Development of the Single Graded Groove high-performance heat pipe

Author(s):  
J. AMBROSE ◽  
H. HOLMES
Keyword(s):  
2017 ◽  
Vol 53 (11) ◽  
pp. 3241-3247 ◽  
Author(s):  
Mohammad Shahed Ahamed ◽  
Yuji Saito ◽  
Koichi Mashiko ◽  
Masataka Mochizuki

Author(s):  
Pramod Chamarthy ◽  
H. Peter J. de Bock ◽  
Boris Russ ◽  
Shakti Chauhan ◽  
Brian Rush ◽  
...  

Heat pipes have been gaining a lot of popularity in electronics cooling applications due to their ease of operation, reliability, and high effective thermal conductivity. An important component of a heat pipe is the wick structure, which transports the condensate from condenser to evaporator. The design of wick structures is complicated by competing requirements to create high capillary driving forces and maintain high permeability. While generating large pore sizes will help achieve high permeability, it will significantly reduce the wick’s capillary performance. This study presents a novel experimental method to simultaneously measure capillary and permeability characteristics of the wick structures using fluorescent visualization. This technique will be used to study the effects of pore size and gravitational force on the flow-related properties of the wick structures. Initial results are presented on wick samples visually characterized from zero to nine g acceleration on a centrifuge. These results will provide a tool to understand the physics involved in transport through porous structures and help in the design of high performance heat pipes.


Author(s):  
M. H. de Wit ◽  
J. L. M. Hensen ◽  
H. A. L. van Dijk ◽  
G. J. van den Brink ◽  
E. van Galen

Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


2001 ◽  
Author(s):  
Lanchao Lin ◽  
Rengasamy Ponnappan ◽  
John Leland
Keyword(s):  

1999 ◽  
Vol 121 (07) ◽  
pp. 64-65
Author(s):  
Calvin C. Silverstein

This article reviews heat pipes that address thermal management problems inside high-performance aircraft engines. Higher performance engines demand that compressors develop higher pressure ratios which, in turn, result in higher temperatures at the entrance to the combustor. CCS Associates of Bethel Park, PA, proposes tackling the problem by using pipes to distribute heat more effectively throughout the combustor. The heat pipe liner must handle both acceleration and vibration. The heat pipe arrays, including half-thickness webs, can be fabricated into gas-side and air-side halves by extrusion, forging, stamping, chemical milling, or some combination of methods. The liquid flow channel would be formed as an integral part of the gas-side valves.


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