A Hybrid Technique based on Standard SRS Modules for Software Requirement Prioritization

10.28945/2016 ◽  
2014 ◽  
Author(s):  
Khurram Shehzad ◽  
Mohammad Daud Awan ◽  
Sanam Shahla Rizvi ◽  
Malik Sikander Hayat Khiyal

Requirements Prioritization (RP) helps to discover the most desired requirements. System developers are not always fully able to implement stakeholders' requirements when time, scope and cost are limited. To solve this challenge, requirements must be prioritized. A few prioritization techniques have been proposed but nonehasbeen automated. Furthermore, rank reversals (updating rank status whenever requirements are added or deleted) is a major limitation of existing techniques. This paper uses AHP and Cost-Value methods for requirement prioritization while addressing rank reversal. The techniques are able to rank every requirement based on relative value and implementation cost. The AHP method allows an input from the system developers and system users and makes a pair wise comparison. The Cost value method ranks the requirements in terms of the ratio of value to cost. As requirements increases, human inconsistency in judgment increases. AHP calculates inconsistency and if it is less than 0.1 then stakeholders should consider new input values. The prioritization methods are implemented into a prioritization tool which creates a list of the prioritized requirements as output, then consequently generates a scatter plot to display relative values and implementation costs of input requirements. This tool is evaluated in terms of efficiency (total time taken for prioritization) and ease of use.


Author(s):  
Thomas M. Moore

In the last decade, a variety of characterization techniques based on acoustic phenomena have come into widespread use. Characteristics of matter waves such as their ability to penetrate optically opaque solids and produce image contrast based on acoustic impedance differences have made these techniques attractive to semiconductor and integrated circuit (IC) packaging researchers.These techniques can be divided into two groups. The first group includes techniques primarily applied to IC package inspection which take advantage of the ability of ultrasound to penetrate deeply and nondestructively through optically opaque solids. C-mode Acoustic Microscopy (C-AM) is a recently developed hybrid technique which combines the narrow-band pulse-echo piezotransducers of conventional C-scan recording with the precision scanning and sophisticated signal analysis capabilities normally associated with the high frequency Scanning Acoustic Microscope (SAM). A single piezotransducer is scanned over the sample and both transmits acoustic pulses into the sample and receives acoustic echo signals from the sample.


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