Polyetheretherketone Films with Low Thermal Expansion for Flexible Printed Circuit Boards

2008 ◽  
Vol 23 (1) ◽  
pp. 103-109 ◽  
Author(s):  
C. Seidel ◽  
H. Muenstedt
Keyword(s):  
Thermal Expansion ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Low Thermal Expansion ◽  
Flexible Printed Circuit

Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards

2020 ◽  
Vol 2020 (0) ◽  
pp. 0042
Author(s):  
Yohei Ito ◽  
Kenjiro Takanishi ◽  
Tatsuya Sakamoto ◽  
Keisuke Fujiwara ◽  
Hitoshi Arai
Keyword(s):  
Thermal Expansion ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
High Heat ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Low Thermal Expansion

Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)

2009 ◽  
Vol 85 (6) ◽  
pp. 341-350 ◽  
Author(s):  
Jong-Bum Lee ◽  
Ja-Myeong Koo ◽  
Jong-Woong Kim ◽  
Bo-In Noh ◽  
Jong-Gun Lee ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Ultrasonic Bonding ◽  
Conductive Film ◽  
Flexible Printed Circuit

Mechanical Test of FPCB and Failure Analysis by Simulation

2009 ◽  
Author(s):  
Jian Zhong ◽  
Ping Yang ◽  
Jian-ping Li ◽  
Hai-bo Sun ◽  
Quayle Chen ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Boards ◽  
Simulation Analysis ◽  
Mechanical Test ◽  
Mechanical Tests ◽  
Stress Distributions ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Depth Analysis ◽  
Flexible Printed Circuit

The paper mainly presented mechanical test and failure analysis methods to reliability study of a new FPCB (Flexible Printed Circuit Boards). Mechanical tests include flexural test, tensile test and flexural fatigue and ductility test. As to simulation analysis, the stress distributions of FPCB under bending and tensile conditions were gained by simulations. Through in-depth analysis of the testing results, the mechanical reliability of FPCB was known detailed. The research provides an approach to improve FPCB performance.

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

2008 ◽  
Vol 47 (5) ◽  
pp. 4300-4304 ◽  
Author(s):  
Jong-Bum Lee ◽  
Ja-Myeong Koo ◽  
Soon-Min Hong ◽  
Hyoyoung Shin ◽  
Young-jun Moon ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Ultrasonic Bonding ◽  
Flexible Printed Circuit

Polymerization of poly-(amic acid) ammonium salt in aqueous solution and its use in flexible printed circuit boards

2017 ◽  
Vol 96 ◽  
pp. 393-402 ◽  
Author(s):  
Zhibo Cao ◽  
Xiaogang Zhao ◽  
Daming Wang ◽  
Chunhai Chen ◽  
Chunyan Qu ◽  
...  
Keyword(s):  
Aqueous Solution ◽  
Ammonium Salt ◽  
Printed Circuit Boards ◽  
Amic Acid ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

2013 ◽  
Vol 655-657 ◽  
pp. 88-93 ◽  
Author(s):  
Luciano Arruda ◽  
Cristiano Coimbra ◽  
João Marco Andolfatto
Keyword(s):  
Strain Gauge ◽  
Strain Measurement ◽  
High Speed ◽  
Printed Circuit Boards ◽  
Direct Method ◽  
Indirect Measurement ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Polyimide Substrate ◽  
Flexible Printed Circuit

This work is related to reliability of strain measurement in flexible printed circuit boards (fPCBs) made with polyimide substrate. It was observed that the fPCBs are very sensitive to strain mounting stiffness. The indirect measurement method will be done employing High Speed Camera (HSP). The direct method will be formulated in two ways: 1) conventional strain gauge glued in an fPCBs; 2) printed strain gauge in a polyimide substrate. This paper will point out mistakes and show advantages when using different method to extract the deformation field of the selected area in a flexible thin film.

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