scholarly journals Low Temperature Microcalorimeters for Decay Energy Spectroscopy

2021 ◽  
Vol 11 (9) ◽  
pp. 4044
Author(s):  
Katrina E. Koehler
Keyword(s):  
Low Temperature ◽  
Sample Preparation ◽  
Energy Resolution ◽  
Semiconductor Detectors ◽  
Low Temperature Detectors ◽  
Decay Energy ◽  
Mass Measurements ◽  
Preparation Methods ◽  
Measurement Mode ◽  
Better Than

Low Temperature Detectors have been used to measure embedded radioisotopes in a measurement mode known as Decay Energy Spectroscopy (DES) since 1992. DES microcalorimeter measurements have been used for applications ranging from neutrino mass measurements to metrology to measurements for safeguards and medical nuclides. While the low temperature detectors have extremely high intrinsic energy resolution (several times better than semiconductor detectors), the energy resolution achieved in practice is strongly dependent on factors such as sample preparation method. This review seeks to present the literature consensus on what has been learned by looking at the energy resolution as a function of various choices of detector, absorber, and sample preparation methods.

Development of decay energy spectroscopy using low temperature detectors

2012 ◽  
Vol 70 (9) ◽  
pp. 2255-2259 ◽  
Author(s):  
Y.S. Jang ◽  
G.B. Kim ◽  
K.J. Kim ◽  
M.S. Kim ◽  
H.J. Lee ◽  
...  
Keyword(s):  
Low Temperature ◽  
Low Temperature Detectors ◽  
Decay Energy

Determination of Fluoride in Vegetation: A Comparative Study of Four Sample Preparation Methods

1975 ◽  
Vol 58 (6) ◽  
pp. 1135-1137 ◽  
Author(s):  
Marc A Van Den Heede ◽  
Aubin M Heyndrickx ◽  
Carlos H Van Peteghem ◽  
Wilfried A Van Zele
Keyword(s):  
Low Temperature ◽  
Sample Preparation ◽  
Dilute Acid ◽  
Acid Digestion ◽  
Citrate Buffer ◽  
Preparation Methods ◽  
Alkali Fusion ◽  
Low Temperature Ashing ◽  
Sample Preparation Methods

Abstract Four sample preparation methods (dilute acid digestion, concentrated acid digestion, alkali fusion, and low temperature ashing) for the determination of fluoride in vegetation are compared. A fluoride ion selective electrode is used for the final quantitative measurements. Ionic strength and pH are maintained by a concentrated citrate buffer. The highest sensitivity and reproducibility are obtained by low temperature ashing of the dry sample. Several vegetables, grown in the neighborhood of a glaze factory, were simultaneously analyzed by 2 of the methods, the dilute acid digestion and the low temperature ashing procedures. The higher fluoride content found with the latter technique is attributed to the complete mineralization of the sample.

Parallel Detection of Electron Energy Loss Spectra in Direct Mode

1990 ◽  
Vol 48 (2) ◽  
pp. 82-83
Author(s):  
Eckhard Quandt ◽  
Stephan laBarré ◽  
Andreas Hartmann ◽  
Heinz Niedrig
Keyword(s):  
Energy Loss ◽  
Electron Energy ◽  
Energy Resolution ◽  
Large Angle ◽  
Maximum Energy ◽  
Semiconductor Detectors ◽  
Parallel Detection ◽  
Photodiode Arrays ◽  
Electron Energy Loss ◽  
Electron Energy Loss Spectra

Due to the development of semiconductor detectors with high spatial resolution -- e.g. charge coupled devices (CCDs) or photodiode arrays (PDAs) -- the parallel detection of electron energy loss spectra (EELS) has become an important alternative to serial registration. Using parallel detection for recording of energy spectroscopic large angle convergent beam patterns (LACBPs) special selected scattering vectors and small detection apertures lead to very low intensities. Therefore the very sensitive direct irradiation of a cooled linear PDA instead of the common combination of scintillator, fibre optic, and semiconductor has been investigated. In order to obtain a sufficient energy resolution the spectra are optionally magnified by a quadrupole-lens system.The detector used is a Hamamatsu S2304-512Q linear PDA with 512 diodes and removed quartz-glas window. The sensor size is 13 μm ∗ 2.5 mm with an element spacing of 25 μm. Along with the dispersion of 3.5 μm/eV at 40 keV the maximum energy resolution is limited to about 7 eV, so that a magnification system should be attached for experiments requiring a better resolution.

Improving Sample Preparation Methods For Cannabis-Infused Edible And Topical Products

Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick
Keyword(s):  
Sample Preparation ◽  
Preparation Methods ◽  
Sample Preparation Methods

Methodology for TEM Analysis of Barrier Profiles

2002 ◽  
Author(s):  
Tan-Chen Lee ◽  
Jui-Yen Huang ◽  
Li-Chien Chen ◽  
Ruey-Lian Hwang ◽  
David Su
Keyword(s):  
Sample Preparation ◽  
Profile Analysis ◽  
Image Interpretation ◽  
Sample Thickness ◽  
Image Resolution ◽  
Specimen Preparation ◽  
Tem Analysis ◽  
Preparation Methods ◽  
High Image Resolution ◽  
Common Technique

Abstract Device shrinkage has resulted in thinner barriers and smaller vias. Transmission Electron Microscopy (TEM) has become a common technique for barrier profile analysis because of its high image resolution. TEM sample preparation and image interpretation becomes difficult when the size of the small cylindrical via is close to the TEM sample thickness. Effects of different sample thickness and specimen preparation methods, therefore, have been investigated. An automatic FIB program has been shown to be useful in via sample preparation. Techniques for imaging a TEM specimen will be discussed in the paper. Conventional TEM bright field (BF) image is adequate to examine the barrieronly via; however, other techniques are more suitable for a Cu filled via.

Thin-Die Flip Chip Physical-FA Process Flow

2002 ◽  
Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Fault Isolation ◽  
Preparation Methods ◽  
Chip Technology ◽  
Isolation Test ◽  
Sample Preparation Methods

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.

Influence of Sample Preparation on Intrinsic Stress Inside a Model Chip—Comparison of Results from Electric Read-Out and Raman Spectroscopy

2017 ◽  
Author(s):  
T. Schaffus ◽  
H. Pfaff ◽  
P. Albert ◽  
M. Schaffus ◽  
F. Kroninger ◽  
...  
Keyword(s):  
Raman Spectroscopy ◽  
Sample Preparation ◽  
Intrinsic Stress ◽  
Stress Monitoring ◽  
Preparation Methods ◽  
Comparison Of Results ◽  
The Given

Abstract The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electric components. Raman spectroscopy has been applied as well as the piezo resistive readout on a specifically designed model stress monitoring chip.

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