Thermal conductivity enhancement of solid-solid phase-change materials for thermal storage

10.2514/3.237 ◽  
1991 ◽  
Vol 5 (1) ◽  
pp. 122-124 ◽  
Author(s):  
C. H. Son ◽  
J. H. Morehouse
Keyword(s):  
Thermal Conductivity ◽  
Phase Change ◽  
Phase Change Materials ◽  
Solid Phase ◽  
Thermal Storage ◽  
Thermal Conductivity Enhancement ◽  
Conductivity Enhancement

Polyethylene glycol/Cu/SiO2 form stable composite phase change materials: preparation, characterization, and thermal conductivity enhancement

RSC Advances ◽  
2016 ◽  
Vol 6 (63) ◽  
pp. 58740-58748 ◽  
Author(s):  
Xiaoguang Zhang ◽  
Zhaohui Huang ◽  
Bin Ma ◽  
Ruilong Wen ◽  
Ming Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polyethylene Glycol ◽  
Phase Change ◽  
Phase Change Materials ◽  
Sol Gel ◽  
Thermal Conductivity Enhancement ◽  
Gel Method ◽  
Conductivity Enhancement ◽  
Composite Phase Change Materials ◽  
Ultrasound Assisted

Novel form-stable composite phase change materials (FS-CPCMs) of polyethylene glycol (PEG)/Cu/SiO2 were prepared by adding Cu powder to PEG and SiO2via the ultrasound-assisted sol–gel method.

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