Theory and Experimental Setup of the New Rise In Core Reservoir Wettability Measurement Technique

2014 ◽  
Author(s):  
Shawket G. Ghedan ◽  
Celal Hakan Canbaz
Keyword(s):  
Measurement Technique ◽  
Experimental Setup ◽  
Reservoir Wettability ◽  
Wettability Measurement

scholarly journals TRAJECTORY BASED 3D FRAGMENT TRACKING IN HYPERVELOCITY IMPACT EXPERIMENTS

2018 ◽  
Vol XLII-2 ◽  
pp. 1175-1181 ◽  
Author(s):  
E. Watson ◽  
H.-G. Maas ◽  
F. Schäfer ◽  
S. Hiermaier
Keyword(s):  
Measurement Technique ◽  
Experimental Measurement ◽  
High Speed ◽  
Space Debris ◽  
Hypervelocity Impact ◽  
Experimental Setup ◽  
Velocity Data ◽  
Hypervelocity Impacts ◽  
Impact Experiment ◽  
Impact Experiments

Collisions between space debris and satellites in Earth’s orbits are not only catastrophic to the satellite, but also create thousands of new fragments, exacerbating the space debris problem. One challenge in understanding the space debris environment is the lack of data on fragmentation and breakup caused by hypervelocity impacts. In this paper, we present an experimental measurement technique capable of recording 3D position and velocity data of fragments produced by hypervelocity impact experiments in the lab. The experimental setup uses stereo high-speed cameras to record debris fragments generated by a hypervelocity impact. Fragments are identified and tracked by searching along trajectory lines and outliers are filtered in 4D space (3D + time) with RANSAC. The method is demonstrated on a hypervelocity impact experiment at 3.2 km/s and fragment velocities and positions are measured. The results demonstrate that the method is very robust in its ability to identify and track fragments from the low resolution and noisy images typical of high-speed recording.

Jitter measurement technique for image converter streak cameras

2020 ◽  
pp. 33-37
Author(s):  
M. V. Kanzyuba ◽  
V. B. Lebedev
Keyword(s):  
Measurement Technique ◽  
Optical Signal ◽  
Process Research ◽  
Experimental Setup ◽  
Customer Requirements ◽  
Image Converter ◽  
Linear Sweep ◽  
Fast Process ◽  
Jitter Measurement

The phenomenon of jitter is considered for image converter streak cameras used in fast process research. Jitter measurement technique is proposed for image converter streak cameras working in linear sweep mode of the pulsed optical signal in study. The experimental setup implementing this measurement technique is described. This setup is used in VNIIOFI for jitter checking of manufactured image converter streak cameras for compliance with specification or customer requirements.

Quantitative Solder Wetting Measurement for DCA Assembly

1992 ◽  
Vol 114 (4) ◽  
pp. 476-479 ◽  
Author(s):  
Cynthia M. Melton ◽  
Carl J. Raleigh ◽  
Susan M. Yarling
Keyword(s):  
Contact Angle ◽  
Measurement Technique ◽  
Continuous Monitoring ◽  
Solder Ball ◽  
Nitrogen Atmosphere ◽  
Base Diameter ◽  
Solder Flux ◽  
Wettability Measurement ◽  
Full Factorial ◽  
Final Degree

A quantitative dynamic solder wettability measurement technique was utilized to evaluate the effects of reflow processing on the wettability parameters associated with solder ball alloys. This technique enables the examination of the final degree of solder wetting and the continuous monitoring of wetting as a function of time during the reflow process under nitrogen atmosphere. An experimental design approach employing a 24 full factorial experiment was formulated to illustrate the use of this measurement technique investigating the final result of wetting. Solder wettability was determined with respect to the contact angle, base diameter and height of the reflowed solder ball alloy. The most significant effect estimates with respect to contact angle were solder flux and pad metallization. Solder ball alloy was found to significantly impact the base diameter and height of the reflowed solder. The effect of solder flux activators and pad metallizations on the subsequent continuous solder wettability wetting rates and amount of molten solder spread of solder ball alloys during reflow were measured. Reflow with a relatively more activated solder flux material was found to enhance the rate of solder wetting of the pad metallization.

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