Influence of Mold Powder Slag Composition on Formation of Oxide Particles in Steel

2021 ◽  
Author(s):  
J. Gilmore ◽  
J. Ito ◽  
Y. Iwamoto ◽  
M. Okada
Keyword(s):  
Slag Composition ◽  
Mold Powder ◽  
Oxide Particles

Influence of Thermo-Mechanical Processing on the Microstructure of Beryllia Dispersed Nickel Alloys

1973 ◽  
Vol 31 ◽  
pp. 184-185
Author(s):  
M.S. Grewal ◽  
S.A. Sastri ◽  
N.J. Grant
Keyword(s):  
High Temperature ◽  
Nickel Alloys ◽  
Thermomechanical Processing ◽  
Cold Work ◽  
High Temperature Strength ◽  
Strengthening Effect ◽  
Mechanical Processing ◽  
Uniform Dispersion ◽  
Oxide Particles ◽  
Nickel Base

Currently there is a great interest in developing nickel base alloys with fine and uniform dispersion of stable oxide particles, for high temperature applications. It is well known that the high temperature strength and stability of an oxide dispersed alloy can be greatly improved by appropriate thermomechanical processing, but the mechanism of this strengthening effect is not well understood. This investigation was undertaken to study the dislocation substructures formed in beryllia dispersed nickel alloys as a function of cold work both with and without intermediate anneals. Two alloys, one Ni-lv/oBeo and other Ni-4.5Mo-30Co-2v/oBeo were investigated. The influence of the substructures produced by Thermo-Mechanical Processing (TMP) on the high temperature creep properties of these alloys was also evaluated.

The oxidation of Inconel alloy MA754 at low oxidation potential

1983 ◽  
Vol 41 ◽  
pp. 218-219
Author(s):  
D. N. Braski ◽  
P. D. Goodell ◽  
J. V. Cathcart ◽  
R. H. Kane
Keyword(s):  
Surface Layer ◽  
Oxidation Potential ◽  
Metal Interface ◽  
Elevated Temperature Strength ◽  
Surface Conditions ◽  
Inconel Alloy ◽  
Inco Alloy ◽  
Resistance To Oxidation ◽  
Oxide Particles ◽  
Cold Worked

It has been known for some time that the addition of small oxide particles to an 80 Ni—20 Cr alloy not only increases its elevated-temperature strength, but also markedly improves its resistance to oxidation. The mechanism by which the oxide dispersoid enhances the oxidation resistance is being studied collaboratively by ORNL and INCO Alloy Products Company.Initial experiments were performed using INCONEL alloy MA754, which is nominally: 78 Ni, 20 Cr, 0.05 C, 0.3 Al, 0.5 Ti, 1.0 Fe, and 0.6 Y2O3 (wt %).Small disks (3 mm diam × 0.38 mm thick) were cut from MA754 plate stock and prepared with two different surface conditions. The first was prepared by mechanically polishing one side of a disk through 0.5 μm diamond on a syntron polisher while the second used an additional sulfuric acid-methanol electropolishing treatment to remove the cold-worked surface layer. Disks having both surface treatments were oxidized in a radiantly heated furnace for 30 s at 1000°C. Three different environments were investigated: hydrogen with nominal dew points of 0°C, —25°C, and —55°C. The oxide particles and films were examined in TEM by using extraction replicas (carbon) and by backpolishing to the oxide/metal interface. The particles were analyzed by EDS and SAD.

Effect of Improved ThO2 Particle Dispersion in Nickel on High-Temperature Strength

1970 ◽  
Vol 28 ◽  
pp. 444-445
Author(s):  
E. R. Kimmel ◽  
H. L. Anthony ◽  
W. Scheithauer
Keyword(s):  
High Temperature ◽  
Metal Matrix ◽  
Oxide Particle ◽  
Oxide Phase ◽  
Dislocation Motion ◽  
Particle Dispersion ◽  
High Temperature Strength ◽  
Strengthening Effect ◽  
Oxide Particles ◽  
The Stability

The strengthening effect at high temperature produced by a dispersed oxide phase in a metal matrix is seemingly dependent on at least two major contributors: oxide particle size and spatial distribution, and stability of the worked microstructure. These two are strongly interrelated. The stability of the microstructure is produced by polygonization of the worked structure forming low angle cell boundaries which become anchored by the dispersed oxide particles. The effect of the particles on strength is therefore twofold, in that they stabilize the worked microstructure and also hinder dislocation motion during loading.

Electrodeposition of Cu2O Particles by Using Electrolyte Solution Containing Glucopone as Surfactant

2009 ◽  
Vol 1 (2) ◽  
pp. 18-20
Author(s):  
Dahyunir Dahlan
Keyword(s):  
Indium Tin Oxide ◽  
Pulse Current ◽  
Platinum Electrode ◽  
Saturated Calomel Electrode ◽  
X Ray Diffraction ◽  
X Ray ◽  
Glass Substrates ◽  
Continuous Current ◽  
Oxide Particles ◽  
Cupric Sulphate

Copper oxide particles were electrodeposited onto indium tin oxide (ITO) coated glass substrates. Electrodeposition was carried out in the electrolyte containing cupric sulphate, boric acid and glucopone. Both continuous and pulse currents methods were used in the process with platinum electrode, saturated calomel electrode (SCE) and ITO electrode as the counter, reference and working electrode respectively. The deposited particles were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). It was found that, using continuous current deposition, the deposited particles were mixture of Cu2O and CuO particles. By adding glucopone in the electrolyte, particles with spherical shapes were produced. Electrodeposition by using pulse current, uniform cubical shaped Cu2O particles were produced

Study of the microstructure and particles of vanadium (III) oxide, vanadium (V) oxide and lithium aluminate powders

2020 ◽  
Vol 86 (1) ◽  
pp. 32-37
Author(s):  
Valeria A. Brodskaya ◽  
Oksana A. Molkova ◽  
Kira B. Zhogova ◽  
Inga V. Astakhova
Keyword(s):  
Particle Size ◽  
Particle Size Distribution ◽  
Vanadium Oxide ◽  
Size Distribution ◽  
Microstructural Analysis ◽  
Coherent Scattering ◽  
Powder Materials ◽  
Lithium Aluminate ◽  
Range Limit ◽  
Oxide Particles

Powder materials are widely used in the manufacture of electrochemical elements of thermal chemical sources of current. Electrochemical behavior of the powders depends on the shape and size of their particles. The results of the study of the microstructure and particles of the powders of vanadium (III), (V) oxides and lithium aluminate obtained by transmission electron and atomic force microscopy, X-ray diffraction and gas adsorption analyses are presented. It is found that the sizes of vanadium (III) and vanadium (V) oxide particles range within 70 – 600 and 40 – 350 nm, respectively. The size of the coherent-scattering regions of the vanadium oxide particles lies in the lower range limit which can be attributed to small size of the structural elements (crystallites). An average volumetric-surface diameter calculated on the basis of the surface specific area is close to the upper range limit which can be explained by the partial agglomeration of the powder particles. Unlike the vanadium oxide particles, the range of the particle size distribution of the lithium aluminate powder is narrower — 50 – 110 nm. The values of crystallite sizes are close to the maximum of the particle size distribution. Microstructural analysis showed that the particles in the samples of vanadium oxides have a rounded (V2O3) or elongated (V2O5) shape; whereas the particles of lithium aluminate powder exhibit lamellar structure. At the same time, for different batches of the same material, the particle size distribution is similar, which indicates the reproducibility of the technologies for their manufacture. The data obtained can be used to control the constancy of the particle size distribution of powder materials.

A Proof for the Possibility of Ce-Oxide from CMP Residuals in Si-Wafers by Analytical TEM

2012 ◽  
Author(s):  
Wayne Zhao ◽  
Liem Do Thanh ◽  
Michael Gribelyuk ◽  
Mary-Ann Zaitz ◽  
Wing Lai
Keyword(s):  
Technology Development ◽  
Early Stage ◽  
Chemical Mechanical Planarization ◽  
Particle Cluster ◽  
Limited Region ◽  
Physical Evidence ◽  
Analytical Tem ◽  
Transmission Electron ◽  
Oxide Particles

Abstract Inclusion of cerium (Ce) oxide particles as an abrasive into chemical mechanical planarization (CMP) slurries has become popular for wafer fabs below the 45nm technology node due to better polishing quality and improved CMP selectivity. Transmission electron microscopy (TEM) has difficulties finding and identifying Ce-oxide residuals due to the limited region of analysis unless dedicated efforts to search for them are employed. This article presents a case study that proved the concept in which physical evidence of Ce-rich particles was directly identified by analytical TEM during a CMP tool qualification in the early stage of 20nm node technology development. This justifies the need to setup in-fab monitoring for trace amounts of CMP residuals in Si-based wafer foundries. The fact that Cr resided right above the Ce-O particle cluster, further proved that the Ce-O particles were from the wafer and not introduced during the sample preparation.

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