scholarly journals THz Reflective Imaging System Utilizing Broadband Homodyne Amplification for Artifact-Free See-Through Imaging

2020 ◽  
Vol 10 (20) ◽  
pp. 7228
Author(s):  
Kiwon Moon ◽  
Il-Min Lee ◽  
Eui Su Lee ◽  
Kyung Hyun Park
Keyword(s):  
Signal Amplification ◽  
Continuous Wave ◽  
Imaging System ◽  
Imaging Techniques ◽  
Thz Imaging ◽  
Material Loss ◽  
Frequency Dependent ◽  
Imaging Capability ◽  
Technical Issues ◽  
Non Destructive

Terahertz (THz) technology offers unique see-through imaging capability for various non-destructive inspection applications. In this work, we implemented a broadband continuous-wave THz imaging system to study technical issues related to the see-through imaging, including frequency-dependent resolution, material loss, and interference-induced artifacts. The interference-induced false contrast and artifacts were observed, which were suppressed by broadband imaging techniques adopting the homodyne signal amplification by interferometric setup to overcome the material loss.

Method for defect contour extraction in terahertz non-destructive testing conducted with a raster-scan THz imaging system

2018 ◽  
Vol 57 (17) ◽  
pp. 4884 ◽  
Author(s):  
Cheng-Wu You ◽  
Chengchangfeng Lu ◽  
Tian-Yi Wang ◽  
Shun-Rong Qian ◽  
Zhen-Gang Yang ◽  
...  
Keyword(s):  
Imaging System ◽  
Contour Extraction ◽  
Non Destructive Testing ◽  
Thz Imaging ◽  
Destructive Testing ◽  
Raster Scan ◽  
Non Destructive

Compact and cost-effective continuous wave THz imaging system

2003 ◽  
Author(s):  
T. Kleine-Ostmann ◽  
P. Knobloch ◽  
M. Koch ◽  
S. Hoffmann ◽  
M. Hofmann ◽  
...  
Keyword(s):  
Continuous Wave ◽  
Imaging System ◽  
Cost Effective ◽  
Thz Imaging

A continuous-wave THz imaging system

2013 ◽  
Author(s):  
Ting-Hang Pei ◽  
Yang-Tung Huang ◽  
Yu-Jiu Wang ◽  
Wei-Zen Chen ◽  
Chien-Nan Kuo ◽  
...  
Keyword(s):  
Continuous Wave ◽  
Imaging System ◽  
Thz Imaging

Terahertz antenna technology for imaging applications: a technical review

2018 ◽  
Vol 10 (3) ◽  
pp. 271-290 ◽  
Author(s):  
Isha Malhotra ◽  
Kumud Ranjan Jha ◽  
Ghanshyam Singh
Keyword(s):  
Imaging System ◽  
Imaging Techniques ◽  
Relevant Literature ◽  
Dipole Antenna ◽  
Image Resolution ◽  
Depth Of Field ◽  
Electromagnetic Spectrum ◽  
Thz Imaging ◽  
Thz Sources ◽  
Thz Antenna

AbstractThe terahertz (THz) regime of the electromagnetic spectrum is rich with the emerging possibilities in imaging applications with unique characteristics to screening for weapons, explosives and bio-hazards, imaging of concealed objects, water content, and skin, and these advantages can be harnessed by using the effective THz sources and detectors. In THz imaging systems, the pulsed THz sources and detectors find unique applications and thus we have emphasized on re-visiting these kinds of systems. Several novel imaging techniques which exploit the distinctive properties of the THz systems have been presented. Moreover, the THz antenna is one of the most important components of a THz imaging system as it plays a significant role in both impedance matching and power source. Therefore, the recent developments in THz antenna design for imaging applications are reviewed and the potential challenges of such THz systems are investigated. The photoconductive antennas form the basis of many THz imaging and spectroscopy systems and finds promising applications in various scientific fields. However, for the imaging applications, there is a requirement of planar and compact THz antenna sources with on-chip fabrication and high directivity in order to achieve large depth-of-field for better image resolution. Therefore, the key modalities of improving photoconductive dipole antennas performance are identified for imaging applications. Also, the ways to improve the directivity of the photoconductive dipole antenna are discussed. The main purpose of this review is to provide an assortment of all relevant literature to bring researchers up-to-date on the current state-of-the-art and potential challenges of THz antenna technology for imaging applications.

scholarly journals Nondestructive Internal Defect Detection Using a CW–THz Imaging System in XLPE for Power Cable Insulation

2020 ◽  
Vol 10 (6) ◽  
pp. 2055 ◽  
Author(s):  
In-Sung Lee ◽  
Joong Wook Lee
Keyword(s):  
Nondestructive Testing ◽  
Continuous Wave ◽  
Imaging System ◽  
Electrical Power ◽  
Coherent Detection ◽  
Power Cable ◽  
Thz Imaging ◽  
Cable Insulation ◽  
Detection Scheme ◽  
Thz Waves

The demand for internal nondestructive testing and inspection techniques is rapidly increasing. Using a continuous wave (CW) terahertz (THz) imaging system, we demonstrate that the internal defects in cross-linked polyethylene (XLPE) plates for power cable insulation can be detected. In a coherent detection scheme based on photomixers, which serve as the THz emitters and receivers, the change of phase occurring with the defects inside the XLPE plates is distinctly measured by the change in the amplitude of the transmitted THz waves. According to the two-dimensional images of THz waves transmitted through the XLPE plates, defects of up to 0.5 mm size located inside the XLPE plates can be detected by the internal nondestructive examination method based on CW–THz waves. This technique will be useful for internal nondestructive testing and inspection of insulation materials that require high resolution in various industries, including the automobiles, electronics, and electrical power industries.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

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