scholarly journals An Overview of Biomembrane Functions in Plant Responses to High-Temperature Stress

2018 ◽  
Vol 9 ◽  
Author(s):  
Yue Niu ◽  
Yun Xiang
Author(s):  
Kamrun Nahar ◽  
Mirza Hasanuzzaman ◽  
Kamal Uddin Ahamed ◽  
Khalid Rehman Hakeem ◽  
Munir Ozturk ◽  
...  

Plants ◽  
2021 ◽  
Vol 10 (12) ◽  
pp. 2644
Author(s):  
Yin Luo ◽  
Yanyang Xie ◽  
Weiqiang Li ◽  
Maohuan Wei ◽  
Tian Dai ◽  
...  

High temperature stress seriously limits the yield and quality of wheat. Trehalose, a non-reducing disaccharide, has been shown involved in regulating plant responses to a variety of environmental stresses. This study aimed to explore the molecular regulatory network of exogenous trehalose to improve wheat heat tolerance through RNA-sequencing technology and physiological determination. The physiological data and RNA-seq showed that trehalose reduced malondialdehyde content and relative conductivity in wheat roots, and affecting the phenylpropane biosynthesis, starch and sucrose metabolism, glutathione metabolism, and other pathways. Our results showed that exogenous trehalose alleviates the oxidative damage caused by high temperature, coordinating the effect of wheat on heat stress by re-encoding the overall gene expression, but two wheat varieties showed different responses to high temperature stress after trehalose pretreatment. This study preliminarily revealed the effect of trehalose on gene expression regulation of wheat roots under high temperature stress, which provided a reference for the study of trehalose.


Agronomy ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 685
Author(s):  
Rashid Hussain ◽  
Choudhary Muhammad Ayyub ◽  
Muhammad Rashid Shaheen ◽  
Sahar Rashid ◽  
Muhammad Nafees ◽  
...  

Keeping in view the yield losses instigated by heat stress in several crops, we carried out an experiment to explore the curative effect of exogenous applications of proline on the morpho-physiological, biochemical, and water-related attributes of okra genotypes under high-temperature stress (controlled conditions). Four contrasting genotypes C1, C2, C3, and C4 heat tolerant and heat sensitive genotypes were selected from a diverse panel of okra genotypes (n = 100) to examine plant responses to high-temperature stress and exogenous application of proline. Four-week-old seedlings were subjected to heat stress by gradually increasing the temperature of a growth chamber from 28/22 °C to 45/35 °C (day/night) and sprayed with an optimized proline concentration 2.5 mM. The experiment consisted of a factorial arrangement of treatments in a completely randomized design. The results showed that there were maximum increases in shoot length (32.7%), root length (58.9%), and shoot fresh (85.7%). The quantities of leaves per plant were increased by 52.9%, 123.6%, 82.5%, and 62.2% in C1, C2, C3, and C4 after proline application. On the other hand, only root fresh weight decreased in all genotypes after proline application by 23.1%, 20%, 266.7%, and 280.8% (C1, C2, C3, C4). A lower leaf temperature of 27.72 °C, minimum transpiration of 3.29 mmol m−2 s−1, maximum photosynthesis of 3.91 μmol m−2 s−1, and a maximum water use efficiency of 1.20 μmol CO2 mmol H2O were recorded in the genotypes C2, C1, C3, and C4, respectively. The highest enzymatic activity of superoxide dismutase, peroxidase and catalase were 14.88, 0.31, and 0.15 U mg-protein in C2, C1, and C3, respectively. Maximum leaf proline, glycinebetaine, total free amino acids, and chlorophyll content 3.46 mg g−1, 4.02 mg g−1, 3.46 mg g−1, and 46.89 (in C2), respectively, due to foliar applications of proline. Another important finding was that heat tolerance in okra was highly linked highly linked to genotypes’ genetic potential, having more water use efficiency, enzymatic activities, and physio-biochemical attributes under the foliar applications of proline.


Plants ◽  
2021 ◽  
Vol 10 (10) ◽  
pp. 2211
Author(s):  
Zhuoya Cheng ◽  
Yuting Luan ◽  
Jiasong Meng ◽  
Jing Sun ◽  
Jun Tao ◽  
...  

Plant growth and development are closely related to the environment, and high-temperature stress is an important environmental factor that affects these processes. WRKY transcription factors (TFs) play important roles in plant responses to high-temperature stress. WRKY TFs can bind to the W-box cis-acting elements of target gene promoters, thereby regulating the expression of multiple types of target genes and participating in multiple signaling pathways in plants. A number of studies have shown the important biological functions and working mechanisms of WRKY TFs in plant responses to high temperature. However, there are few reviews that summarize the research progress on this topic. To fully understand the role of WRKY TFs in the response to high temperature, this paper reviews the structure and regulatory mechanism of WRKY TFs, as well as the related signaling pathways that regulate plant growth under high-temperature stress, which have been described in recent years, and this paper provides references for the further exploration of the molecular mechanisms underlying plant tolerance to high temperature.


2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  

Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.


2020 ◽  
Vol 16 (2) ◽  
pp. 18-23
Author(s):  
K. PRAVALLIKA ◽  
C. ARUNKUMAR ◽  
A. VIJAYKUMAR ◽  
R. BEENA ◽  
V. G. JAYALEKSHMI

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