scholarly journals Virtual Mechanical Product Disassembly Sequences Based on Disassembly Order Graphs and Time Measurement Units

2019 ◽  
Vol 9 (17) ◽  
pp. 3638 ◽  
Author(s):  
Francia ◽  
Ponti ◽  
Frizziero ◽  
Liverani

Recently, the approach that defines the total life cycle assessment (LCA) and the end of life (EoL) in the early design phases is becoming even more promising. Literature evidences many advantages in terms of the saving of costs and time and in the fluent organization of the whole design process. Design for disassembly (DfD) offers the possibility of reducing the time and cost of disassembling a product and accounts for the reusing of parts and of the dismantling of parts, joints, and materials. The sequence of disassembly is the ordered way to extract parts from an assembly and is a focal item in DfD because it can deeply influence times and operations. In this paper, some disassembly sequences are evaluated, and among them, two methods for defining an optimal sequence are provided and tested on a case study of a mechanical assembly. A further sequence of disassembly is provided by the authors based on experience and personal knowledge. All three are analyzed by the disassembly order graph (DOG) approach and compared. The operations evaluated have been converted in time using time measurement units (TMUs). As result, the best sequence has been highlighted in order to define a structured and efficient disassembly.

2015 ◽  
Vol 9 (1) ◽  
pp. 51-58 ◽  
Author(s):  
Keiji Ogawa ◽  
◽  
Toshiki Hirogaki ◽  
Shreyes N. Melkote ◽  
Sachiko Ogawa ◽  
...  

This paper describes an approach achieving process design based on sustainability evaluation by Life Cycle Assessment (LCA). The case study focuses on quenching steel products, which was evaluated by comparing laser quenching to conventional furnace quenching based on the proposed approach. We found that the break-even point depends on production volume as one of product features. The proposed approach shows promise as a strategy for decision making in process design.


Author(s):  
Hung-Sung Lin ◽  
Ying-Chin Hou ◽  
Juimei Fu ◽  
Mong-Sheng Wu ◽  
Vincent Huang ◽  
...  

Abstract The difficulties in identifying the precise defect location and real leakage path is increasing as the integrated circuit design and process have become more and more complicated in nano scale technology node. Most of the defects causing chip leakage are detectable with only one of the FA (Failure Analysis) tools such as LCD (Liquid Crystal Detection) or PEM (Photon Emission Microscope). However, due to marginality of process-design interaction some defects are often not detectable with only one FA tool [1][2]. This paper present an example of an abnormal power consumption process-design interaction related defect which could only be detected with more advanced FA tools.


2021 ◽  
Vol 122 ◽  
pp. 107319
Author(s):  
Wei Chen ◽  
Jinglan Hong ◽  
Chengxin Wang ◽  
Lu Sun ◽  
Tianzuo Zhang ◽  
...  

2020 ◽  
Vol 261 ◽  
pp. 121220 ◽  
Author(s):  
Zi Xiang Keng ◽  
Siewhui Chong ◽  
Chee Guan Ng ◽  
Nur Izzati Ridzuan ◽  
Svenja Hanson ◽  
...  

2021 ◽  
Vol 167 ◽  
pp. 105318
Author(s):  
Giovanna Croxatto Vega ◽  
Joshua Sohn ◽  
Juliën Voogt ◽  
Morten Birkved ◽  
Stig Irving Olsen ◽  
...  

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