Electroless deposition of brushite (CaHPO4· 2H2O) crystals on Ti–6Al–4V at room temperature

2006 ◽  
Vol 97 (5) ◽  
pp. 639-644 ◽  
Author(s):  
A. Cuneyt Tas
Keyword(s):  
Room Temperature ◽  
Electroless Deposition

Planarized Copper Interconnects by Selective Electroless Plating

1992 ◽  
Vol 260 ◽  
Author(s):  
M. H. Kiang ◽  
J. Tao ◽  
W. Namgoong ◽  
C. Hu ◽  
M. Lieberman ◽  
...  
Keyword(s):  
High Frequency ◽  
Room Temperature ◽  
Electroless Deposition ◽  
Stress Testing ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Pulsed Dc ◽  
Seeding Method ◽  
Plasma Immersion Ion Implantation ◽  
Frequency Behavior

ABSTRACTElectroless deposition of planarized copper in SiO2 trenches has been carried out using Pd/Si plasma immersion ion implantation (PIII) or Pd2Si deposition to form a seed layer at the bottom of trenches. Electrical resistivity of the plated Cu is < 2 μΩ-cm for both types of seeding layers. For the PHI seeding method, we found a threshold Pd dose of 2 ×l014/cm2 is required to initiate Cu plating, and RBS analysis confirms intermixing of Pd, Si, and SiO2 improves the adhesion of the plated Cu to SiO2. Electromigration tests show both void and hillock formation under accelerated current stress testing, with an activation energy of 0.8 eV for interconnect open failure. The DC and pulse-DC median-time-to-failure (MTF) of plated Cu are found to be about two orders of magnitude longer than that of Al-2%Si at 275°C, and about four orders of magnitude longer than that of Al-2%Si when extrapolated to room temperature. Pulsed DC electromigration stressing exhibits a transition from low to high frequency behavior around 900 kHz, indicating a vacancy relaxation time much shorter than that of Al. For bipolar AC stressing, the ratio MTFAC / MTFDC of Cu is much smaller than that of Al-2%Si, indicating a different void recovery mechanism for Cu.

Friction Coefficients and Wear Rates of MoS2/Cu, BN/Cu Composites

2008 ◽  
Vol 54 ◽  
pp. 174-179
Author(s):  
Takashi Hashimoto ◽  
Hitoshi Kohri ◽  
Atsushi Yumoto ◽  
Ichiro Shiota
Keyword(s):  
Room Temperature ◽  
Electroless Deposition ◽  
Solid Lubricant ◽  
Volume Fraction ◽  
Testing Machine ◽  
Hard Material ◽  
Dynamical Friction ◽  
Wear Rates ◽  
Lubricant Oil ◽  
Properties Of Composites

It is difficult to use an ordinary bearing in a vacuum and/or at a high temperature, because of evaporation or deterioration of the lubricant oil. A solid lubricant, MoS2 or BN, is promising in such condition. Recently, a thin solid lubricant film is often applied on a hard material by PVD or CVD. The thin film is, however, easily removed when the load or friction speed is too high. On the other hand, when the lubricant is dispersed in a matrix, the solid lubricant always exists even the surface of the bearing is worn out. The aim of this experiment is to examine friction properties of the composites. Cu was plated on the lubricant particles by electroless deposition. The lubricant volume fraction (hereafter Vf) was up to 30 vol%. The Cu plated lubricant powder was hot-pressed to form composites at 873 K under 30 MPa in a vacuum. Friction properties of composites were determined by using a ball-on-disk type testing machine. The test was performed either in air or in a vacuum without oil at the room temperature. The coefficients of dynamical friction of the composites were decreased by the lubricant in the air. The effect of the lubricant was much remarkable in vacuum. The wear rates of the composites were, however, larger than Cu in the air. On the contrary, the wear rates of the composites were much less than one of Cu in a vacuum.

Influence of Hf and H2O2 on Morphology of Silicon Formed by Ag Assisted Chemical Etching

2014 ◽  
Vol 953-954 ◽  
pp. 1045-1048
Author(s):  
Guo Feng Ma ◽  
Heng Ye ◽  
Hong Lin Zhang ◽  
Chun Lin He ◽  
Li Na Sun
Keyword(s):  
Silicon Substrate ◽  
Room Temperature ◽  
Electroless Deposition ◽  
Metal Salt ◽  
Substrate Surface ◽  
Volume Ratio ◽  
Type Silicon ◽  
P Type ◽  
Silicon Substrate Surface ◽  
Si Wafer

The Ag-assisted electroless etching of p-type silicon substrate in HF/H2O2solution at room temperature was investigated. In this work, the effects of HF, H2O2and their volume ratio on morphology and growth of p-type silicon substrate surface by using metal assisted etching were investigated in order to produce a highly efficient antireflecting structure. The Ag metal particles were deposited onto Si wafer by electroless deposition from a metal salt solution including HF. The experimental results show that the growth rate and morphology of the pores formed on the Ag metalized Si surfaces are strongly dependent on the volume ratio of HF and H2O2.

Electroless Deposition of Platinum Nanoparticles in Room-Temperature Ionic Liquids

Langmuir ◽  
2013 ◽  
Vol 29 (38) ◽  
pp. 11931-11940 ◽  
Author(s):  
Da Zhang ◽  
Takeyoshi Okajima ◽  
Dalin Lu ◽  
Takeo Ohsaka
Keyword(s):  
Ionic Liquids ◽  
Platinum Nanoparticles ◽  
Room Temperature ◽  
Electroless Deposition ◽  
Room Temperature Ionic Liquids

Electroless Deposition of III-V Semiconductor Nanostructures from Ionic Liquids at Room Temperature

2015 ◽  
Vol 54 (40) ◽  
pp. 11870-11874 ◽  
Author(s):  
Abhishek Lahiri ◽  
Natalia Borisenko ◽  
Mark Olschewski ◽  
René Gustus ◽  
Janine Zahlbach ◽  
...  
Keyword(s):  
Ionic Liquids ◽  
Room Temperature ◽  
Electroless Deposition ◽  
Semiconductor Nanostructures

A Trial of FGM Bearings with Solid Lubricant

2009 ◽  
Vol 631-632 ◽  
pp. 465-470
Author(s):  
Takashi Hashimoto ◽  
Hitoshi Kohri ◽  
Atsushi Yumoto ◽  
Ichiro Shiota
Keyword(s):  
Friction Surface ◽  
Room Temperature ◽  
Electroless Deposition ◽  
Solid Lubricant ◽  
Volume Fraction ◽  
Testing Machine ◽  
High Load ◽  
Lubricant Oil ◽  
The Matrix ◽  
Composite Bearing

It is difficult to use an ordinary plain bearing under a high load or at a high friction speed because lubricant oil is pushed out from the friction surface or deterioration of the lubricant oil is caused by heat of friction. A solid lubricant, MoS2, is promising in such condition. When the lubricant is dispersed in a matrix, the solid lubricant is always supplied from the matrix. Such a composite bearing needs a back metal to maintain its shape. The heat of friction may cause a crack between the bearing and the back metal due to thermal stress. A bearing with low coefficient of friction is necessary to decrease the heat of friction, and an FGM structure is also promising to decrease the stress. The aim of this experiment is to fabricate and to examine friction properties of the composites. Cu was plated on the lubricant particles by electroless deposition. The lubricant volume fraction (hereafter Vf) was up to Vf 30 %. The Cu plated lubricant particles were hot-pressed to form a composite at 873 K under 30 MPa in a vacuum. Friction properties of the composites were determined by using a ball-on-disk type testing machine. The test was performed in the air without oil at room temperature. The solid lubricant in the composites was effective to decrease the coefficients of friction under a high load when the Vf was higher than 20 %.

Room-temperature electroless deposition of high-coercivity Co-Ni-P films

1993 ◽  
Vol 120 (1-3) ◽  
pp. 338-341 ◽  
Author(s):  
H. Matsuda ◽  
G.A. Jones ◽  
O. Takano ◽  
P.J. Grundy
Keyword(s):  
Room Temperature ◽  
Electroless Deposition ◽  
High Coercivity
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