Thermal contact conductance of polymeric materials

1995 ◽  
Author(s):  
E Marotta ◽  
L Fletcher
Keyword(s):  
Thermal Contact ◽  
Polymeric Materials ◽  
Thermal Contact Conductance ◽  
Contact Conductance

scholarly journals Thermal Contact Conductance-Based Thermal Behavior Analytical Model for a Hybrid Floor at Elevated Temperatures

Materials ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 4257 ◽  
Author(s):  
Min Jae Park ◽  
Jeong Ki Min ◽  
Jaehoon Bae ◽  
Young K. Ju
Keyword(s):  
Thermal Behavior ◽  
Elevated Temperatures ◽  
Heated Surface ◽  
Thermal Contact ◽  
Polymeric Materials ◽  
Steel Plates ◽  
Thermal Contact Conductance ◽  
Small Scale ◽  
Element Analysis ◽  
Contact Conductance

Hybrid floors infilled with polymeric materials between two steel plates were developed as a prefabricated floor system in the construction industry. However, the floor’s fire resistance performance has not been investigated. To evaluate this, fire tests suggested by the Korean Standards should be performed. As these tests are costly and time consuming, the number of variables were limited. However, many variables can be investigated in other ways such as furnace tests and finite element analysis (FEA) with less cost and time. In this study, furnace tests on heated surface areas smaller than 1 m2 were conducted to investigate the thermal behavior of the hybrid floor at elevated temperatures. To obtain the reliability of the proposed thermal behavior analytical (TBA) model, verifications were conducted by FEAs. Thermal contact conductance including interfacial thermal properties between two materials was adopted in the TBA model, and the values at elevated temperatures were suggested based on thermo-gravimetric analyses results and verified by FEA. Errors between the tests and TBA model indicated that the model was adequate in predicting the temperature distribution in small-scale hybrids. Furthermore, larger furnace tests and analysis results were compared to verify the TBA model’s application to different sized hybrid floors.

Review of models for thermal contact conductance of metals

10.2514/3.870 ◽  
1997 ◽  
Vol 11 ◽  
pp. 129-140
Author(s):  
B. Merci ◽  
J. Steelant ◽  
J. Vierendeels ◽  
K. Riemslagh ◽  
E. Dick ◽  
...  
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance

Thermal contact conductance of adhesives for microelectronic systems

10.2514/3.871 ◽  
1997 ◽  
Vol 11 ◽  
pp. 141-145
Author(s):  
Andreas Haselbacher ◽  
Jiri Blazek ◽  
S. R. Mirmira ◽  
E. Marotta ◽  
L. S. Fletcher
Keyword(s):  
Thermal Contact ◽  
Thermal Contact Conductance ◽  
Contact Conductance
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