Performance Testing of Loop Heat Pipe in a 1kW Heat Transport/Rejection System

2012 ◽  
Author(s):  
Sheleen Spencer ◽  
Ronald Sutton ◽  
Robert Baldauff ◽  
Triem Hoang
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Performance Testing ◽  
Loop Heat Pipe

Effect of Sintering Temperature and Time in Nickel Wick for Loop Heat Pipe with Flat Evaporator

2014 ◽  
Vol 602-605 ◽  
pp. 528-532
Author(s):  
Shen Chun Wu ◽  
Chang Yu Wu ◽  
Weie Jhih Lin ◽  
Jia Ruei Chen ◽  
Yau Ming Chen
Keyword(s):  
Heat Pipe ◽  
Constant Temperature ◽  
Heat Load ◽  
Sintering Temperature ◽  
Performance Testing ◽  
Effective Porosity ◽  
Temperature Curve ◽  
Loop Heat Pipe ◽  
Maximum Heat ◽  
Load Increase

This paper specifically addresses the effect of changing the constant temperature region of the sintering temperature curve in manufacturing nickel powder capillary structure (wick) on the performance of a flat loop heat pipe (FLHP). The sintering temperature curve is composed of three regions: a region of increasing temperature, a region of constant temperature, and a region of decreasing temperature, with the sintering time and temperature in the region of constant temperature having significant effect on the permeability of the wick. In this study, for wick manufacturing the temperatures in this region tested range from 550°C to 650°C and the time from 30 minutes to 60 minutes. The properties and internal parameters of the wick are measured, and the wick is placed into FLHP for performance testing. Experimental results show that at sintering temperature of 550°C and lasting about 45 minutes, maximum heat load is 200W, minimum thermal resistance is 0.32°C/W, permeability is , porosity is 66%, effective porosity is 3.8and heat flux is around 21W/cm2; related literatures have only reported maximum heat load increase of 25%.

Heat transport characteristics of loop heat pipe considering distribution of pore diameter

2016 ◽  
Vol 2016.54 (0) ◽  
pp. 77-78
Author(s):  
Atsushi TSUJIMORI ◽  
Yoshiya MATSUDA ◽  
Hiroki MATSUOKA ◽  
Sumiko KASHIMA
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Pore Diameter ◽  
Loop Heat Pipe

Study of a high heat transport Loop Heat Pipe for the automobile thermal management

2018 ◽  
Vol 2018.67 (0) ◽  
pp. 519
Author(s):  
Yoshitada AONO ◽  
Hosei NAGANO ◽  
Seiji YAMASHITA ◽  
Mamoru ISHIKIRIYAMA ◽  
Yu HOSHINO
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Thermal Management ◽  
High Heat ◽  
Loop Heat Pipe

505 Heat Transport Characteristics of Loop Heat Pipe for Cooling Servers

2009 ◽  
Vol 2009.48 (0) ◽  
pp. 145-146
Author(s):  
Takahiko SADO ◽  
Wataru ENOMOTO ◽  
Atsushi TSUJIMORI
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Loop Heat Pipe

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

2011 ◽  
Author(s):  
Tomonao Takamatsu ◽  
Katsumi Hisano ◽  
Hideo Iwasaki
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Thermal Energy ◽  
Heat Load ◽  
Cooling System ◽  
Electronic Devices ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Reserve Area ◽  
Heat Transport Capability

In this paper is presented the results on performance of the cooling model using Loop Heat Pipe (LHP) system. In recent years, ever-ending demand of high performance CPU led to a rapid increase in the amount of heat dissipation. Consequently, thermal designing of electronic devices need to consider some suitable approach to achieve high cooling performance in limited space. Heat Pipe concept is expected to serve as an effective cooling system for laptop PC, however, it suffered from some problems as follows. The heat transport capability of conventional Heat Pipe decreases with the reduction in its diameter or increase in its length. Therefore, in order to use it as cooling system for future electronic devices, the above-mentioned limitations need to be removed. Because of the operating principle, the LHP system is capable of transferring larger amount of heat than conventional heat pipes. However, most of the LHP systems suffered from some problems like the necessity of installing check valves and reservoirs to avoid occurrence of counter flow. Therefore, we developed a simple LHP system to install it on electronic devices. Under the present experimental condition (the working fluid was water), by keeping the inside diameter of liquid and vapor line equal to 2mm, and the distance between evaporator and condenser equal to 200mm, it was possible to transport more than 85W of thermal energy. The thickness of evaporator was about 5mm although it included a structure to serve the purpose of controlling vapor flow direction inside it. Successful operation of this system at inclined position and its restart capability are confirmed experimentally. In order to make the internal water location visible, the present LHP system is reconstructed using transparent material. In addition, to estimate the limit of heat transport capability of the present LHP system using this thin evaporator, the air cooling system is replaced by liquid cooling one for condensing device. Then this transparent LHP system could transport more than 100W of thermal energy. However, the growth of bubbles in the reserve area with the increase in heat load observed experimentally led to an understanding that in order to achieve stable operation of the LHP system under high heat load condition, it is very much essential to keep enough water in the reserve area and avoid blocking the inlet with bubbles formation.

Experimental study on the supercritical startup and heat transport capability of a neon-charged cryogenic loop heat pipe

2017 ◽  
Vol 134 ◽  
pp. 178-187 ◽  
Author(s):  
Yuandong Guo ◽  
Guiping Lin ◽  
Jiang He ◽  
Lizhan Bai ◽  
Hongxing Zhang ◽  
...  
Keyword(s):  
Experimental Study ◽  
Heat Pipe ◽  
Heat Transport ◽  
Loop Heat Pipe ◽  
Heat Transport Capability

406 Heat transport characteristics of loop heat pipe with plate-type evaporator

2008 ◽  
Vol 2008.47 (0) ◽  
pp. 95-96
Author(s):  
Atsushi TSUJMORI ◽  
Wataru ENOMOTO ◽  
Kazuyuki OBARA
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Loop Heat Pipe ◽  
Plate Type
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