scholarly journals A 25.78-Gbit/s × 4-ch Active Optical Cable with Ultra-Compact Form Factor for High-Density Optical Interconnects

2018 ◽  
Vol 8 (1) ◽  
pp. 137 ◽  
Author(s):  
Naohiro Kohmu ◽  
Toshiaki Takai ◽  
Norio Chujo ◽  
Hideo Arimoto
Keyword(s):  
Form Factor ◽  
Optical Interconnects ◽  
High Density ◽  
Compact Form ◽  
Optical Cable

High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]

2014 ◽  
Vol 2 (3) ◽  
pp. A1 ◽  
Author(s):  
Yutaka Urino ◽  
Tatsuya Usuki ◽  
Junichi Fujikata ◽  
Masashige Ishizaka ◽  
Koji Yamada ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
High Density ◽  
Wide Bandwidth

A Compact 310-Gb/s Optical Transceiver for High-Density Optical Interconnects

2017 ◽  
Vol 29 (3) ◽  
pp. 334-337 ◽  
Author(s):  
Yasunobu Matsuoka ◽  
Naohiro Kohmu ◽  
Yong Lee ◽  
Hideo Arimoto ◽  
Toshiaki Takai ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
High Density

Flex-DIMM – A New High Density Module Form Factor

2015 ◽  
Vol 2015 (1) ◽  
pp. 000806-000809
Author(s):  
James E. Clayton
Keyword(s):  
Form Factor ◽  
Cross Section ◽  
Lower Layer ◽  
Signal Integrity ◽  
High Density ◽  
Thermal Dissipation ◽  
Ideal Solution ◽  
Memory Module ◽  
The Past ◽  
New Generation

The Dual In-Line Memory Module (DIMM) has remained relatively unchanged for the past two decades, with exception of an increase in PCB size, I/O pads and layer count. A new generation called Flex-DIMM is introduced by replacing the rigid-PCB substrate with a thin, bifurcated, flexible circuit that enables several improvements; including a thinner cross-section, better signal integrity with lower layer count, better thermal dissipation and ability to be directly mated to the surface of a motherboard. Originally intended for RDIMM applications, the new module may be an ideal solution for clustered microservers.

3D IPD on Thru Glass Via Substrate using panel Manufacturing Technology

2017 ◽  
Vol 2017 (1) ◽  
pp. 000097-000102 ◽  
Author(s):  
Takamasa Takano ◽  
Satoru Kuramochi ◽  
Hobie Yun
Keyword(s):  
Form Factor ◽  
Quality Factor ◽  
Glass Substrate ◽  
High Density ◽  
Color Filter ◽  
Glass Panel ◽  
Low Resistance ◽  
Low Dielectric ◽  
Front End ◽  
Rf Front End

Abstract As electronic products become smaller and thinner with increasing number of functions, the demand for high density and high integration becomes stronger. Glass has many properties that make it an ideal substrate for high integration substrate such as; ultra high resistivity, adjustable thermal expansion (CTE) high modulus, low dielectric constant, low dielectric loss and manufacturability with large panel sizes. Multi-bands with carrier aggregation, Wi-Fi/GPS coexistence, and LTE-U make RF front end more and more complicated. 3D IPD (integrated passive devices) on Glass substrate technology could be advantage solution include reducing power consumption and small form factor. This paper presents a demonstration of 3D RF front end filters using 3D solenoid inductors with through glass vias (TGV) and Cu-SiN-Cu MIM structure on Gen1 glass substrate (300mm × 400mm) panel format using color filter manufacturing line for flat panel display. For inductors, drastic performance (size and low resistance therefore high-quality factor) improvement have been demonstrated by technology evolutions from 3D solenoid using TGV with conformal Cu plating method, achieving low resistance of 3.1mohm per 70um diameter TGV on a 400um thick glass panel. This low-resistance TGV with 2.7mOhm/sq TGV connections on both sides of the glass substrate, record high inductor quality factor of 39 was obtained at 2.5GHz using five and half turn inductor of 7.9nH inductance, For capacitors, we have successfully integrated a Cu MIM (metal-insulator-metal) structure by using 15um thick Cu plates and dielectric, resulting in high capacitance density of 0.26nF/mm2 for RF application. By integrating TGV inductor-first and MIM capacitor-next, high-performance and high-density LC components are synthesized to perform as RF front end filters such as low-pass filters, diplexers, triplexers, and multiplexers. The 3D inductors, Cu MIM, LC resonators and filters were successfully integrated using glass panel manufacturing infrastructure for the first time. Process characterization and process control monitors were evaluated at the panel level to address high-volume and high-yield manufacturability of RF filters with the unprecedented filter performance in terms of insertion loss and out of band rejections in smaller form factor than any other technologies have achieved so far. Furthermore, the TGV filters were mounted on electrical evaluation boards as well as JEDEC standard testing boards to check any device-level, chip-level, and board-level reliabilities associated with glass or TGV materials as well as their interaction with Cu, SiN, polymer inter layer dielectric materials, and solder joints, showing no performance degradations during thermal cycling, drop shock, bending, or high-power testing situations.

Heterogeneous sensing in a multifunctional soft sensor for human-robot interfaces

2020 ◽  
Vol 5 (49) ◽  
pp. eabc6878 ◽  
Author(s):  
Taekyoung Kim ◽  
Sudong Lee ◽  
Taehwa Hong ◽  
Gyowook Shin ◽  
Taehwan Kim ◽  
...  
Keyword(s):  
Form Factor ◽  
Form Factors ◽  
Soft Sensor ◽  
Compact Form ◽  
Original Form ◽  
Entire Body ◽  
Soft Sensors ◽  
Input Stimulus ◽  
Human Robot Interfaces ◽  
Deformation Modes

Soft sensors have been playing a crucial role in detecting different types of physical stimuli to part or the entire body of a robot, analogous to mechanoreceptors or proprioceptors in biology. Most of the currently available soft sensors with compact form factors can detect only a single deformation mode at a time due to the limitation in combining multiple sensing mechanisms in a limited space. However, realizing multiple modalities in a soft sensor without increasing its original form factor is beneficial, because even a single input stimulus to a robot may induce a combination of multiple modes of deformation. Here, we report a multifunctional soft sensor capable of decoupling combined deformation modes of stretching, bending, and compression, as well as detecting individual deformation modes, in a compact form factor. The key enabling design feature of the proposed sensor is a combination of heterogeneous sensing mechanisms: optical, microfluidic, and piezoresistive sensing. We characterize the performance on both detection and decoupling of deformation modes, by implementing both a simple algorithm of threshold evaluation and a machine learning technique based on an artificial neural network. The proposed soft sensor is able to estimate eight different deformation modes with accuracies higher than 95%. We lastly demonstrate the potential of the proposed sensor as a method of human-robot interfaces with several application examples highlighting its multifunctionality.

High-density Optical Interconnects with Integrated Quantum Dot Lasers

2016 ◽  
Author(s):  
Yutaka Urino ◽  
Kenji Mizutani ◽  
Kenichiro Yashiki ◽  
Takahiro Nakamura ◽  
Kazuhiko Kurata ◽  
...  
Keyword(s):  
Quantum Dot ◽  
Optical Interconnects ◽  
High Density ◽  
Quantum Dot Lasers
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