Thermal Design and Optimization of a Microchannel Cooled Integrated Power Electronic Module

2006 ◽  
Author(s):  
Manu Mital ◽  
Mingyuan Zhao ◽  
Elaine Scott ◽  
Rena Huang
Keyword(s):  
Thermal Design ◽  
Power Electronic ◽  
Design And Optimization

Thermal Design and Optimization of an IGBT Power Electronic Module

2005 ◽  
Author(s):  
Manu Mital ◽  
Elaine P. Scott
Keyword(s):  
Design Optimization ◽  
Thermal Design ◽  
Maximum Temperature ◽  
Power Electronic ◽  
Design And Optimization ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Module ◽  
Finite Element Package ◽  
Forced Air ◽  
Geometric Layout

This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power electronic module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT module. Thermal simulations were performed under different forced air convection conditions, and for both single and double-sided cooling, to study the effects on the hot-spots and maximum temperature rise of the module. The design optimization for the module was performed by varying parameters (choice of materials and layer thicknesses) and studying their effect on the thermal performance of the module. The results of these studies were several improved designs for the module.

Thermal Design and Optimization of Heat Exchangers

2019 ◽  
pp. 33-98
Author(s):  
Vivek K. Patel ◽  
Vimal J. Savsani ◽  
Mohamed A. Tawhid
Keyword(s):  
Heat Exchangers ◽  
Thermal Design ◽  
Design And Optimization

Thermal Design and Optimization of Few Miscellaneous Systems

2019 ◽  
pp. 345-413
Author(s):  
Vivek K. Patel ◽  
Vimal J. Savsani ◽  
Mohamed A. Tawhid
Keyword(s):  
Thermal Design ◽  
Design And Optimization
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