Development of the High Capability Air Launched test vehicle

1982 ◽  
Author(s):  
R. JENKINS
Keyword(s):  
Test Vehicle

Preparation of integrated circuits for TEM electromigration in situ studies

1986 ◽  
Vol 44 ◽  
pp. 882-883
Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
Integrated Circuits ◽  
Crystallographic Orientation ◽  
Silicon Wafers ◽  
Minimum Size ◽  
Test Vehicle ◽  
In Situ Studies ◽  
Boron Doped ◽  
Doped Silicon ◽  
Drill Holes

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.

Introduction of a Novel Sample Preparation Technique for the Failure Analysis of Silicon Integrated Photonics Modules

2019 ◽  
Author(s):  
Pradip Sairam Pichumani ◽  
Fauzia Khatkhatay
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Silicon Photonics ◽  
Cmos Technology ◽  
Single Step ◽  
Oxide Semiconductor ◽  
Disruptive Technology ◽  
Preparation Technique ◽  
Test Vehicle ◽  
Sample Preparation Technique

Abstract Silicon photonics is a disruptive technology that aims for monolithic integration of photonic devices onto the complementary metal-oxide-semiconductor (CMOS) technology platform to enable low-cost high-volume manufacturing. Since the technology is still in the research and development phase, failure analysis plays an important role in determining the root cause of failures seen in test vehicle silicon photonics modules. The fragile nature of the test vehicle modules warrants the development of new sample preparation methods to facilitate subsequent non-destructive and destructive analysis methods. This work provides an example of a single step sample preparation technique that will reduce the turnaround time while simultaneously increasing the scope of analysis techniques.

An effective procedure for extracting the first few bridge frequencies from a test vehicle

2021 ◽  
Author(s):  
Y. B. Yang ◽  
Hao Xu ◽  
X. Q. Mo ◽  
Z. L. Wang ◽  
Y. T. Wu
Keyword(s):  
Effective Procedure ◽  
Test Vehicle

3D direct vertical interconnect microprocessors test vehicle

2003 ◽  
Author(s):  
John Mayega ◽  
Okan Erdogan ◽  
Paul M. Belemjian ◽  
Kuan Zhou ◽  
John F. McDonald ◽  
...  
Keyword(s):  
Test Vehicle ◽  
Vertical Interconnect

Implementation and experimental evaluation of a MIMO drifting controller on a test vehicle

2020 ◽  
Author(s):  
Adam Bardos ◽  
Adam Domina ◽  
Viktor Tihanyi ◽  
Zsolt Szalay ◽  
Laszlo Palkovics
Keyword(s):  
Experimental Evaluation ◽  
Test Vehicle

Sample Preparation of Aluminum Bridge Test Vehicles for Tem In-Situ Crystallographic Studies of Electromigration

1987 ◽  
Vol 115 ◽  
Author(s):  
W. E. Rhoden ◽  
J. V. Maskowitz ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
High Temperature ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Circuit Reliability ◽  
Test Vehicle ◽  
Aluminum Films ◽  
Current Densities ◽  
Integrated Circuit Reliability ◽  
A Current

IntroductionElectromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.

Effects of Retroreflector Placement on the Nighttime Conspicuity of Pedestrians: An Open-Road Study

2007 ◽  
Vol 51 (24) ◽  
pp. 1565-1568 ◽  
Author(s):  
Stacy A. Balk ◽  
Justin S. Graving ◽  
Ryan G. Chanko ◽  
Richard A. Tyrrell
Keyword(s):  
Biological Motion ◽  
Class Ii ◽  
Left Shoulder ◽  
Test Vehicle ◽  
Safety Devices ◽  
Road Study ◽  
Open Road

While considerable data indicate that positioning retroreflective markings on a pedestrian's extremities can dramatically enhance nighttime conspicuity, most relevant safety devices (vests) limit coverage to the torso. We asked 120 participants to press a button whenever they recognized that a pedestrian was present during a short drive at night. A test pedestrian wearing different configurations of retroreflective markings was positioned on the left shoulder of an unilluminated two-lane roadway. Compared to an ANSI class-II vest alone, response distances were significantly greater when the vest was supplemented with ankle markings and when a full biological motion configuration was worn. Conspicuity was also greater when the pedestrian was walking and when facing the approaching test vehicle. Relative to a full eleven-element biological motion configuration, adding just two retroreflective ankle straps to a conventional safety vest is considerably more practical while still providing substantial conspicuity benefits.

The high-speed experimental flight test vehicle of HEXAFLY-INT: a multidisciplinary design

2021 ◽  
Author(s):  
Sara Di Benedetto ◽  
Maria Pia Di Donato ◽  
Antonio Schettino ◽  
Roberto Scigliano ◽  
Francesco Nebula ◽  
...  
Keyword(s):  
High Speed ◽  
Flight Test ◽  
Multidisciplinary Design ◽  
Test Vehicle

High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light Irradiation

2020 ◽  
Vol 2020 (1) ◽  
pp. 000302-000306
Author(s):  
Yuta Akasu ◽  
Emi Miyazawa ◽  
Tetsuya Enomoto ◽  
Yasuyuki Oyama ◽  
Shogo Sobue ◽  
...  
Keyword(s):  
Chemical Resistance ◽  
High Heat ◽  
Light Irradiation ◽  
Wafer Surface ◽  
Assembly Process ◽  
Test Vehicle ◽  
Packaging Process ◽  
Release System ◽  
Temporary Bonding ◽  
Carrier Wafer

Abstract We have developed a new temporary bonding film (TBF) and new debonding system with Xe flash light irradiation, named photonic release system, for advanced package assembly process. Since new TBF has a high Tg over 200 °C after curing and shows good chemical resistance to developer, resist stripper, and plating chemicals, no delamination, voiding, and swelling were observed after thermal and chemical treatment in the bonded structure of wafer and glass carrier. In addition, by adopting a metal-sputtered glass carrier, wafer could be debonded by Xe flash light irradiation in less than 1 ms through the glass carrier with no damage. Residual TBF on the wafer surface could be peeled off smoothly at ambient temperature without residue on the wafer. In this research, we also demonstrated the good applicability of this temporary bonding film to the typical packaging process by using test vehicle including 12 inch mold wafer and the advantage of photonic release system.

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