scholarly journals Micro Vibration Measurement with Microscopic Speckle Interferometry Based on Orthogonal Phase

2021 ◽  
Vol 11 (11) ◽  
pp. 5251
Author(s):  
Chenjia Gao ◽  
Zhan Gao ◽  
Yuhao Niu ◽  
Xu Wang ◽  
Jieming Zhao ◽  
...  
Keyword(s):  
Optical Measurement ◽  
Speckle Interferometry ◽  
Vibration Measurement ◽  
Linear Distribution ◽  
Full Field ◽  
Full Field Measurement ◽  
Measurement Principle ◽  
Scanning Imaging ◽  
Micro Vibration ◽  
Orthogonal Phase

A micro-device vibration measurement method based on microscopic speckle interferometry combined with orthogonal phase is presented. This method utilizes the approximate linear distribution characteristics of orthogonal points (points satisfying the condition that the initial phase difference equal to π/2) to quickly obtain the vibration information of the measured object. Compared with common optical measurement methods, this method does not require scanning imaging and can realize real-time full-field measurement. Moreover, the measurement principle and equipment is simple, so there is no need to introduce a stroboscopic light source or heterodyne device.

Review of 3D Shape Measurement Using Fringe Projection Techniques

2012 ◽  
Vol 503-504 ◽  
pp. 1437-1440 ◽  
Author(s):  
Ming Rang Yu ◽  
Ying Jie Zhang ◽  
Ding Zhang
Keyword(s):  
High Speed ◽  
Optical Measurement ◽  
Projection Methods ◽  
Fringe Projection ◽  
Full Field ◽  
3D Shape ◽  
3D Shape Measurement ◽  
Full Field Measurement ◽  
Cad Cam ◽  
Projection Techniques

Optical measurement has been widely used in many fields of science and engineering, such as CAD/CAM, machine vision, quality inspection, reverse engineering, etc, due to its properties of non-contact and high speed. Fringe projection methods have caused much more attentions in full field measurement and insensitive to the change of the objects’ reflectivity. This paper reviews state-of-the art progresses in the 3D shape measuring methods using fringe projection techniques. A comparison of the existing methods is performed with their advantages and drawbacks also are pointed out.

The Development of a Reference Material for Calibration of Full-Field Optical Measurement Systems for Dynamic Deformation Measurements

2011 ◽  
Vol 70 ◽  
pp. 33-38 ◽  
Author(s):  
Andrea Davighi ◽  
Richard L. Burguete ◽  
Mara Feligiotti ◽  
Erwin Hack ◽  
Simon James ◽  
...  
Keyword(s):  
Reference Material ◽  
Optical Measurement ◽  
Three Dimensional ◽  
Speckle Interferometry ◽  
Optical Systems ◽  
Measured Quantity ◽  
Full Field ◽  
Measurement Systems ◽  
Definition Of ◽  
Generic Design

A reference material is defined as material, sufficiently homogeneous and stable with respect to one or more specified properties, which has been established to be fit for its intended use in a measurement process. Reference materials provide a simple definition of the measured quantity that can be traced to an international standard and can be used to assess the uncertainty associated with a measurement system. Previous work established a reference material and procedure for calibrating full-field optical systems suitable for measuring static, in-plane strain distributions. Efforts are now underway to extend this work to the calibration of systems capable of measuring three-dimensional deformation fields induced by dynamic loading. The important attributes for a dynamic reference material have been identified in a systematic and rational fashion, which have been subsequently translated into a generic design specification. Initial prototypes of candidate designs have been produced and evaluated using experimental modal analysis and digital speckle interferometry, and the results have been compared with finite element analyses. Based on the outcome of this initial evaluation, further refinements in design and manufacturing are proposed.

scholarly journals Raman and Infrared Thermometry for Microsystems

2013 ◽  
Vol 5 (3) ◽  
Author(s):  
Leslie M. Phinney ◽  
Wei-Yang Lu ◽  
Justin R. Serrano
Keyword(s):  
Data Collection ◽  
Spatial Resolution ◽  
Infrared Imaging ◽  
Silicon On Insulator ◽  
Pixel Size ◽  
Full Field ◽  
Infrared Thermometry ◽  
Full Field Measurement ◽  
Typical Data ◽  
Field Temperature

This paper reports and compares Raman and infrared thermometry measurements along the legs and on the shuttle of a SOI (silicon on insulator) bent-beam thermal microactuator. Raman thermometry offers micron spatial resolution and measurement uncertainties of ±10 K. Typical data collection times are a minute per location leading to measurement times on the order of hours for a complete temperature profile. Infrared thermometry obtains a full-field measurement so the data collection time is on the order of a minute. The spatial resolution is determined by the pixel size, 25 μm by 25 μm for the system used, and infrared thermometry also has uncertainties of ±10 K after calibration with a nonpackaged sample. The Raman and infrared measured temperatures agreed both qualitatively and quantitatively. For example, when the thermal microactuator was operated at 7 V, the peak temperature on an interior leg is 437 K ± 10 K and 433 K ± 10 K from Raman and infrared thermometry, respectively. The two techniques are complementary for microsystems characterization when infrared imaging obtains a full-field temperature measurement and Raman thermometry interrogates regions for which higher spatial resolution is required.

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