scholarly journals Characterisation of crack tip fields under non-uniform fatigue loading

2013 ◽  
Vol 7 (25) ◽  
pp. 1-6 ◽  
Author(s):  
D. Nowell ◽  
M.E. Kartal ◽  
P.F.P. de Matos
Keyword(s):  
Crack Tip ◽  
Fatigue Loading ◽  
Crack Tip Fields

The Higher Order Crack Tip Fields for Arbitrary FGM Composite Functions

2011 ◽  
Vol 19 (4-5) ◽  
pp. 401-404
Author(s):  
Dai Yao ◽  
Zhang Lei ◽  
Liu Jun-feng ◽  
Zhong Xiao
Keyword(s):  
Crack Tip ◽  
Higher Order ◽  
Composite Functions ◽  
Crack Tip Fields

Fracture Mechanics of Thin Plates and Shells Under Combined Membrane, Bending, and Twisting Loads

2005 ◽  
Vol 58 (1) ◽  
pp. 37-48 ◽  
Author(s):  
Alan T. Zehnder ◽  
Mark J. Viz
Keyword(s):  
Fracture Mechanics ◽  
Plate Theory ◽  
Experimental Studies ◽  
Three Dimensional ◽  
Crack Tip ◽  
Thin Plates ◽  
Element Analysis ◽  
Crack Tip Fields ◽  
Plates And Shells ◽  
Membrane Bending

The fracture mechanics of plates and shells under membrane, bending, twisting, and shearing loads are reviewed, starting with the crack tip fields for plane stress, Kirchhoff, and Reissner theories. The energy release rate for each of these theories is calculated and is used to determine the relation between the Kirchhoff and Reissner theories for thin plates. For thicker plates, this relationship is explored using three-dimensional finite element analysis. The validity of the application of two-dimensional (plate theory) solutions to actual three-dimensional objects is analyzed and discussed. Crack tip fields in plates undergoing large deflection are analyzed using von Ka´rma´n theory. Solutions for cracked shells are discussed as well. A number of computational methods for determining stress intensity factors in plates and shells are discussed. Applications of these computational approaches to aircraft structures are examined. The relatively few experimental studies of fracture in plates under bending and twisting loads are also reviewed. There are 101 references cited in this article.

The Higher Order Crack Tip Fields for Interfacial Crack between Linear Functionally Graded and Homogeneous Piezoelectric Materials

2014 ◽  
Vol 1015 ◽  
pp. 97-100
Author(s):  
Yao Dai ◽  
Xiao Chong ◽  
Ying Chen
Keyword(s):  
Piezoelectric Materials ◽  
Electric Displacement ◽  
Interfacial Crack ◽  
Crack Tip ◽  
Higher Order ◽  
Functionally Graded ◽  
Linear Functions ◽  
Intensity Factors ◽  
Crack Tip Fields ◽  
Functionally Graded Piezoelectric Materials

The higher order crack-tip fields for an anti-plane crack situated in the interface between functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) are presented. The mechanical and electrical properties of the FGPMs are assumed to be linear functions of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. By using the method of eigen-expansion, the higher order stress and electric displacement crack tip fields for FGPMs and HPMs are obtained. The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.

Sign in / Sign up

Export Citation Format

Share Document