Development of low outgassing resins and electrical conductive paints for thermal control and space applications

1981 ◽  
Author(s):  
J. GUILLAUMON ◽  
J. GUILLIN
2009 ◽  
Author(s):  
Emile Haddad ◽  
Roman V. Kruzelecky ◽  
Brian Wong ◽  
Wes Jamroz ◽  
Mohamed Soltani ◽  
...  

Author(s):  
Nicolas Vayas Tobar ◽  
Pavolas N. Christidis ◽  
Nathaniel J. O'Connor ◽  
Michal Talmor ◽  
Jamal Seyed-Yagoobi

As modern day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable operation must advance as well to meet the demands. One such demand is the advent of flexible electronics for wearable technology, medical applications, and biology-inspired mechanisms. This paper presents the design and performance characteristics of a proof of concept for a flexible Electrohydrodynamic (EHD) pump, based on EHD conduction pumping technology in macro- and meso-scales. Unlike mechanical pumps, EHD conduction pumps have no moving parts, can be easily adjusted to the micro-scale, and have been shown to generate and control the flow of refrigerants for electronics cooling applications. However, these pumping devices have only been previously tested in rigid configurations unsuitable for use with flexible electronics. In this work, for the first time, the net flow generated by flexible EHD conduction pumps is measured on a flat-plane and in various bending configurations. In this behavioral characteristics study, the results show that the flexible EHD conduction pumps are capable of generating significant flow velocities in all size scales considered in this study, with and without bending. This study also proves the viability of screen printing as a manufacturing method for these pumps. EHD conduction pumping technology shows potential for use in a wide range of terrestrial and space applications, including thermal control of rigid as well as flexible electronics, flow generation and control in micro-scale heat exchangers and other thermal devices, as well as cooling of high power electrical systems, soft robotic actuators, and medical devices.


1966 ◽  
Vol 39 (4) ◽  
pp. 1247-1257 ◽  
Author(s):  
Clyde L. Whipple ◽  
John A. Thorne

Abstract Elastomeric silicones are among the best materials available for many ablative and space applications. In ablative applications, these materials protect launching equipment, safeguard various parts of vehicles and spacecraft during flight, and shield re-entering spacecraft. Generally, elastomeric silicones are used where ablative conditions involve low to moderate heat fluxes and shear forces. Ablative characteristics of materials can vary widely depending on polymer type, fillers, and applications techniques, and no one elastomeric silicone will perform in a wide range of ablative missions. A good knowledge of the ablative characteristics of silicone materials is required to select the best candidates for a given application. In the space environment, silicones are often used for seals, thermal control coatings, potting materials, and other applications because they perform well over wide temperature ranges, and because they are inherently stable to high-vacuum and ultraviolet conditions. Data given in this paper illustrate that silicones show little weight loss or loss of properties on exposure to space environmental extremes. Furthermore, these losses can be made almost negligible by proper conditioning of the finished elastomer.


2018 ◽  
Vol 2018 (0) ◽  
pp. 0207
Author(s):  
Soumei Baba ◽  
Kenichiro Sawada ◽  
Kohsuke Tanaka ◽  
Atsushi Okamoto

Author(s):  
Ryan A. Schmidt

The vacuum of space can lead to some interesting heater problems. In many space applications, heater patches consisting of Inconel elements joined together with Teflon sandwiched together between two Kapton layers are bonded to a structure (substrate) to provide thermal control. A void between the heater patch and the substrate can lead to a hot spot due to the loss of conduction path from the heater to the substrate. When the heater is in a vacuum with a void beneath it, heat is transferred to the substrate by radiation and fin effects through the heater and then to the substrate. The localized hot spot can cause heater layers to separate and further reduce the conduction pathway from the affected area and eventually burnout the heater. A large enough void combined with high heater heat fluxes and substrate temperatures can induce heater failures. For this paper the sensitivity of peak temperature with respect to heat flux (power density), substrate temperature, void size, and void location is considered.


Author(s):  
M. Marengo ◽  
S. Zhdanov ◽  
L. Chignoli ◽  
G. E. Cossali

During the space missions, the problems related to the thermal conditioning of devices, to the personnel comfort and to the thermo-mechanical stresses are known and important. Furthermore for a space mission certain priorities are stressed, such as the small dimension and the lightness of thermal equipments. Due to the presence of high temperature gradients, which straightforwardly implies significant heating/cooling powers, these characteristics are sometimes difficult to obtain. The decreasing of the satellites payloads in terms of mass and volume has brought to the necessity of a further development of traditional space technologies, such as heat pipes and radiators. A promising technology is the fabrication of micro-heat-sinks for active and passive thermal control systems suitable for the space environment, which is always an important workshop for future progresses. In fact, miniaturized heat sinks will have a terrestrial large industrial diffusion for electronic component cooling, in propulsion and in the power production for satellites, spacecrafts and airplanes, in various biomedical applications and in cloth conditioning in harsh environmental conditions. The present paper intends to introduce the reader to the standard space requirements, to present some new prospective and experiments to present some new prospective and experimental results and to discuss the use of thermal MEMS for micro- and nano-satellites.


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