Pressure Buildup or Falloff Test Analysis for a Well in Commingled Reservoirs with Flow Rate Profile Logging

Author(s):  
Jia En Lin
ACS Omega ◽  
2020 ◽  
Vol 5 (41) ◽  
pp. 26955-26955
Author(s):  
Hongwen Luo ◽  
Beibei Jiang ◽  
Haitao Li ◽  
Ying Li ◽  
Zhangxin Chen

2014 ◽  
Vol 191 (4S) ◽  
Author(s):  
Sean McAdams ◽  
Fluvio Lobo ◽  
Carly Aho ◽  
Joseph Mein ◽  
Linden Vander-Linden ◽  
...  
Keyword(s):  

Author(s):  
Muhammad Dimas Adiguna ◽  
Muhammad Taufiq Fathaddin ◽  
Hari Karyadi Oetomo

<p>Well test analysis was conducted to determine the characteristics of reservoir rocks. From the well test analysis it is obtained information such as permeability and skin factor. The skin factor is a quantity indicating the presence of disturbance in the formation as a result of drilling operations, production operations, perforating casing, gravel pack installation, remedial well work, acidizing operation, and hydraulic fracture operation. The objective of this research is to determine the relationship of multi rate test method of Jones, Blount, and Glaze and the comparison result among pressure buildup test and pressure drawdown test analyses, using Kappa software or manually calculation. Therefore, in this paper will study the method of Jones, Blount, and Glaze and the well test analyses to determine further work of the wells on block X. The data used in this paper is secondary data, namely the results of well test from three wells.Applying drawdown test analysis of A, Y, and Z wells yield skin factor values of 3.37; 27.10; and -1.39. Where in buildup pressure Horner method analysis of A, Y, and Z wells yield skin factor values of 16.10; 11.18; and -2.07. In the method of type curve derivatives the drawdown analysis of A, Y, and Z wells yield skin factor values of 7.04; 11.18; and 4.20. The analysis of pressure buildup, of A, Y, and Z wells yield skin factor value of 25.11; 14.47; and 1.93. In the analysis using <br /> Kappa software of A, Y, and Z wells yield skin factor values of 5.56; 10.2; and 2.00. The skin results of these wells indicate the formation damages. The Short Term Multiple Rate Flow Tests analysis using Jones, Blount, and Glaze method from the plots of Δp/q versus oil flow rate (q) are b’ high and b’/b low. These indicate that the three wells are encountering formation damages. The Jones, Blount, and Glaze method as well as the pressure buildup and pressure drawdown test analyses in block X indicate that these wells require to be stimulated.</p>


1972 ◽  
Author(s):  
Hossein Kazemi

Abstract Two simple and equivalent procedures are suggested for improving the calculated average reservoir pressure from pressure buildup tests of liquid or gas wells in developed reservoirs. These procedures are particularly useful in gas well test analysis irrespective of gas composition, in reservoirs with pressure-dependent permeability and porosity, and in oil reservoirs where substantial gas saturation has been developed. Long-term production history need not be known. Introduction For analyzing pressure buildup data with constant flowrate before shut in, two plotting procedures are mostly used: The Miller-Dyes-Hutchinson (MDH) plot (1,8) and the Horner plot (2,8). The Miller-Dyes-Hutchinson plot is a plot of pws vs log Δt. The Horner plot consists of plotting the bottom hole shut-in pressure, pws vs log [(tp + Δt)/Δt]. Δt is the shut-in time and tp is a pseudo-production time equal to the ratio of total produced fluid and the last stabilized flowrate prior to shut in. This method was first used by Theis (3) in the water industry.


2014 ◽  
Vol 778-780 ◽  
pp. 738-741 ◽  
Author(s):  
Dairi Yajima ◽  
Hitoshi Habuka ◽  
Tomohisa Kato

A SiC dry etching reactor using chlorine trifluoride (ClF3) gas was designed and evaluated with the help of numerical calculations and experimental results. The etching rate was about 16 μm/min when the ClF3 gas concentration, the total flow rate and the SiC substrate temperature were 90%, 0.3 slm and 500 °C, respectively. The gas stream above the substrate surface was concluded to significantly affect the etching rate profile.


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