
Bipolar Resistive Switching ◽  
Change Mechanism ◽  
Resistance State ◽  
Switching Characteristics

ABSTRACTImpacts of a forming process on bipolar resistive switching (RS) characteristics in Pt/TaOx/Ta2O5/Pt cells were investigated. We found that the forming resulted in a transition from an initial state to a particular high resistance state (HRS) in most of the Pt/TaOx/Ta2O5/Pt cells. Evaluation of electrical characteristics after the transition to the particular HRS revealed that two modes of bipolar RS with the conventional polarity based on valence change mechanism and with the opposite polarity could be selectively obtained by adjusting the magnitude of the applied voltage. Moreover, the cell resistance decreased gradually during set processes in the bipolar RS with the opposite polarity.

WOx resistive memory elements for scaled Flash memories

2011 ◽  
Vol 1337 ◽  
Author(s):  
S. Gorji Ghalamestani ◽  
L. Goux ◽  
D.E. Díaz-Droguett ◽  
D. Wouters ◽  
J. G. Lisoni
Keyword(s):  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Time Windows ◽  
Electrical Measurement ◽  
Thin Layers ◽  
Switching Behavior ◽  
Elastic Recoil ◽  
X Ray ◽  
Bipolar Switching ◽  
Switching Characteristics

ABSTRACTWe investigated the resistive switching behavior of WOx films. WOx was obtained from the thermal oxidation of W thin layers. The parameters under investigation were the influence of the temperature (450-500 °C) and time (30-220 s) used to obtain the WOx on the resistive switching characteristics of Si\W\WOx\Metal_electrode ReRAM cells. The metal top electrodes (TE) tested were Pt, Ni, Cu and Au. The elemental composition and microstructure of the samples were characterized by means of elastic recoil detection analysis (ERD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), X-ray diffraction (XRD) and X-ray reflectivity (XRR).Electrical measurement of the WOx-based memory elements revealed bipolar and unipolar switching and this depended upon the oxidation conditions and TE selected. Indeed, switching events were observed in WOx samples obtained either at 450 °C or 500 °C in time windows of 180-200 s and 30-60 s, respectively. Pt and Au TE promoted bipolar switching while unipolar behavior was observed with Ni TE only; no switching events were observed with Cu TE. Good switching characteristics seems not related to the overall thickness, crystallinity and composition of the oxide, but on the W6+/W5+ ratio present on the WOx surface, surface in contact with the TE material. Interestingly, W6+/W5+ ratio can be tuned through the oxidation conditions, showing a path for optimizing the properties of the WOx-based ReRAM cells.

scholarly journals Effects of Sm2O3 and V2O5 Film Stacking on Switching Behaviors of Resistive Random Access Memories

Crystals ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 318
Author(s):  
Lin ◽  
Wu ◽  
Chen
Keyword(s):  
Resistive Switching ◽  
Random Access ◽  
Single Layer ◽  
High Resistance State ◽  
Switching Behavior ◽  
Bipolar Resistive Switching ◽  
Compliance Behavior ◽  
Order Of Magnitude ◽  
Resistance State ◽  
Switching Characteristics

: In this work, the resistive switching characteristics of resistive random access memories (RRAMs) containing Sm2O3 and V2O5 films were investigated. All the RRAM structures made in this work showed stable resistive switching behavior. The High-Resistance State and Low-Resistance State of Resistive memory (RHRS/RLRS) ratio of the RRAM device containing a V2O5/Sm2O3 bilayer is one order of magnitude higher than that of the devices containing a single layer of V2O5 or Sm2O3. We also found that the stacking sequence of the Sm2O3 and V2O5 films in the bilayer structure can affect the switching features of the RRAM, causing them to exhibit both bipolar resistive switching (BRS) behavior and self-compliance behavior. The current conduction mechanisms of RRAM devices with different film structures were also discussed.

scholarly journals Resistive Switching Characteristics of HfO2 Thin Films on Mica Substrates Prepared by Sol-Gel Process

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1124 ◽  
Author(s):  
Chao-Feng Liu ◽  
Xin-Gui Tang ◽  
Lun-Quan Wang ◽  
Hui Tang ◽  
Yan-Ping Jiang ◽  
...  
Keyword(s):  
Thin Films ◽  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Sol Gel ◽  
Random Access ◽  
High Resistance State ◽  
X Ray ◽  
Low Resistance ◽  
Sol Gel Process ◽  
Resistance State

The resistive switching (RS) characteristics of flexible films deposited on mica substrates have rarely been reported upon, especially flexible HfO2 films. A novel flexible Au/HfO2/Pt/mica resistive random access memory device was prepared by a sol-gel process, and a Au/HfO2/Pt/Ti/SiO2/Si (100) device was also prepared for comparison. The HfO2 thin films were grown into the monoclinic phase by the proper annealing process at 700 °C, demonstrated by grazing-incidence X-ray diffraction patterns. The ratio of high/low resistance (off/on) reached 1000 and 50 for the two devices, respectively, being relatively stable for the former but not for the latter. The great difference in ratios for the two devices may have been caused by different concentrations of the oxygen defect obtained by the X-ray photoelectron spectroscopy spectra indicating composition and chemical state of the HfO2 thin films. The conduction mechanism was dominated by Ohm’s law in the low resistance state, while in high resistance state, Ohmic conduction, space charge limited conduction (SCLC), and trap-filled SCLC conducted together.

scholarly journals Chemical Nature of Electrode and the Switching Response of RF-Sputtered NbOx Films

Nanomaterials ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 2164
Author(s):  
Jamal Aziz ◽  
Honggyun Kim ◽  
Shania Rehman ◽  
Muhammad Farooq Khan ◽  
Deok-kee Kim
Keyword(s):  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Dominant Role ◽  
Interface Layer ◽  
Spectroscopy Analysis ◽  
X Ray ◽  
Inert Electrode ◽  
Switching Characteristics ◽  
Different Characteristics

In this study, the dominant role of the top electrode is presented for Nb2O5-based devices to demonstrate either the resistive switching or threshold characteristics. These Nb2O5-based devices may exhibit different characteristics depending on the selection of electrode. The use of the inert electrode (Au) initiates resistive switching characteristics in the Au/Nb2O5/Pt device. Alternatively, threshold characteristics are induced by using reactive electrodes (W and Nb). The X-ray photoelectron spectroscopy analysis confirms the presence of oxide layers of WOy and NbOx at interfaces for W and Nb as top electrodes. However, no interface layer between the top electrode and active layer is detected in X-ray photoelectron spectroscopy for Au as the top electrode. Moreover, the dominant phase is Nb2O5 for Au and NbO2 for W and Nb. The threshold characteristics are attributed to the reduction of Nb2O5 phase to NbO2 due to the interfacial oxide layer formation between the reactive top electrode and Nb2O5. Additionally, reliability tests for both resistive switching and threshold characteristics are also performed to confirm switching stabilities.

scholarly journals Irregular Resistive Switching Behaviors of Al2O3-Based Resistor with Cu Electrode

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 653
Author(s):  
Hojeong Ryu ◽  
Sungjun Kim
Keyword(s):  
Resistive Switching ◽  
Photoelectron Spectroscopy ◽  
Complementary Metal Oxide Semiconductor ◽  
High Resistance State ◽  
Oxide Semiconductor ◽  
Bipolar Resistive Switching ◽  
Thin Film Layer ◽  
Film Layer ◽  
Resistance State ◽  
Al2o3 Thin Film

In this work, we examined the irregular resistive switching behaviors of a complementary metal–oxide–semiconductor (CMOS)-compatible Cu/Al2O3/Si resistor device. X-ray photoelectron spectroscopy (XPS) analysis confirmed the chemical and material compositions of a Al2O3 thin film layer and Si substrate. Bipolar resistive switching occurred in a more stable manner than the unipolar resistive switching in the device did. Five cells were verified over 50 endurance cycles in terms of bipolar resistive switching, and a good retention was confirmed for 10,000 s in the high-resistance state (HRS) and the low-resistance state (LRS). Both high reset current (~10 mA) and low reset current (<100 μA) coexisted in the bipolar resistive switching. We investigated nonideal resistive switching behaviors such as negative-set and current overshoot, which could lead to resistive switching failure.

Resistive switching of multiferroic BiCoO3 nanoflowers

2015 ◽  
Vol 08 (01) ◽  
pp. 1550001 ◽  
Author(s):  
Bai Sun ◽  
Qiling Li ◽  
Yonghong Liu ◽  
Peng Chen
Keyword(s):  
Resistive Switching ◽  
High Resistance ◽  
Hydrothermal Process ◽  
High Resistance State ◽  
Bipolar Resistive Switching ◽  
Low Resistance ◽  
Current Voltage ◽  
Extreme Change ◽  
Resistance State ◽  
Switching Characteristics

Multiferroic BiCoO 3 nanoflowers were synthesized by a hydrothermal process. The BiCoO 3 nanoflowers show superior bipolar resistive switching characteristics. The typical current–voltage (I–V) characteristics of the Ag / BiCoO 3/ Ag structures exhibit an extreme change in resistance between high resistance state (HRS) or "OFF" state and low resistance state (LRS) or "ON" state with ON/OFF ratio ~ 105.

Nitrogen (N2) Implantation to Suppress Growth of Interfacial Oxide in Mocvd Bst and Sputtered Bst Films

1999 ◽  
Vol 567 ◽  
Author(s):  
Renee Nieh ◽  
Wen-Jie Qi ◽  
Yongjoo Jeon ◽  
Byoung Hun Lee ◽  
Aaron Lucas ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Interfacial Layer ◽  
Gate Dielectric ◽  
Nitrogen Concentration ◽  
Chemical Vapor ◽  
Future Generation ◽  
Oxide Thickness ◽  
Layer Growth ◽  
X Ray ◽  
Bst Films

ABSTRACTBa0.5Sr0.5TiO3 (BST) is one of the high-k candidates for replacing SiO2 as the gate dielectric in future generation devices. The biggest obstacle to scaling the equivalent oxide thickness (EOT) of BST is an interfacial layer, SixOy, which forms between BST and Si. Nitrogen (N2) implantation into the Si substrate has been proposed to reduce the growth of this interfacial layer. In this study, capacitors (Pt/BST/Si) were fabricated by depositing thin BST films (50Å) onto N2 implanted Si in order to evaluate the effects of implant dose and annealing conditions on EOT. It was found that N2 implantation reduced the EOT of RF magnetron sputtered and Metal Oxide Chemical Vapor Deposition (MOCVD) BST films by ∼20% and ∼33%, respectively. For sputtered BST, an implant dose of 1×1014cm−;2 provided sufficient nitrogen concentration without residual implant damage after annealing. X-ray photoelectron spectroscopy data confirmed that the reduction in EOT is due to a reduction in the interfacial layer growth. X-ray diffraction spectra revealed typical polycrystalline structure with (111) and (200) preferential orientations for both films. Leakage for these 50Å BST films is on the order of 10−8 to 10−5 A/cm2—lower than oxynitrides with comparable EOTs.

scholarly journals Gradually Modified Conductance in the Self-Compliance Region of an Atomic-Layer-Deposited Pt/TiO2/HfAlOx/TiN RRAM Device

Metals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1199
Author(s):  
Hojeong Ryu ◽  
Sungjun Kim
Keyword(s):  
Photoelectron Spectroscopy ◽  
Depth Profiling ◽  
Atomic Layer ◽  
High Resistance State ◽  
Long Term Potentiation ◽  
Memory Device ◽  
Bipolar Resistive Switching ◽  
Term Potentiation ◽  
Resistance State ◽  
Neuromorphic System

This study presents conductance modulation in a Pt/TiO2/HfAlOx/TiN resistive memory device in the compliance region for neuromorphic system applications. First, the chemical and material characteristics of the atomic-layer-deposited films were verified by X-ray photoelectron spectroscopy depth profiling. The low-resistance state was effectively controlled by the compliance current, and the high-resistance state was adjusted by the reset stop voltage. Stable endurance and retention in bipolar resistive switching were achieved. When a compliance current of 1 mA was imposed, only gradual switching was observed in the reset process. Self-compliance was used after an abrupt set transition to achieve a gradual set process. Finally, 10 cycles of long-term potentiation and depression were obtained in the compliance current region for neuromorphic system applications.

Sign in / Sign up

Export Citation Format

Share Document