scholarly journals Design and Comparative Analysis of a Retrofitted Liquid Cooling System for High-Power Actuators

Actuators ◽  
2015 ◽  
Vol 4 (3) ◽  
pp. 182-202 ◽  
Author(s):  
Nicholas Paine ◽  
Luis Sentis
Keyword(s):  
Comparative Analysis ◽  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
Liquid Cooling System

COMPACT LIQUID COOLING SYSTEM FOR HIGH POWER IGBT MODULES IN EV/HEV APPLICATIONS

2018 ◽  
Author(s):  
Seokkan Ki ◽  
Jooyoung Lee ◽  
Seunggeol Ryu ◽  
Youngsuk Nam
Keyword(s):  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
Igbt Modules ◽  
Liquid Cooling System

757 Development of a Forced-Liquid Cooling System for High Power Electronic Chips Using ECF

2005 ◽  
Vol 2005 (0) ◽  
pp. 219-220
Author(s):  
Woo-Suk SEO ◽  
Kazuhiro YOSHIDA ◽  
Shinichi YOKOTA ◽  
Kazuya EDAMURA
Keyword(s):  
High Power ◽  
Cooling System ◽  
Power Electronic ◽  
Liquid Cooling ◽  
Liquid Cooling System

P-173: Improved Liquid Cooling System for Ultra High Power LED Projector

2010 ◽  
Vol 41 (1) ◽  
pp. 1915
Author(s):  
Mao-Yi Lee ◽  
Alex Wang ◽  
Jung-Hsien Yen ◽  
Jung-Hua Chou
Keyword(s):  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
High Power Led ◽  
Liquid Cooling System

Study on the Heat Sink Structure and Heat Transfer Effect of Liquid Cooling System for High Power LEDs

2015 ◽  
Vol 35 (3) ◽  
pp. 0323003
Author(s):  
田立新 Tian Lixin ◽  
文尚胜 Wen Shangsheng ◽  
黄伟明 Huang Weiming ◽  
夏云云 Xia Yunyun ◽  
姚日晖 Yao Rihui
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Heat Sink ◽  
Cooling System ◽  
Transfer Effect ◽  
Liquid Cooling ◽  
Liquid Cooling System

Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

2011 ◽  
Vol 130-134 ◽  
pp. 3967-3971
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Jhih Wei Huang
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Cooling System ◽  
Thermal Dissipation ◽  
Liquid Cooling ◽  
K Value ◽  
Control Factors ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis

2011 ◽  
Vol 383-390 ◽  
pp. 6416-6421
Author(s):  
San Shan Hung ◽  
Hsing Cheng Chang ◽  
Chan Ming Liang
Keyword(s):  
Flow Rate ◽  
High Power ◽  
Cooling System ◽  
Liquid Cooling ◽  
K Value ◽  
Pump Flow ◽  
Pump Flow Rate ◽  
High Power Led ◽  
Liquid Type ◽  
Liquid Cooling System

To optimize thermal dissipation efficiency for cooling high power LED modules is studied and analyzed using ANSYS CFX software and Taguchi method. In liquid-cooling system, four control factors are tested and compared in order to find the best cooling arrangement that are pump flow rate, fan power, cooling liquid type and k- value of thermal compound. The experimental results show that the importance of these cooling parameters applied to high power LED module are k-value of thermal compound, fan power, liquid type and pump flow rate in sequence. For a constant heating power of 90W from an LED lighting module, an optimal thermal resistance of 0.563K/W is obtained that shows a significant improved result then the conventional LED module’s. It has high potential in future high power LED applications.

Sign in / Sign up

Export Citation Format

Share Document