scholarly journals Failure analysis of hydrophilic and hydrophobic aerogels under liquid nitrogen thermal shock

2016 ◽  
Author(s):  
Ai Du ◽  
Bin Zhou ◽  
Mingfang Liu ◽  
Shangming Huang ◽  
Conghang Li
Keyword(s):  
Failure Analysis ◽  
Thermal Shock ◽  
Liquid Nitrogen ◽  
Hydrophobic Aerogels

scholarly journals Thermal Failure Analysis of Fiber-Reinforced Silica Aerogels under Liquid Nitrogen Thermal Shock

Molecules ◽  
2018 ◽  
Vol 23 (7) ◽  
pp. 1522 ◽  
Author(s):  
Ai Du ◽  
Mingfang Liu ◽  
Shangming Huang ◽  
Conghang Li ◽  
Bin Zhou
Keyword(s):  
Failure Analysis ◽  
Thermal Shock ◽  
Liquid Nitrogen ◽  
Silica Aerogels ◽  
Fiber Reinforced ◽  
Thermal Failure

Failure Analysis of Thermally Shocked NiCr Films on Mn-Ni-Co Spinel Oxide Substrates

2005 ◽  
Vol 875 ◽  
Author(s):  
Min-Seok Jeon ◽  
Jun-Kwang Song ◽  
Eui-Jong Lee ◽  
Yong-Nam Kim ◽  
Hyun-Gyu Shin ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Thermal Cycling ◽  
Thermal Shock ◽  
Failure Mechanism ◽  
Thick Film ◽  
Sheet Resistance ◽  
Spinel Oxide ◽  
Initial Value ◽  
Shock Chamber ◽  
Oxide Substrates

AbstractNiCr films were thermally evaporated on the Mn-Ni-Co-O thick-film substrates. The NiCr/Mn-Ni-Co-O bi-layer systems were tested in a thermal shock chamber with three temperature differences of 150, 175 and 200°C. The systems were considered to have failed when the sheet resistance of NiCr films changed by 30% relative to an initial value. As the cyclic repetition of thermal shock increased, the sheet resistance of NiCr coatings increased. The Coffin-Manson equation was applied to the failure mechanism of cracking of NiCr coatings and the SEM observation of cracks and delamination in NiCr coatings due to thermal cycling agreed well with the failure mechanism.

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

2013 ◽  
Vol 53 (1) ◽  
pp. 70-78 ◽  
Author(s):  
Xi Liu ◽  
Qiao Chen ◽  
Venkatesh Sundaram ◽  
Rao R. Tummala ◽  
Suresh K. Sitaraman
Keyword(s):  
Failure Analysis ◽  
Thermal Shock ◽  
Thermal Shock Test ◽  
Free Standing ◽  
Through Silicon Vias ◽  
Shock Test ◽  
Silicon Vias

scholarly journals Failure analysis of aluminum wire bonds in automotive pressure sensors in thermal shock environments

IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Jun Yang ◽  
Panpan Zheng ◽  
Xiaogang Liu ◽  
Qinglin Song ◽  
Yingfeng Zhu ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Thermal Shock ◽  
Pressure Sensors ◽  
Aluminum Wire ◽  
Wire Bonds
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