scholarly journals Experimental characterization of the radio channel for systems with large bandwidth and multiple antennas

2011 ◽  
Author(s):  
Concepción García Pardo
Keyword(s):  
Radio Channel ◽  
Multiple Antennas ◽  
Experimental Characterization ◽  
Large Bandwidth

Experimental Characterization of Indoor Mobile Radio Channel in 700 MHz Band

2018 ◽  
Author(s):  
L. G. Ribeiro ◽  
L. J. Matos ◽  
P.V.G. Castellanos ◽  
V. L. G. Costa ◽  
W. D. T. Meza
Keyword(s):  
Radio Channel ◽  
Mobile Radio ◽  
Experimental Characterization

Experimental characterization of a femtocell radio channel

2012 ◽  
Author(s):  
Joao C Braz ◽  
Pedro Gonzalez Castellanos ◽  
Carlos Rodriguez Ron ◽  
Luiz A R Ramirez ◽  
Leonardo Gonsioroski ◽  
...  
Keyword(s):  
Radio Channel ◽  
Experimental Characterization

Initial experimental characterization of the millimeter-wave radio channel

2012 ◽  
Author(s):  
Maria Teresa Martinez-Ingles ◽  
Concepcion Garcia-Pardo ◽  
Juan Pascual Garcia ◽  
Jose-Maria Molina-Garcia-Pardo ◽  
Jose-Victor Rodriguez ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Radio Channel ◽  
Experimental Characterization ◽  
Wave Radio

Experimental Characterization of UWB On-Body Radio Channel in Indoor Environment Considering Different Antennas

2010 ◽  
Vol 58 (1) ◽  
pp. 238-241 ◽  
Author(s):  
A. Sani ◽  
A. Alomainy ◽  
G. Palikaras ◽  
Y. Nechayev ◽  
Yang Hao ◽  
...  
Keyword(s):  
Indoor Environment ◽  
Radio Channel ◽  
Experimental Characterization

scholarly journals Experimental Characterization of Non-Stationary V2I Radio Channel in Tunnels

2020 ◽  
Author(s):  
Marwan Yusuf ◽  
Emmeric Tanghe ◽  
Luc Martens ◽  
Wout Joseph ◽  
Frederic Challita ◽  
...  
Keyword(s):  
Radio Channel ◽  
Experimental Characterization

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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