scholarly journals A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over

Electronics ◽  
2019 ◽  
Vol 8 (9) ◽  
pp. 1041 ◽  
Author(s):  
Jung-Han Lee
Keyword(s):  
Electromagnetic Coupling ◽  
Signal Integrity ◽  
Ground Plane ◽  
Magnetic Coupling ◽  
Capacitive Coupling ◽  
Signal Quality ◽  
Crossing Over ◽  
Transmission Line Model ◽  
Working Mechanism ◽  
Lc Equivalent Circuit

In this paper, a novel meander split power/ground plane is proposed for reducing crosstalk between parallel lines crossing over it. The working mechanism of the meander split scheme is investigated by simulations and measurements. The LC equivalent circuit and transmission line model are developed for modeling interactions between the meander split and the signal lines. The proposed meander structure enhances electromagnetic coupling between split planes. The capacitive coupling across the split ensures signal integrity and magnetic coupling between adjacent finger shaped structures suppresses lateral wave propagation along the split gap, which in turn helps suppress the crosstalk. The effectiveness of the meander split remains valid over very wide frequency ranges (up to 9 GHz). Experimental results show that the proposed structure improves the signal quality and reduces the near/far end crosstalk over 30 dB and 50% in the frequency domain and time domain, respectively.

Predicting Electromagnetic Interference to a Terminated Wire Using Characteristic Mode Analysis

2021 ◽  
Vol 35 (11) ◽  
pp. 1318-1319
Author(s):  
Mohamed Hamdalla ◽  
Anthony Caruso ◽  
Ahmed Hassan
Keyword(s):  
Electromagnetic Interference ◽  
Incident Angle ◽  
Electromagnetic Coupling ◽  
Ground Plane ◽  
Mode Analysis ◽  
Characteristic Mode ◽  
Work Characteristic

Electromagnetic coupling to realistic wire configurations exhibit large variations with respect to the frequency, incident angle, and polarization of the interfering signal. In this work, Characteristic Mode Analysis (CMA) is used to calculate the fundamental modes of a terminated wire above an infinite ground plane. Using the properties of the modes, the coupled currents to the wire’s loads are predicted for different incident excitations. Using this simple but practical wire configuration, we show the versatility of CMA in practical electromagnetic interference and coupling applications.

Dual Band Notched EBG Structure based UWB MIMO/Diversity Antenna with Reduced Wide Band Electromagnetic Coupling

Frequenz ◽  
2017 ◽  
Vol 71 (11-12) ◽  
Author(s):  
Naveen Jaglan ◽  
Binod Kumar Kanaujia ◽  
Samir Dev Gupta ◽  
Shweta Srivastava
Keyword(s):  
Band Gap ◽  
Mutual Coupling ◽  
Electromagnetic Coupling ◽  
Impedance Matching ◽  
Ground Plane ◽  
Wide Band ◽  
Dual Band ◽  
Ultra Wide Band ◽  
Electromagnetic Band Gap ◽  
Diversity Antenna

AbstractA dual band-notched MIMO/Diversity antenna is proposed in this paper. The proposed antenna ensures notches in WiMAX band (3.3–3.6 GHz) besides WLAN band (5–6 GHz). Mushroom Electromagnetic Band Gap (EBG) arrangements are employed for discarding interfering frequencies. The procedure followed to attain notches is antenna shape independent with established formulas. The electromagnetic coupling among two narrowly set apart Ultra-Wide Band (UWB) monopoles is reduced by means of decoupling bands and slotted ground plane. Monopoles are 90° angularly parted with steps on the radiator. This aids to diminish mutual coupling and also adds in the direction of impedance matching by long current route. S

scholarly journals Substrate Effect Evaluation by the Analysis of Intrinsic Capacitances in SOI UTBB Transistors

2020 ◽  
Vol 15 (1) ◽  
pp. 1-6
Author(s):  
Fernando José Costa ◽  
Renan Trevisoli Doria ◽  
Rodrigo Trevisoli Doria
Keyword(s):  
Experimental Data ◽  
Ground Plane ◽  
Capacitive Coupling ◽  
Thin Body ◽  
Substrate Effect ◽  
Gate Bias ◽  
Effect Evaluation ◽  
Back Gate ◽  
Buried Oxide

The main goal of this paper is to present the behavior of the substrate effect in Ultra-Thin Body and Buried Oxide (UTBB) SOI MOSFETs with respect to the back gate bias (VSUB) through DC and AC simulations validated to experimental data. Different ground plane (GP) arrangements have been considered in order to enhance the analysis. It has been shown that the substrate effect is strongly influenced by the reduction of the back gate bias and, that the capacitive coupling of the structure presents a different behavior with respect of each kind of GP configuration as the back gate bias is varied. Finally, it has been shown that the GP below the source and drain regions contributes significantly to the overall capacitive coupling of the transistors.

scholarly journals Metamaterial Inspired Gain Enhanced Elliptical Curved CPW fed Multiband Antenna for Medical and Wireless Communication Applications

2019 ◽  
Vol 12 (2) ◽  
pp. 729-737
Author(s):  
M. Purna Kishore ◽  
B. T. P. Madhav ◽  
S. S. Mohan Reddy
Keyword(s):  
Satellite Communication ◽  
Electromagnetic Coupling ◽  
Coplanar Waveguide ◽  
Ground Plane ◽  
Medical Application ◽  
Satellite System ◽  
Ieee 802.11A ◽  
X Band ◽  
Efficiency Parameter ◽  
Peak Gain

This article presents a novel elliptical curved coplanar waveguide fed antenna with defected ground. Electromagnetic coupling between splitring resonator (SRR) on other side to the substrate to CPW feeding line on the top side resulting the frequency notches in the wideband. The SRR shaped etched portion in the ground plane not only miniaturizing the antenna, but also providing good bandwidth in the operating bands. Antenna providing multiband characteristics for PCS, Bluetooth, LTE, ISM (Medical Application Band) and Wi-Fi communication (2-3.6 GHz), WLAN IEEE 802.11a/h/j/n (4.5-5.825 GHz), satellite system X-band downlink (7.5-9 GHz) and satellite communication applications at (12-16 GHz) & (17.5-18.5 GHz) respectively. This antenna offering quad band notching with penta band operation from 2-20 GHz. The size of the antenna is 40X44X1.6 mm with peak gain value of 7.18 dB with average efficiency parameter more than 68%. The manufactured antenna prototype is tested for validation and the obtained measurement matching with respect to the optimized simulation result.

scholarly journals A High Gain Microstrip Patch Array for 5 GHz WLAN Applications

2018 ◽  
Vol 7 (3) ◽  
pp. 93-98 ◽  
Author(s):  
B. W. Ngobese ◽  
P. Kumar
Keyword(s):  
Ground Plane ◽  
Local Area ◽  
Dielectric Substrate ◽  
High Gain ◽  
Transmission Line Model ◽  
Microstrip Patch ◽  
Model Equations ◽  
5 Ghz ◽  
Standard States ◽  
Good Agreement

This paper presents the design, fabrication and measurement of a high gain 4-elements linear patch array, which uses the corporate feed technique with inset for excitation resonating at 5.216 𝐺𝐻z.  is used as a dielectric substrate for the proposed array structure. The designed array is simulated and optimized by using CST microwave studio software. The element of the array is designed using the transmission-line model equations. The ground plane is made defective by incorporating slots and the reflective ground is utilized to enhance the gain of the array. The simulated and measured results for various parameters of the array are presented. The comparison between simulated and measured results show good agreement with little deviation. The optimized dimensions of the proposed design provides a maximum gain of 9.019 dB and a maximum directivity of 12.81 dBi. The antenna has been designed for the range  which is one of the ranges for  band for wireless local area networks (WLAN) applications as the  standard states.

scholarly journals Effect of Substrate Bias and Temperature Variation in the Capacitive Coupling of SOI UTBB MOSFETs

2021 ◽  
Vol 16 (2) ◽  
pp. 1-7
Author(s):  
Everton Matheus Da Silva ◽  
Renan Trevisoli Doria ◽  
Rodrigo Trevisoli Doria
Keyword(s):  
Ground Plane ◽  
Silicon Layer ◽  
The Body ◽  
Capacitive Coupling ◽  
Thin Body ◽  
Substrate Bias ◽  
Temperature Influence ◽  
Different Types ◽  
P Type ◽  
The Impact

In this work, the electrical features related to the capacitive coupling and temperature influence of the Ultra-Thin Body and Buried Oxide SOI MOSFET (UTBB) transistors are explored through numerical simulations. The impact of the substrate bias is observed for a set of values ranging from -3 V to 2 V for a temperature range between 100 K and 400 K. Also, structures with different types of ground plane (GP-P and GPN) and without GPhave been evaluated. This approach analyzes the capacitive coupling through the body factor and shows that the negative biasing for all GP types significantly improves the structure coupling and that the device with P-type ground plane has the lowest value of body factor for all the evaluated conditions. The dependence of the body factor on the temperature has shown to be negligible for longer devices. However, for devices shorter than 50 nm, the position of the maximum electrons concentration inside the silicon layer may affect the capacitive coupling.

scholarly journals Optimization of Radio Interference Levels for 500 and 600 kV Bipolar HVDC Transmission Lines

Energies ◽  
2019 ◽  
Vol 12 (16) ◽  
pp. 3187 ◽  
Author(s):  
Carlos Tejada-Martinez ◽  
Fermin P. Espino-Cortes ◽  
Suat Ilhan ◽  
Aydogan Ozdemir
Keyword(s):  
Transmission Lines ◽  
Skin Effect ◽  
Ground Plane ◽  
Radio Interference ◽  
Transmission Line Model ◽  
Hvdc Transmission ◽  
High Voltage Direct Current ◽  
Hvdc Transmission Lines ◽  
Voltage Frequency ◽  
Optimal Values

In this work, a method to compute the radio interference (RI) lateral profiles generated by corona discharge in high voltage direct current (HVDC) transmission lines is presented. The method is based on a transmission line model that considers the skin effect, through the concept of complex penetration depth, in the conductors and in the ground plane. The attenuation constants are determined from the line parameters and the bipolar system is decoupled by using modal decomposition theory. As application cases, ±500 and ±600 kV bipolar transmission lines were analyzed. Afterwards, parametric sweeps of five variables that affect the RI levels are presented. Both the RI and the maximum electric field were calculated as a function of sub-conductor radius, bundle spacing, and the number of sub-conductors in the bundle. Additionally, the RI levels were also calculated as a function of the soil resistivity, and the RIV (radio interference voltage) frequency. Following this, vector optimization was applied to minimize the RI levels produced by the HVDC lines and differences between the designs with nominal and optimal values are discussed.

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