scholarly journals A New Approach to the Modeling of Anisotropic Media with the Transmission Line Matrix Method

Electronics ◽  
2021 ◽  
Vol 10 (17) ◽  
pp. 2071
Author(s):  
Jorge A. Portí ◽  
Alfonso Salinas ◽  
Enrique A. Navarro ◽  
Jesús Rodríguez-Camacho ◽  
Jesús Fornieles ◽  
...  

A reformulation of the Transmission Line Matrix (TLM) method is presented to model non-dispersive anisotropic media. Two TLM-based solutions to solve this problem can already be found in the literature, each one with an interesting feature. One can be considered a more conceptual approach, close to the TLM fundamentals, which identifies each TLM in Maxwell’s equations with a specific line. But this simplicity is achieved at the expense of an increase in the memory storage requirements of a general situation. The second existing solution is a more powerful and general formulation that avoids this increase in memory storage. However, it is based on signal processing techniques and considerably deviates from the original TLM method, which may complicate its dissemination in the scientific community. The reformulation presented in this work exploits the benefits of both methods. On the one hand, it maintains the direct and conceptual approach of the original TLM, which may help to better understand it, allowing for its future use and improvement by other authors. On the other hand, the proposal includes an optimized treatment of the signals stored at the stub lines in order to limit the requirement of memory storage to only one accumulative term per field component, as in the original TLM versions used for isotropic media. The good behavior of the proposed algorithm when applied to anisotropic media is shown by its application to different situations involving diagonal and off-diagonal tensor properties.

1995 ◽  
Vol 31 (21) ◽  
pp. 1849-1851 ◽  
Author(s):  
D.M. Stubbs ◽  
B. Wilson ◽  
S.H. Pulko

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Banafsheh Barabadi ◽  
Yogendra K. Joshi ◽  
Satish Kumar ◽  
Gamal Refai-Ahmed

The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of transient Joule heating in interconnects in a two-dimensional (2D) inhomogeneous domain using the transmission line matrix (TLM) method. Computational efficiency of the TLM method and its ability to accept non-uniform 2D and 3D mesh and variable time step makes it a good candidate for multi-scale analysis of Joule heating in on-chip interconnects. The TLM method was implemented with link-resistor (LR) and link-line (LL) formulations, and the results were compared with a finite element (FE) model. The overall behavior of the TLM models were in good agreement with the FE model while, near the heat source, the transient TLM solutions developed slower than the FE solution. The steady-state results of the TLM and FE models were identical. The two TLM formulations yielded slightly different transient results, with the LL result growing slower, particularly at the source boundary and becoming unstable at short time-steps. It was concluded that the LR formulation is more accurate for transient thermal analysis.


Robotica ◽  
1991 ◽  
Vol 9 (3) ◽  
pp. 283-290 ◽  
Author(s):  
S. C. Pomeroy ◽  
H. R. Williams ◽  
P. Blanchfield

SUMMARYAirborne ultrasound based sensor systems have been applied to a variety of problems in robotics and advanced manufacturing. These include slot and hole inspection, and systems suitable for workspace imaging and autonomous guided vehicle (AGV) navigation. The transmission line matrix (TLM) method of modelling wave propagation has been used in the evaluation of these systems. The model gives both graphical and numerical outputs, and allows an improved understanding of the interaction of ultrasonic waves and targets to be obtained.


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