scholarly journals The Interaction of Failure Modes in the Compression Response and Failure of Laminated Composites

2012 ◽  
Author(s):  
Pavana Prabhakar ◽  
Anthony Waas ◽  
Ravi Raveendra
Keyword(s):  
Failure Modes ◽  
Laminated Composites

Low Velocity Impact Analysis on GFRP Laminates under Different Temperatures

2011 ◽  
Vol 110-116 ◽  
pp. 632-636
Author(s):  
K. Pazhanivel ◽  
G.B. Bhaskar ◽  
S. Arunachalam ◽  
V. Hariharan ◽  
A. Elayaperumal
Keyword(s):  
Composite Materials ◽  
Impact Analysis ◽  
Failure Modes ◽  
Laminated Composites ◽  
Low Velocity Impact ◽  
Impact Behavior ◽  
Low Velocity ◽  
Aerospace Applications ◽  
Different Temperatures ◽  
The Impact

Composite materials have a number of properties that make them attractive for use in aerospace applications. The impact behavior of fiber reinforced composite materials is much more complex than conventional metallic structures due to a number of different failure modes on the inter laminar and intra laminar level. The aim of this study is to investigate the effects of temperature and thermal residual stresses on the impact behavior and damage of glass/epoxy laminated composites. To this end, thermal stress analyses of the laminates with lay-ups [90/0/0/90] s, [90/0/45/45] s, [0/90/45/-45] s, [45/0/-45/90] s are carried out under different temperatures by using ANSYS software. Also, the impact analysis on the laminated composites was performed at the different range of impact energies under different temperatures. The specific energy values and impact parameters were obtained and compared for each type of specimens and temperatures.

Study on bending and tensile properties of a T-shaped hook-connected structure made of two-and-a-half-dimensional woven composites and laminated composites

2019 ◽  
Vol 89 (19-20) ◽  
pp. 4046-4059 ◽  
Author(s):  
Hongjian Zhang ◽  
Junhua Guo ◽  
Weidong Wen ◽  
Haitao Cui ◽  
Shu He
Keyword(s):  
Mechanical Properties ◽  
Failure Modes ◽  
Bending Strength ◽  
Laminated Composites ◽  
Prediction Method ◽  
Experimental Results ◽  
Bending Test ◽  
Woven Composites ◽  
Root Edge ◽  
Connected Structure

In this paper, a kind of T-shaped hook-connected structure, which consists of a T-shaped plate made of two-and-a-half-dimensional woven composites and a groove structure made of T300/BMP316 laminated composites, was designed as the simulator specimen of the connection structure between the vane and the case in an aero-engine. As the bending strength and tensile strength are important mechanical properties, bending tests and tensile tests, respectively, of the T-shaped hook-connected structure were conducted to study the mechanical properties and failure modes under bending and tensile loads on web. Experimental results showed that the initial damages both occur at the root-edge, and then the damages extend to the root-middle during the bending test or extend perpendicular to the root-edge to the margin of the flange during the tensile test. Then, a strength prediction method based on the progressive damage theory was developed to simulate the mechanical properties and damage processes of the T-shaped hook-connected structure under bending and tensile loads, respectively. Compared with experimental results, the maximum error is less than 10%, and the damage modes are similar.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Interface forces measurement in laminated composites

2005 ◽  
Vol 126 ◽  
pp. 147-150 ◽  
Author(s):  
C. Barthod ◽  
G. Gautier ◽  
Y. Teisseyre ◽  
A. Agbossou
Keyword(s):  
Laminated Composites ◽  
Interface Forces
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