scholarly journals Effective Strategies for Project-Based Learning of Practical Electronics

Electronics ◽  
2021 ◽  
Vol 10 (18) ◽  
pp. 2245
Author(s):  
Faisal Mohd-Yasin
Keyword(s):  
Undergraduate Students ◽  
Printed Circuit Board ◽  
Evaluation Criteria ◽  
Project Based Learning ◽  
Circuit Board ◽  
Learning And Teaching ◽  
Effective Strategies ◽  
The Past ◽  
Component Selection ◽  
Learning Institutions

Some universities offer specific project-based learning (PBL) courses in the third year of their electronic engineering degree to equip undergraduate students before they embark on industrial attachment and/or a capstone project. This course exposes those students to full design cycles at circuit and system levels. Students also pick up practical skills, such as component selection, circuit troubleshooting, printed circuit board design, and market analysis. This perspective offers the author’s reflections on effective learning and teaching strategies for this purpose, after running such a course for the past 10 years at Griffith University. In earlier years, students’ have complained about lack of direction and overloading, which are common issues being reported in PBL courses. In response, we have implemented scaffolding and balanced evaluation criteria for assessment, providing formative feedback, and we have designed integrated assessment items. As a result, average marks for the cohort and the percentage of students that receive the grade of high distinction have increased in the past five years. These strategies might be of help at other learning institutions that offer similar courses.

Blended induction program for electronic engineering freshmen

2018 ◽  
Vol 55 (4) ◽  
pp. 354-366
Author(s):  
Indra Dayawansa ◽  
Chamith Wijenayake ◽  
Chamira Edussooriya ◽  
Thusitha Samarasekara ◽  
Chamanthi Karunasekara ◽  
...  
Keyword(s):  
Undergraduate Students ◽  
Printed Circuit Board ◽  
Learning Experience ◽  
University Education ◽  
Circuit Board ◽  
Smooth Transition ◽  
Qualitative Assessment ◽  
Learning And Teaching ◽  
Induction Program ◽  
Transition From High School

This paper presents learning and teaching experiences gathered from an induction program conducted at the Department of Electronic and Telecommunication Engineering, University of Moratuwa, Sri Lanka for newly enrolled undergraduate students. The induction program, named as the pre-academic term, was an experimental effort to explore the applicability of blended leaning concepts to enhance the learning experience of Engineering freshmen, while enabling smooth transition from high school to university education. In addition to standard lectures, an integral part of the program was in-class demonstrations, where electronic circuits were assembled from scratch on a printed circuit board and demonstrated using a projected camera during the lectures. Organization, learning objectives, brief description of the example projects are presented along with a summary of formal student feedback. More than 85% of the freshmen indicated that the induction program helped them to smoothly begin the university education. A qualitative assessment in the laboratory work indicated that about 98% of the students successfully completed the assigned hands-on activities.

scholarly journals Design of Aerodynamic Ball Levitation Laboratory Plant

Processes ◽  
2021 ◽  
Vol 9 (11) ◽  
pp. 1950
Author(s):  
Tomáš Tkáčik ◽  
Milan Tkáčik ◽  
Slávka Jadlovská ◽  
Anna Jadlovská
Keyword(s):  
Mathematical Model ◽  
Printed Circuit Board ◽  
Least Squares Method ◽  
Selection Process ◽  
Nonlinear Least Squares ◽  
Circuit Board ◽  
Component Selection ◽  
Physical Plant ◽  
Nonlinear Least Squares Method ◽  
Physical Construction

This paper presents the development of a new Aerodynamic Ball Levitation Laboratory Plant at the Center of Modern Control Techniques and Industrial Informatics (CMCT&II). The entire design process of the plant is described, including the component selection process, the physical construction of the plant, the design of a printed circuit board (PCB) powered by a microcontroller, and the implementation of its firmware. A parametric mathematical model of the laboratory plant is created, whose parameters are then estimated using a nonlinear least-squares method based on acquired experimental data. The Kalman filter and the optimal state-space feedback control are designed based on the obtained mathematical model. The designed controller is then validated using the physical plant.

scholarly journals Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach

1984 ◽  
Vol 11 (2) ◽  
pp. 165-172
Author(s):  
A. Kerkhoff
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
The Past ◽  
Press Fit ◽  
Back Panel ◽  
Design Options ◽  
The Relationship

Involving, as it does, DIN and Reversed DIN board connectors, compliant press-fit pins, round cable, flat cable, and coaxial-connectors, the Berg Backpanel System has, over the past two years, gained a recognized position in the European and US markets.Development and expansion of the system in depth, and in breadth, is still ongoing. One of the major subjects is press-fit: preloaded press-fit connectors and studies focused on the relationship between printed circuit board properties vs. compliant press-fit pin design.This paper presents results of these developments and discusses design options.

The bifurcation of advanced packaging

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000834-000855
Author(s):  
John Park
Keyword(s):  
Printed Circuit Board ◽  
Mechanical Design ◽  
Design Tool ◽  
Circuit Board ◽  
Design Tools ◽  
Wafer Level ◽  
3D Ic ◽  
Package Design ◽  
The Past ◽  
Advanced Packaging

Following a similar trend from the 1990's, IC package design is experiencing a sea change. As a refresher, the 1990's is when the ball grid array (BGA) came along, introducing a whole new set of design tool requirements. The mechanical design tools used for the previous generation of lead frame styled packages were no longer capable of supporting the new design requirements of the BGA. In short, the BGA introduced multi-layer routable organic and ceramic substrates and new possibilities for stacking (and embedding) multi-die, requiring designers to abandon their mechanical design tools and look at new solutions for doing package design. On top of that, IO's were switching faster than ever, requiring engineers to look at new ways of electrically characterizing these designs. As a result, a couple of EDA companies stepped up and adapted their printed circuit board (PCB) layout and analysis tools for that generation of BGA-based advanced packaging. Problem (more or less) solved! Fast forward to today and we see a very similar trend. Now being introduced at a rapid pace, are new advanced IC packaging solutions that have a lot more silicon content, wafer stacking and, in some cases, chips being packaged directly at the wafer-level at traditional IC foundries, skipping the traditional OSAT model of the past. Make no mistake, this is a significant change to the status quo of BGA package design tools of the past. The PCB-like flows that were established for BGA design are likely not the path forward for technologies like, 2.5D/3D IC and fan-out wafer-level packaging (FOWLP). Instead, in all likelihood IC design tools and flows will need to be slightly adapted to support the next generation of package designs. Let's start with foundry-based FOWLP. In this case, induvial dice are placed on a chip-carrier with additional spacing between them. Molding is poured in the empty space and then an array of bumps (UBM) and the connectivity (RDL) are added. In foundry-based flows, these UBM and RDL layers require IC-styled routing/metal fill and mask generation from the layout tool. In addition, these masks must be verified with traditional IC DRC/LVS tools. It's clear that some kind of hybrid advanced packaging flow using some traditional IC tools in the flow is required to support this type of design. And in fact, if you look at the largest semiconductor foundries reference flow tools, you will find this to be true. This presentation further examines the design tool/flow requirement for FOWLP, 2.5D/3D IC and future multi-die packaging technologies.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

A Study on Learners’ Readiness and Perceptions of the Implementation of Blended Learning in UiTM Kedah

2019 ◽  
Vol 3 (2) ◽  
pp. 41
Author(s):  
Robekhah Harun ◽  
Zetty Harisha Harun ◽  
Laura Christ Dass
Keyword(s):  
Blended Learning ◽  
Successful Implementation ◽  
Learning Approaches ◽  
Learner Readiness ◽  
Learning And Teaching ◽  
Face To Face ◽  
Online Assessments ◽  
Research Findings ◽  
On Line ◽  
Learning Institutions

The increase in student enrolment and the need  to cater to students of diverse backgrounds have led to the adoption of blended learning in many higher learning institutions. Blended learning, which allows both face to face interaction and on-line delivery, has been adopted into many curricula. One such institution is University Technology MARA which is slowly introducing features of blended learning in its course syllabus beginning with practice to online assessments. However, to ensure successful implementation of blended learning as part of the curricula, there are several aspects for consideration such as learner and teacher readiness for blended learning. This paper examines issues regarding the use of blended learning as a delivery method at UiTM Kedah . The discussion in this paper focuses on learner’ readiness and perceptions of the blended learning environment. The data collected for this study are responses from learners to a questionnaire survey. The research findings form the basis for recommendations for the development of learning and teaching practices using blended learning approaches to enhance learners' learning experiences.  

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

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