Digital data for volcano hazards of the Three Sisters region, Oregon

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
W.E. Scott ◽  
R.M. Iverson
Keyword(s):  
Digital Data ◽  
Volcano Hazards ◽  
Three Sisters

Digital data for volcano hazards in the Mount Jefferson Region, Oregon

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
J.S. Walder ◽  
C.A. Gardner ◽  
R.M. Conrey ◽  
...  
Keyword(s):  
Digital Data ◽  
Volcano Hazards

Digital Data for Volcano Hazards of the Mount Hood Region, Oregon

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
W.E. Scott ◽  
T.C. Pierson ◽  
J.E. Costa ◽  
...  
Keyword(s):  
Digital Data ◽  
Volcano Hazards ◽  
Mount Hood

Digital data for volcano hazards at Newberry Volcano, Oregon

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
D.R. Sherrod ◽  
L.G. Mastin ◽  
W.E. Scott
Keyword(s):  
Digital Data ◽  
Newberry Volcano ◽  
Volcano Hazards

Digital Data for Volcano Hazards from Mount Rainier, Washington, Revised 1998

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
R.P. Hoblitt ◽  
J.S. Walder ◽  
C.L. Driedger ◽  
...  
Keyword(s):  
Digital Data ◽  
Mount Rainier ◽  
Volcano Hazards

Digital data for volcano hazards in the Crater Lake Region, Oregon

2008 ◽  
Author(s):  
S.P. Schilling ◽  
S. Doelger ◽  
C.R. Bacon ◽  
L.G. Mastin ◽  
K.E. Scott ◽  
...  
Keyword(s):  
Crater Lake ◽  
Digital Data ◽  
Lake Region ◽  
Volcano Hazards

scholarly journals Volcano hazards in the Three Sisters region, Oregon

2001 ◽  
Author(s):  
William E. Scott ◽  
R.M. Iverson ◽  
S.P. Schilling ◽  
B.J. Fisher
Keyword(s):  
Volcano Hazards ◽  
Three Sisters

Practical applications of scanning tunneling microscopy

1989 ◽  
Vol 47 ◽  
pp. 18-19
Author(s):  
D. R. Denley
Keyword(s):  
High Resolution ◽  
Scanning Tunneling Microscopy ◽  
Quantitative Information ◽  
Digital Data ◽  
Scanning Tunneling ◽  
Ambient Atmosphere ◽  
Tunneling Microscopy ◽  
Clear Trend ◽  
Practical Applications ◽  
Promising Tool

Scanning tunneling microscopy (STM) has recently been introduced as a promising tool for analyzing surface atomic structure. We have used STM for its extremely high resolution (especially the direction normal to surfaces) and its ability for imaging in ambient atmosphere. We have examined surfaces of metals, semiconductors, and molecules deposited on these materials to achieve atomic resolution in favorable cases.When the high resolution capability is coupled with digital data acquisition, it is simple to get quantitative information on surface texture. This is illustrated for the measurement of surface roughness of evaporated gold films as a function of deposition temperature and annealing time in Figure 1. These results show a clear trend for which the roughness, as well as the experimental deviance of the roughness is found to be minimal for evaporation at 300°C. It is also possible to contrast different measures of roughness.

Convergent-beam thickness determination: The advantages of digital imaging

1994 ◽  
Vol 52 ◽  
pp. 420-421
Author(s):  
Stuart McKernan ◽  
C. Barry Carter
Keyword(s):  
Intensity Variation ◽  
Convergent Beam Electron Diffraction ◽  
Digital Data ◽  
Thickness Determination ◽  
Frequent Use ◽  
Automated Processing ◽  
Beam Thickness ◽  
Convergent Beam ◽  
Remarkable Agreement

Convergent-beam electron diffraction (CBED) patterns contain an immense amount of information relating to the structure of the material from which they are obtained. The analysis of these patterns has progressed to the point that under appropriate, well specified conditions, the intensity variation within the CBED discs may be understood in a quantitative sense. Rossouw et al for example, have produced numerical simulations of zone-axis CBED patterns which show remarkable agreement with experimental patterns. Spence and co-workers have obtained the structure factor parameters for lowindex reflections using the intensity variation in 2-beam CBED patterns. Both of these examples involve the use of digital data. Perhaps the most frequent use for quantitative CBED analysis is the thickness determination described by Kelly et al. This analysis has been implemented in a variety of different ways; from real-time, in-situ analysis using the microscope controls, to measurements of photographic prints with a ruler, to automated processing of digitally acquired images. The potential advantages of this latter process will be presented.

Slow-scan CCD cameras and low-dose High-Resolution Electron Microscopy: Direct and quantitative

1994 ◽  
Vol 52 ◽  
pp. 412-413
Author(s):  
M. Pan
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Structural Damage ◽  
Low Dose ◽  
Dynamic Range ◽  
High Resolution Electron Microscopy ◽  
Operating Conditions ◽  
Digital Data ◽  
Ccd Cameras ◽  
Resolution Electron

It has been known for many years that materials such as zeolites, polymers, and biological specimens have crystalline structures that are vulnerable to electron beam irradiation. This radiation damage severely restrains the use of high resolution electron microscopy (HREM). As a result, structural characterization of these materials using HREM techniques becomes difficult and challenging. The emergence of slow-scan CCD cameras in recent years has made it possible to record high resolution (∽2Å) structural images with low beam intensity before any apparent structural damage occurs. Among the many ideal properties of slow-scan CCD cameras, the low readout noise and digital recording allow for low-dose HREM to be carried out in an efficient and quantitative way. For example, the image quality (or resolution) can be readily evaluated on-line at the microscope and this information can then be used to optimize the operating conditions, thus ensuring that high quality images are recorded. Since slow-scan CCD cameras output (undistorted) digital data within the large dynamic range (103-104), they are ideal for quantitative electron diffraction and microscopy.

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