scholarly journals Implementation of integrated circuit and design of SAR ADC for fully implantable hearing aids

2017 ◽  
Vol 25 ◽  
pp. 83-92
Author(s):  
Jong Hoon Kim ◽  
Jyung Hyun Lee ◽  
Jin-Ho Cho
Keyword(s):  
Hearing Aids ◽  
Integrated Circuit ◽  
Sar Adc ◽  
Implantable Hearing Aids

scholarly journals Totally Implantable Hearing Devices

2010 ◽  
Vol 2 (2) ◽  
pp. 139-142
Author(s):  
Mohan Kameswaran ◽  
S Raghunandhan
Keyword(s):  
Hearing Loss ◽  
Hearing Aids ◽  
Surgical Procedure ◽  
Social Stigma ◽  
Current Status ◽  
Auditory Rehabilitation ◽  
Hearing Devices ◽  
Implantable Hearing Aids

Abstract Hearing aids are the principal means of auditory rehabilitation for patients with moderate to severe sensori-neural hearing loss. Although technical improvements and modifications have improved the fidelity of conventional aids, hearing aids still have many limitations including the inherent self consciousness and social stigma attached to visible hearing aids. The recently introduced totally implantable hearing aids offer patients with hearing loss several potential advantages over conventional hearing aids. This article reviews the indications, surgical procedure, advantages and the current status of totally implantable hearing devices.

A 1-Channel 3-Band Wide Dynamic Range Compression Chip for Vibration Transducer of Implantable Hearing Aids

2014 ◽  
Vol 24 (1) ◽  
pp. 1009-1017 ◽  
Author(s):  
DongWook Kim ◽  
KiWoong Seong ◽  
MyoungNam Kim ◽  
JinHo Cho ◽  
JyungHyun Lee
Keyword(s):  
Hearing Aids ◽  
Dynamic Range ◽  
Wide Dynamic Range ◽  
Dynamic Range Compression ◽  
Vibration Transducer ◽  
Implantable Hearing Aids

Evaluation of Epoxy Flux for Use in Hearing Aid SMD Assemblies

2013 ◽  
Vol 2013 (1) ◽  
pp. 000152-000157
Author(s):  
Susie Johansson ◽  
John Dzarnoski
Keyword(s):  
Integrated Circuits ◽  
Hearing Aids ◽  
Integrated Circuit ◽  
Hearing Aid ◽  
Single Step ◽  
Size Reduction ◽  
Circuit Board ◽  
Limiting Factor ◽  
Surface Mount ◽  
Die Attach

Miniaturization of everyday products has been driving sales for some time and continues to fuel the consumer market. Everyone expects size reduction with each new product generation [1], [2]. Almost everything has electronics inside that must get smaller. There is no market demanding smaller devices that are faster, more capable, more feature-rich than that of the hearing aid industry. While radios, Bluetooth wireless systems and other accessories are added to hearing instruments feature lists, the consumer nonetheless continues to wish for them to be even smaller. Advancements in circuit fabrication, component shrinkage and die consolidation have aided the industry in satisfying this need. However, as this demand continues and even intensifies, current surface mount device assembly materials are becoming inadequate and the limiting factor for overall circuit size reduction; specifically, the die attachment, protection and reinforcement process is limiting how small hearing aid circuits can be. For hearing aids, the addition of more features and connection to more accessories each require a number of integrated circuits and associated passives attached to a flexible circuit. These circuits are invariably bent and twisted during assembly, up to 180°, requiring the integrated circuit solder joints to be reinforced by underfilling to prevent detachment. Unfortunately, the underfilling process is time-consuming and the capillary action necessary for its success is finicky. Even more unfavorably, a designated “keep out” area for other components must surround the die to be underfilled to allow for the dispensing equipment to access the die, reducing the useable board space and limiting the overall possibility of circuit size reduction. Additionally, the underfill material must stay away from circuit board edges and areas to be bent during final assembly. In an attempt to increase useable circuit board space, decrease overall circuit board size, and reduce assembly steps, the application of two epoxy flux materials for die attach fluxing and underfilling of hearing aids was evaluated. Epoxy flux is a relatively new material, which combines the functionality of flux and underfill into a single step. Epoxy flux's application, while eliminating steps, would more significantly eliminate the necessary “keep out” areas around die and allow for more densely placed surface mount components. The epoxy flux materials were applied by both printing and dipping, and then evaluated using x-ray imaging, scanning acoustic microscope imaging, die peel testing, multiple reflow integrity testing and die shear testing.

A Pathway for Information Transmission to the Ear

1995 ◽  
Vol 74 (9) ◽  
pp. 640-644 ◽  
Author(s):  
Ricardo Ferreira Bento ◽  
Aroldo Miniti ◽  
Tanit Ganz Sanchez ◽  
Adolfo Leiner ◽  
Carlos Augusto Nunes
Keyword(s):  
Tympanic Membrane ◽  
Hearing Aids ◽  
Electromagnetic Interference ◽  
Light Emitting Diode ◽  
Photovoltaic Cell ◽  
Small Power ◽  
Prosthetic Devices ◽  
Light Emitting ◽  
Implantable Hearing Aids ◽  
Audio Range

The use of implantable hearing aids and cochlear implants as an aid to neurosensory deafness is becoming an established procedure. The transmission of a processed speech signal is accomplished either transcutaneously via radiofrequency or percutaneously by connector coupling. Whereas the former is sensitive to electromagnetic interference, the latter increases the risk of infection. To overcome these disadvantages, an infrared (IR) system for transmission through the tympanic membrane was devised and tested. The transmitter/receiver consisted of an IR light emitting diode (LED;920nm) and a photovoltaic cell. The LED was placed inside the auditory canal of four dogs and the photovoltaic cell in the tympanic cavity over the cochlear promontory. A sinusoidal signal modulation was applied to the LED. The emitted signal was detected undistorted after crossing the tympanic membrane, with an average absorbance of 20%. High-frequency cut-off was adequate for cochlear implant purposes and audio prosthetic devices in general. The authors conclude that the tympanic membrane may be used as a translucent sealed interface to transmit data in the audio range to the middle and inner ears, with small power loss, good frequency response, and immunity to interface.

Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids

2007 ◽  
Vol 9 (6) ◽  
pp. 939-949 ◽  
Author(s):  
Woo-Tae Park ◽  
Kevin N. O’Connor ◽  
Kuan-Lin Chen ◽  
Joseph R. Mallon ◽  
Toshiki Maetani ◽  
...  
Keyword(s):  
Hearing Aids ◽  
Implantable Hearing Aids ◽  
Implantable Sensor

scholarly journals Fully Implantable Hearing Aids

2016 ◽  
Vol 130 (S3) ◽  
pp. S22-S22
Author(s):  
Philippe Lefebvre ◽  
Sébastien Barriat
Keyword(s):  
Hearing Aids ◽  
Implantable Hearing Aids

scholarly journals Low-Frequency Piezoelectric Accelerometer Array for Fully Implantable Cochlear Implants

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1059 ◽  
Author(s):  
János Radó ◽  
Péter Udvardi ◽  
Saeedeh Soleimani ◽  
Lucky Kenda Peter ◽  
István Bársony ◽  
...  
Keyword(s):  
Hearing Aids ◽  
Low Frequency ◽  
Open Circuit ◽  
Implantable Hearing Aids ◽  
Spiral Geometry ◽  
Cantilever Array ◽  
The Individual ◽  
Micro Electromechanical System ◽  
Q Factors ◽  
Volume Stress

We demonstrate a low-volume, stress-free, piezoelectric micro-electromechanical system (MEMS) cantilever array for fully implantable hearing aids. The 12-element spiral-matrix is sensitive to the lower part of audible frequency range (300–700 Hz) through the proper resonant frequency of the individual spirals tuned by dimensions of the cantilevers. The obtained high Q-factors (117–254) provide high frequency selectivity. The generated open circuit voltage signals could be sufficient for the direct analog conversion of the signals for cochlear multielectrode implants. By comparing different geometries we have also demonstrated that the initial stress, which is derived from silicon-dioxide (SiO2) and aluminum-nitride (AlN) layers, could be drastically reduced simply by the spiral geometry. The results of vibration measurements have shown a good agreement with the calculated resonant frequencies.

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