scholarly journals Microstructural characterisation and thermal stability of a metastable Mg-8.6 wt.% Zr alloy produced by physical vapour deposition

2003 ◽  
Vol 94 (8) ◽  
pp. 880-885 ◽  
Author(s):  
G. Garcés ◽  
J. M. Antoranz ◽  
P. Pérez ◽  
J. M. Badía ◽  
S. B. Dodd ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Vapour Deposition ◽  
Physical Vapour Deposition ◽  
Microstructural Characterisation ◽  
Thermal Stability Of ◽  
Zr Alloy

Microstructure and thermal stability of nanocrystalline Mg-Gd-Y-Zr alloy processed by high pressure torsion

2017 ◽  
Vol 721 ◽  
pp. 577-585 ◽  
Author(s):  
Lingling Tang ◽  
Yonghao Zhao ◽  
R.K. Islamgaliev ◽  
R.Z. Valiev ◽  
Y.T. Zhu
Keyword(s):  
Thermal Stability ◽  
High Pressure ◽  
High Pressure Torsion ◽  
Thermal Stability Of ◽  
Zr Alloy

Influence of Temperature of Severe Plastic Deformation and Aging on Microstructure, Mechanical Properties and Electrical Conductivitiy of the Cu-Cr-Zr Alloy

2018 ◽  
Vol 385 ◽  
pp. 273-277
Author(s):  
Elena Sarkeeva ◽  
Marina M. Abramova ◽  
Igor V. Alexandrov
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Plastic Deformation ◽  
Severe Plastic Deformation ◽  
Room Temperature ◽  
High Pressure Torsion ◽  
Influence Of Temperature ◽  
Annealed Copper ◽  
Thermal Stability Of ◽  
Zr Alloy

The article studies an influence of temperature of severe plastic deformation (SPD) and post-deformation heat treatment on microstructure, mechanical properties and thermal stability of the Cu-0.5Cr-0.2Zr alloy. The results demonstrate that strength is considerably increased to 900 MPa by high pressure torsion (HPT) at room temperature. Subsequent ageing at 450 °С during 1 hour leads to a decay of solid solution and an allocation of dispersion particles that further incrises strength to 900 MPa, restores electrical conductivity to 70% IACS (International annealed copper standard) and enhances thermal stability of the alloy. When deformation temperature is increased to 300°С, strength is 690 MPa that is lower than in the case of deformation at room temperature that is related to reversion process at deformation. Additional a aging does not lead to an increase of strength characteristics.

Study of the Adhesion and the Thermal Stability of CrN and CrAlN Thin Films

2011 ◽  
Vol 227 ◽  
pp. 168-172
Author(s):  
Fatima Zohra Mammeri ◽  
Lounis Chekour ◽  
Nadjet Rouag
Keyword(s):  
Thermal Stability ◽  
Vapour Deposition ◽  
Annealing Temperature ◽  
Morphological Characterization ◽  
Thin Layers ◽  
Good Thermal Stability ◽  
Physical Chemical ◽  
Thermal Stability Of ◽  
Lower Adherence

The chromium nitride thin layers have became more and more popular in the last decade because of their good physical, chemical and mechanical properties. The present study deals the morphological characterization of hard Cr-N and CrAlN thin layers deposited on silicon (100) substrates by physical vapour deposition (PVD). The effect of the annealing temperature on the adherence and the thermal stability of CrN layers are considered. SEM observations and EDS microanalyses were performed. Cr-N films, 1μm thick, were annealed for 1 hour at 600 to 1000°C under flux of nitrogen. These layers presented a good thermal stability at low temperatures. Moreover SEM observations showed that the CrN films had a low adhesion at high temperatures. In addition, after annealing at 700°C for 4 hours, CrAlN coating of 1μm thickness presents a better thermal stability than CrN coating but with lower adherence. The results given by SEM-EDS and XRD are compared.

Structure, Properties and Thermal Stability of Utra-Fine Grained Cu-Cr-Zr Alloy

2013 ◽  
pp. 351-360
Author(s):  
A. Vinogradov ◽  
Y. Suzuki ◽  
V. Patlan ◽  
K. Kitagawa ◽  
V. I. Kopylov
Keyword(s):  
Thermal Stability ◽  
Fine Grained ◽  
Thermal Stability Of ◽  
Zr Alloy ◽  
Structure Properties

Effect of Bi Addition on Thermal Stability and Tensile Ductility of Mg-3%Zn-0.4%Zr Alloy

2010 ◽  
Vol 654-656 ◽  
pp. 647-650
Author(s):  
Joong Hwan Jun ◽  
Min Ha Lee
Keyword(s):  
Thermal Stability ◽  
Tensile Strength ◽  
Elevated Temperature ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Tensile Ductility ◽  
Grain Structure ◽  
Hot Rolled ◽  
Thermal Stability Of ◽  
Zr Alloy

Thermal stability of  grains and tensile ductilities at room and elevated temperatures were investigated and compared for Mg-3%Zn-0.4%Zr and Mg-3%Zn-0.4%Zr-1%Bi alloys in hot-rolled state. The Bi-added alloy showed slightly finer-grained microstructure with enhanced thermal stability, which is closely associated with fine Mg-Bi compounds acting as obstacles for the migration of grain boundaries. The Mg-3%Zn-0.4%Zr-1%Bi alloy exhibited better tensile strength at room temperature and tensile ductilities at elevated temperature. Finer and more homogeneous grain structure with higher thermal stability would be responsible for the enhanced tensile properties in the Bi-added alloy.

Comparison of Growth and Microstructure of Copper Films Deposited From Different Cu(Ii) Precursors

1994 ◽  
Vol 337 ◽  
Author(s):  
J. Goswami ◽  
S.A. Shivashankar ◽  
Lakshmi Raghunathan ◽  
Anjana Devi ◽  
K.V. Ramanathan
Keyword(s):  
Thermal Stability ◽  
Growth Rate ◽  
Deposition Temperature ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Copper Films ◽  
High Quality ◽  
Thermally Activated ◽  
Thermal Stability Of ◽  
Lower Resistivity

ABSTRACTHigh quality copper thin films have been obtained by low pressure thermally-activated chemical vapour deposition from two different Cu(II) metalorganic precursors, (a) bis(dipivaloyl-methanato) Cu (II) or Cu(dpm)2 and (b) bis(t-butylaceto acetato)Cu(II) or Cu(tbaoac)2, the latter synthesised with a view to reducing the deposition temperature. A comparative study of the volatility and thermal stability of the two precursors, as well as of the growth and microstructure of copper films from these two precursors, is presented.While the threshold deposition temperature is significantly lower for Cu(tbaoac)2 compared to Cu(dpm)2, the growth rate is considerably higher with Cu(dpm)2-Films obtained from Cu(tbaoac)2 are denser and of lower resistivity at a given thickness compared to those from Cu(dpm)2, and are also smoother, exhibiting mirror-like reflectivity.

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