MATHEMATICAL MODEL FOR PARTICLE MOTION APPLIED ON A MANURE SPREADING APPARATUS USED IN ENVIRONMENTALLY FRIENDLY TECHNOLOGY

2018 ◽  
Vol 17 (1) ◽  
pp. 217-227
Author(s):  
Vasilica Stefan ◽  
Petru Cardei ◽  
Valentin Nicolae Vladuf ◽  
Lucrefia Popa ◽  
Radu Ciuperca ◽  
...  
Keyword(s):  
Mathematical Model ◽  
Particle Motion ◽  
Environmentally Friendly

Modeling the Motion of Slurry Nanoparticles During Chemical Mechanical Polishing

Tribology ◽  
2005 ◽  
Author(s):  
Elon J. Terrell ◽  
Venkata K. Jasti ◽  
C. Fred Higgs
Keyword(s):  
Mathematical Model ◽  
Particle Motion ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Surface Wear ◽  
Particle Collisions ◽  
Nanoscale Particles ◽  
Interparticle Collisions ◽  
Global Surface

Chemical mechanical polishing (CMP) has emerged as a commonly used method for achieving global surface planarization of micro-/nano-scale systems during fabrication. During CMP, the wafer to be polished is pressed against a rotating polymeric pad that is flooded with slurry. The motion of the wafer surface against the asperities of the pad and the abrasive nanoscale particles in the slurry causes the surface of the wafer to be polished to an atomically smooth level. Past studies have shown that the wear distribution is a function of the distribution of slurry particles in the wafer/pad interface, and thus it is desirable to model the migration of particles in order to predict the wear of the wafer surface. The current study involves the creation and simulation of a mathematical model which predicts the paths of slurry particles in a Lagrangian reference frame. The model predicts the effects of the various forces on each particle to determine its motion. The model also accounts for interparticle collisions and wafer/particle and pad/particle collisions. It is expected that the particle motion that is predicted from this model will allow for a more accurate correlation of the wafer surface wear distribution.

scholarly journals Modeling of the management of the microwave grain drying process

2019 ◽  
Vol 110 ◽  
pp. 02142
Author(s):  
Sergey Morozov ◽  
Konstantin Kuzmin ◽  
Denis Pogodin ◽  
Lyudmila Kochetkova ◽  
Anna Rogozhina
Keyword(s):  
Mathematical Model ◽  
Technological Process ◽  
Environmentally Friendly ◽  
Drying Process ◽  
Grain Drying

The article discusses the VisSim program, which allows simulating microwave grain drying process. Its capabilities and methods of development are shown, the structure of a mathematical model for management of the drying process and individual blocks is provided. It is noted that offered modeling of the grain drying process makes it possible to evaluate it as a technological process, as well as to show the possibility of its optimization. It should be noted that this method is environmentally friendly and less energy intensive than others.

Dynamics of the Water-Pipeline-Soil Interaction

1982 ◽  
Vol 104 (4) ◽  
pp. 307-312 ◽  
Author(s):  
K. Karal ◽  
S. A. Halvorsen
Keyword(s):  
Mathematical Model ◽  
Dynamic Response ◽  
Particle Motion ◽  
Flexural Rigidity ◽  
Time Histories ◽  
Normal Water ◽  
Concrete Coating ◽  
Water Pipeline ◽  
The Mathematical Model ◽  
Oriented Approach

A design engineer-oriented approach to determining the pipeline dynamic response to ocean forces accounting for complex environmental and pipeline conditions is presented. The described analysis yields time histories of pipeline motion and steel pipe stresses induced by water motion. Sinusoidal variation of normal water particle motion in time and along the pipeline, waves, flexural rigidity of pipe, damaged concrete coating, among other effects, are accounted for in the mathematical model.

Mathematical model of hit phenomena and its application to movie advertisement

2008 ◽  
Author(s):  
Ishii Akira ◽  
Yoshida Narihiko ◽  
Hayashi Takafumi ◽  
Umemura Sanae ◽  
Nakagawa Takeshi
Keyword(s):  
Mathematical Model
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