High-Temperature Stress and Strain Partitioning in Duplex Stainless Steel

2002 ◽  
Vol 93 (3) ◽  
pp. 236-243 ◽  
Author(s):  
L. Duprez ◽  
B. C. De Cooman ◽  
N. Akdut
Keyword(s):  
Stainless Steel ◽  
High Temperature ◽  
Duplex Stainless Steel ◽  
Temperature Stress ◽  
High Temperature Stress ◽  
Stress And Strain ◽  
Strain Partitioning

Assessment of wheat (Triticum aestivum L.) genotypes for high temperature stress tolerance using physico-chemical analysis

2020 ◽  
Vol 53 (2) ◽  
Author(s):  
Khalil Ahmed Laghari ◽  
Abdul Jabbar Pirzada ◽  
Mahboob Ali Sial ◽  
Muhammad Athar Khan ◽  
Jamal Uddin Mangi
Keyword(s):  
Triticum Aestivum ◽  
High Temperature ◽  
Chemical Analysis ◽  
Stress Tolerance ◽  
Temperature Stress ◽  
Triticum Aestivum L ◽  
High Temperature Stress ◽  
Physico Chemical

Genome-wide identification and analysis of maize PAL gene family and its expression profile in response to high-temperature stress

2020 ◽  
Vol 52 (5) ◽  
Author(s):  
De-Gong Wu ◽  
Qiu-Wen Zhan ◽  
Hai-Bing Yu ◽  
Bao-Hong Huang ◽  
Xin-Xin Cheng ◽  
...  
Keyword(s):  
High Temperature ◽  
Gene Family ◽  
Temperature Stress ◽  
Expression Profile ◽  
High Temperature Stress ◽  
Genome Wide

ZERON 100

Alloy Digest ◽  
1993 ◽  
Vol 42 (11) ◽  
Keyword(s):  
Fracture Toughness ◽  
Stainless Steel ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Duplex Stainless Steel ◽  
Heat Treating ◽  
Super Duplex Stainless Steel ◽  
Corrosion Performance ◽  
Temperature Performance ◽  
Offshore Oil

Abstract ZERON 100 is a super duplex stainless steel which is manufactured to give a guaranteed corrosion performance by using an equation to control the chemistry in those elements which will determine the corrosion resistance of the material. Major usages in seawater applications, particularly offshore oil gathering systems. This datasheet provides information on composition, hardness, and tensile properties as well as fracture toughness. It also includes information on low and high temperature performance as well as heat treating, machining, and joining. Filing Code: SS-555. Producer or source: Weir Material Services Ltd.

ATI 2102

Alloy Digest ◽  
2015 ◽  
Vol 64 (5) ◽  
Keyword(s):  
Stainless Steel ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Duplex Stainless Steel ◽  
Tensile Properties ◽  
Heat Treating ◽  
Temperature Performance

Abstract ATI 2102 is a lean austenitic/ferritic duplex stainless steel. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, and joining. Filing Code: SS-1207. Producer or source: Allegheny Ludlum.

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

Effect of high temperature stress on seed filling and nutritional quality of rice (Oryza sativa L.)

2020 ◽  
Vol 16 (2) ◽  
pp. 18-23
Author(s):  
K. PRAVALLIKA ◽  
C. ARUNKUMAR ◽  
A. VIJAYKUMAR ◽  
R. BEENA ◽  
V. G. JAYALEKSHMI
Keyword(s):  
Oryza Sativa ◽  
High Temperature ◽  
Temperature Stress ◽  
Nutritional Quality ◽  
High Temperature Stress ◽  
Seed Filling
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