Engineering of a lapping machine with a cycloidal toolpath

2019 ◽  
pp. 54-59
Author(s):  
Karim Ravilevich Muratov ◽  
Evgeny Anatolyevich Gashev ◽  
Daria Petrovna Ismailova
Keyword(s):  
Lapping Machine

Analysis of structures of flat planting machines

2021 ◽  
Vol 13 (1) ◽  
pp. 140-148
Author(s):  
Andrіі Slabkyі ◽  
◽  
Olexandr Manzhilevskyy ◽  
Olexandr Polishchuk ◽  
◽  
...  
Keyword(s):  
Cutting Tool ◽  
Relative Movement ◽  
Statistical Parameters ◽  
Abrasive Finishing ◽  
Wide Range ◽  
Uneven Wear ◽  
Lapping Machine ◽  
Numerical Program ◽  
Hydraulic Pulse

One of the methods of material processing is considered, which allows to obtain high geometric accuracy and low surface roughness of parts, namely their abrasive finishing. The high quality of machining of parts in this way is due to the use of coordinated relative movement of the workpiece and the cutting tool. According to the kinematic features, most lapping machines can be divided into two groups: machines with oscillating working motion and machines with rotating lapping motion. The machines of the first group are more common due to the simplicity of their design and versatility. However, the possibility of their use is limited by the size range of the workpieces and uneven wear of the cutting tool and, as a consequence, the uneven surface treatment of the part. The machines of the second group are considered the most versatile, as they allow processing a wide range of parts, varying in shape and size, but they are also not without such a disadvantage as uneven wear of the cutting tool with all the corresponding consequences. Improving the efficiency of abrasive finishing by complicating the trajectory of the relative movement of the tool and the part, ie the formation of a unique mutual working movement of the lapping and the movement of the workpiece, is one of the most common areas. The main disadvantage of equipment that provides processing of parts on this principle is, in most cases, limited regulation of the operating parameters of the cutting process, so this area remains promising and has broad prospects for development. The constructive scheme of the hydraulic-pulse flat-lapping machine offered in work thanks to a combination of advantages of the hydraulic-pulse drive with use of numerical program control will allow to provide unique mutual multi-movement of preparation and the lapping tool with a possibility of adjustment of its parameters in the course of processing. Purposeful choice of the shape and density of the trajectory of the working movement of the tool will form a micro relief of the treated surface with the necessary statistical parameters and low roughness.

Study on Vibration Reduction of Finishing Lapping Machine for Bearing Race

2011 ◽  
Vol 199-200 ◽  
pp. 1496-1500
Author(s):  
Jia Man ◽  
Lian Hong Zhang ◽  
Yong Liang Chen
Keyword(s):  
Vibration Amplitude ◽  
Vibration Reduction ◽  
Experimental Studies ◽  
Machining Efficiency ◽  
Bearing Race ◽  
Excitation Force ◽  
Lapping Machine ◽  
Light Material ◽  
Vibration Performance

It is key to improve the machining efficiency of finishing lapping machine to restrain the vibration that raise with work speed. The vibration amplitude is influenced by the excitation force of unbalanced crank-rocker mechanism and the anti-vibration performance of guide. Following improving schemes as adding counterweight to crank-rocker mechanism, adopting the light material motion components and enhancing the anti-vibration performance of guide are proposed based on theoretical and experimental studies. The improving schemes are verified by the experiment.

The effects of lapping load in finishing advanced ceramic balls on a novel eccentric lapping machine

2005 ◽  
Vol 219 (7) ◽  
pp. 505-513 ◽  
Author(s):  
J Kang ◽  
M Hadfield
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Contact Fatigue ◽  
Rolling Contact ◽  
Flat Bottom ◽  
Load Range ◽  
Advanced Ceramic ◽  
Stress Cycles ◽  
Lapping Machine

Hot isostatically pressed silicon nitride ball blanks were lapped from a diameter of 13.255 mm to a diameter of 12.7 mm by a novel eccentric lapping machine. A maximum material removal rate of 68 μm/h has been achieved under a nominal lapping load of 43 N per ball. It was found that the material removal rate increased almost linearly with the lapping load within this load range. When the lapping load was higher than 43 N per ball, the material removal rate started to drop and the lapped ball roundness error started to increase. At the highest nominal lapping load of 107 N per ball, surface damage and subsurface damage were found on the lapped balls. Because of the eccentric loading effect, the actual load on an individual ball could be 25–28 per cent higher than the nominal lapping load. The surface residual stresses of lapped balls under different lapping loads were measured, and it was found that the lapping load had less effect than the previous hot isostatic pressing process. Rolling contact fatigue tests were conducted on balls lapped at nominal loads of 43 and 107 N per ball. No failure occurred on the ball lapped at 43 N per ball after 138 × 106 stress cycles. The ball lapped at 107 N per ball failed after 13.3 x 106 stress cycles with a shallow spall with a flat bottom inside. This research suggests that the lapping load for advanced ceramic balls in conventional concentric lapping could be doubled from 20 to 40 N per ball without degrading the surface quality of lapped balls.

Influence of Flat Lapping Kinematics on Machinability of Ceramics

2013 ◽  
Vol 199 ◽  
pp. 615-620
Author(s):  
Adam Barylski ◽  
Mariusz Deja
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Shape Error ◽  
Roughness Parameters ◽  
Tool Wear Estimation ◽  
Machine Configuration ◽  
Lapping Machine

New tools for flat grinding of ceramics (Al2O3) are presented in the paper. Electroplated CBN tools (B64 and B107) were used in a modified single-disc lapping machine configuration. The results from experiments, such as the material removal rate and surface roughness parameters are presented and analyzed. Numerical simulations, based on the model for the shape error and tool wear estimation in machining with flat lapping kinematics, are also presented. The tool life of electroplated tools can be extended by choosing appropriate parameter K related to the process kinematics.

Study the Properties of Abrasive Stone for Aluminum Grinding

2015 ◽  
Vol 754-755 ◽  
pp. 688-692
Author(s):  
Nurul Syafiqah Hasni ◽  
Noorina Hidayu Jamil ◽  
Abdullah Chik ◽  
Wi Wan Mohd Arif ◽  
Hong Eng Seong
Keyword(s):  
Hard Disk Drive ◽  
Disk Drive ◽  
Grinding Process ◽  
Ftir Analysis ◽  
Thermosetting Resin ◽  
Magnetic Substrate ◽  
Soft Spot ◽  
Lapping Machine ◽  
Abrasive Stone ◽  
Grinding Stone

A doubled-sided lapping machine of grinding stone manufactured of a SiC as an abrasive, specific resin and other thermosetting resin were developed for grinding process of the substrate of hard disk drive (HDD) made up of aluminum since the conventional lapping machine cause the serious quality problem of the magnetic substrate. However, at certain parameter during the grinding process, the abrasive stone was clogging due to the agglomeration of debris from the substrate which cause scratches on the magnetic substrates and affect its performance. The samples were classified into four parts (soft spot, border spot, hard spot, and unused spot). Characterizations of the samples were done using XRF, SEM and FTIR analysis. Based on all the above analysis, it can conclude that the porosity of the stone were not homogeneous and the percentage of Al was highest at the border spot which shows that, the area at the border spot cause the clogging to occur thus produces the hard spot that will damage the magnetic substrate during grinding process.

Machining Mechanism of Diamond Fibers Cutter

2011 ◽  
Vol 487 ◽  
pp. 352-356
Author(s):  
Gao Feng Zhang ◽  
Yuan Qiang Tan ◽  
B. Zhang ◽  
Zhao Hui Deng
Keyword(s):  
Aluminum Alloy ◽  
Cutting Force ◽  
Nd:Yag Laser ◽  
Cutting Tools ◽  
Polycrystalline Diamond ◽  
Soft Materials ◽  
Advanced Materials ◽  
Force Analysis ◽  
Machining Mechanism ◽  
Lapping Machine

A novel diamond fibers cutter was proposed in this paper for machining of advanced materials. The fibers cutter was prepared by artificially distributing and orientating a large number of diamond fibers, which were prepared by cutting polycrystalline diamond into size of 0.4mm*0.6mm*10mm using Nd:YAG laser, and then lapped on a lapping machine to form sharpened cutting edges. To investigate the machining mechanism of the diamond fibers cutter, an experiment on machining of aluminum alloy reinforced by SiC particles and nano-structured WC/Co coating was conducted in this paper. Based on the surface observation and the cutting force analysis, it could be found that the diamond fibers cutter combined the advantages of conventional wheels and cutting tools, and was fit for machining of both brittle materials and soft materials.

Microgrinding with Diamond Electroplated Tools and with Single-Disk Lapping Kinematics

2016 ◽  
Vol 831 ◽  
pp. 25-32
Author(s):  
Adam Barylski ◽  
Mariusz Deja
Keyword(s):  
Material Removal ◽  
Removal Rate ◽  
Pull Out ◽  
Ceramic Samples ◽  
Tool Surface ◽  
Single Disk ◽  
The Subject ◽  
Machine Configuration ◽  
Lapping Machine ◽  
Electroplated Tool

New tools for flat grinding are the subject of the paper. Electroplated diamond tools with different grains - D64 and D107 - were used in a modified single-disc lapping machine configuration. The results from flat grinding, such as the material removal rate (MMR), surface roughness and plane-parallelism are presented in the paper. Apart from ceramic samples, the additional experiments were carried out on cemented carbide workpieces (H10S) with the use of a diamond electroplated tool (D64). SEM microscopic images of unworn and worn active tool surface are presented with abrasive grains worn by attrition and cavities in the nickel bond after the grains pull out.

Effect of Double Sided Process Parameters in Lapping Silicon Wafer

2013 ◽  
Vol 393 ◽  
pp. 259-265 ◽  
Author(s):  
Abdul Rahim Mahamad Sahab ◽  
Nor Hayati Saad ◽  
Amirul Abdul Rashid ◽  
Yusoff Noriah ◽  
Nassya Mohd Said ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Process Parameters ◽  
Integrated Circuit ◽  
Quality Standard ◽  
Wafer Surface ◽  
Thickness Variation ◽  
Total Thickness ◽  
Hard And Brittle Material ◽  
Total Thickness Variation ◽  
Lapping Machine

Silicon wafer is widely used in semiconductor industries for development of sensors and integrated circuit in computer, cell phones and wide variety of other devices. Demand on the device performance requires flatter wafer surface, and less dimensional wafer variation. Prime silicon wafer is hard and brittle material. Due to its properties, double sided lapping machine with ceramic grinding agent were introduced for machining high quality standard silicon wafers. The main focus is the silicon wafer with high accuracy of flatness; to reduce total thickness variation, waviness and roughness. In this paper the lapping experiment and analysis showed that the double sided lapping machine is able to produce total thickness variation less than 10 um at controlled process parameters within short processing time. Machining using low mode method reduced the total thickness variation (TTV) value. The lapping load and speed directly reflected the performance and condition of final silicon wafer quality.

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