FULL-WAVE MODELING OF MULTIPLE VIAS USING DIFFERENTIAL SIGNALING AND SHARED ANTIPAD IN MULTILAYERED HIGH SPEED VERTICAL INTERCONNECTS

A fast full-wave modeling methodology for stripline structures with vertical interconnects in multi-layer dielectrics

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) ◽

10.1109/ectc.2004.1319342 ◽

2004 ◽

Cited By ~ 1

Author(s):

K. Nikellis ◽

Y. Koutsoyannopoulos ◽

S. Bantas ◽

N.K. Uzunoglu

Keyword(s):

Wave Modeling ◽

Modeling Methodology ◽

Full Wave ◽

Vertical Interconnects

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High speed single-ended bus: Full-wave modeling methodology and correlation

2013 IEEE International Symposium on Electromagnetic Compatibility ◽

10.1109/isemc.2013.6670480 ◽

2013 ◽

Cited By ~ 2

Author(s):

Mauro Lai ◽

Darryl Kostka ◽

Jonathan Casanova ◽

Madhumitha Seshadhri

Keyword(s):

High Speed ◽

Wave Modeling ◽

Modeling Methodology ◽

Full Wave

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A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures

International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. ◽

10.1109/sispad.2003.1233632 ◽

2003 ◽

Cited By ~ 29

Author(s):

D. Jiao ◽

M. Mazumder ◽

S. Chakravarty ◽

C. Dai ◽

M.J. Kobrinsky ◽

...

Keyword(s):

High Speed ◽

Large Scale ◽

Three Dimensional ◽

Wave Modeling ◽

Novel Technique ◽

Full Wave

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Extraction of a SPICE via model from full-wave modeling for differential signaling

2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) ◽

10.1109/isemc.2004.1349862 ◽

2004 ◽

Author(s):

Shaofeng Luan ◽

G. Selli ◽

J.L. Drewniak ◽

A. De Luca ◽

G. Antonini ◽

...

Keyword(s):

Wave Modeling ◽

Full Wave ◽

Differential Signaling

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An efficient current expansion technique in full-wave modeling of microstrip discontinuities of arbitrary shape

Proceedings of 1997 Asia-Pacific Microwave Conference ◽

10.1109/apmc.1997.654632 ◽

2002 ◽

Author(s):

Tzyy-Sheng Horng

Keyword(s):

Arbitrary Shape ◽

Wave Modeling ◽

Full Wave ◽

Expansion Technique ◽

Microstrip Discontinuities

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A unified finite-element solution from zero frequency to microwave frequencies for full-wave modeling of large-scale three-dimensional on-chip interconnect structures

2008 IEEE Antennas and Propagation Society International Symposium ◽

10.1109/aps.2008.4618921 ◽

2008 ◽

Author(s):

Jianfang Zhu ◽

Dan Jiao

Keyword(s):

Finite Element ◽

Large Scale ◽

Three Dimensional ◽

Finite Element Solution ◽

Element Solution ◽

Wave Modeling ◽

Microwave Frequencies ◽

Full Wave ◽

On Chip ◽

Zero Frequency

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Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) ◽

10.1109/edaps.2013.6724437 ◽

2013 ◽

Author(s):

Sumin Choi ◽

Heegon Kim ◽

Sukjin Kim ◽

Daniel H. Jung ◽

Joungho Kim ◽

...

Keyword(s):

High Speed ◽

Differential Signaling

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Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) ◽

10.1109/emccompo.2013.6735163 ◽

2013 ◽

Cited By ~ 1

Author(s):

Heegon Kim ◽

Jonghyun Cho ◽

Daniel H. Jung ◽

Jonghoon J. Kim ◽

Sumin Choi ◽

...

Keyword(s):

High Speed ◽

Differential Signaling

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Full‐wave modeling of EMIC waves near the He + gyrofrequency

Geophysical Research Letters ◽

10.1002/2015gl066978 ◽

2016 ◽

Vol 43 (1) ◽

pp. 13-21 ◽

Cited By ~ 19

Author(s):

Eun‐Hwa Kim ◽

Jay R. Johnson

Keyword(s):

Wave Modeling ◽

Full Wave ◽

Emic Waves

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A Practical Approach to Analyze Copper Surface Roughness Effects with Applications to Stripline Structures

International Symposium on Microelectronics ◽

10.4071/isom-2012-thp22 ◽

2012 ◽

Vol 2012 (1) ◽

pp. 001068-001072

Author(s):

Xichen Guo ◽

Ji Chen ◽

David R. Jackson ◽

Marina Y. Koledintseva ◽

James Drewniak ◽

...

Keyword(s):

Surface Impedance ◽

High Speed ◽

Propagation Constant ◽

Practical Method ◽

Copper Surface ◽

Metal Foil ◽

Roughness Effects ◽

Full Wave ◽

Surface Wave Propagation ◽

Conductor Loss

Conductor loss due to the roughened metal foil surface has significant effects on high-speed signals propagation on backplane traces designed for 10+ Gbps network. A practical method to evaluate these effects, including the signal attenuation and the propagation phase velocity, is proposed in this paper. A periodic structure is assumed to model the morphology of the roughness profile. The equivalent surface impedance is extracted from the grating surface wave propagation constant to model the roughness. This modified surface impedance can hence be used in the traditional attenuation constant formula to calculate the actual conductor loss. This approach is validated using both full-wave simulation tool and measurement, and is shown to be able to provide robust result within 0.2 dB/m relative error.

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