Properties of CuInS2 free surface and the effect of conductive polymer layers on these properties

2006 ◽  
Vol 55 (2) ◽  
pp. 111
Author(s):  
S Bereznev ◽  
J Kois ◽  
P Lutsyk ◽  
E Mellikov ◽  
A Öpik ◽  
...  
Keyword(s):  
Free Surface ◽  
Conductive Polymer ◽  
Polymer Layers

Electrically tunable liquid-crystal wave plate using quadripolar electrode configuration and transparent conductive polymer layers

2009 ◽  
Vol 48 (28) ◽  
pp. 5301 ◽  
Author(s):  
Nicolas Fraval ◽  
Pascal Joffre ◽  
Stéphane Formont ◽  
Jean Chazelas
Keyword(s):  
Liquid Crystal ◽  
Conductive Polymer ◽  
Electrode Configuration ◽  
Polymer Layers ◽  
Wave Plate

Photo-aligned and photo-conductive polymer layers for photorefractive liquid crystal cells of high transmittance

2003 ◽  
Vol 21 (1-3) ◽  
pp. 657-662 ◽  
Author(s):  
Hyun-Wuk Kim ◽  
Kyung-Soo Choi ◽  
Junho Mun ◽  
Suho Jung ◽  
Choon-Sup Yoon ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Conductive Polymer ◽  
Polymer Layers ◽  
Crystal Cells

Electroactive composite systems containing high conductive polymer layers on poly(ethylene) porous films

2006 ◽  
Vol 17 (9-10) ◽  
pp. 700-704 ◽  
Author(s):  
G. K. Elyashevich ◽  
M. A. Smirnov ◽  
I. S. Kuryndin ◽  
V. Bukošek
Keyword(s):  
Conductive Polymer ◽  
Porous Films ◽  
Polymer Layers ◽  
Composite Systems ◽  
Poly Ethylene

scholarly journals Controlled formation of Schottky diodes on n-doped ZnO layers by deposition of p-conductive polymer layers with oxidative chemical vapor deposition

Nano Express ◽  
2020 ◽  
Vol 1 (1) ◽  
pp. 010013 ◽  
Author(s):  
Linus Krieg ◽  
Zhipeng Zhang ◽  
Daniel Splith ◽  
Holger von Wenckstern ◽  
Marius Grundmann ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Schottky Diodes ◽  
Conductive Polymer ◽  
Chemical Vapor ◽  
Polymer Layers ◽  
Doped Zno

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Design and fabrication of conductive polymer hydrogels and their applications in flexible supercapacitors

2020 ◽  
Vol 8 (44) ◽  
pp. 23059-23095 ◽  
Author(s):  
Xinting Han ◽  
Guangchun Xiao ◽  
Yuchen Wang ◽  
Xiaona Chen ◽  
Gaigai Duan ◽  
...  
Keyword(s):  
Conductive Polymer ◽  
Polymer Hydrogels ◽  
Conductive Materials ◽  
Flexible Supercapacitors

Conductive polymer hydrogels, which combine the advantages of both polymers and conductive materials, have huge potential in flexible supercapacitors.

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