Optimal material selection using branch and bound techniques

AIAA Journal ◽  
1995 ◽  
Vol 33 (2) ◽  
pp. 340-347 ◽  
Author(s):  
A. E. Sepulveda
Keyword(s):  
Branch And Bound ◽  
Material Selection ◽  
Optimal Material ◽  
Branch And Bound Techniques

Research on Material Selection with Multi-Attribute Decision Method and G1 Method

2014 ◽  
Vol 952 ◽  
pp. 20-24 ◽  
Author(s):  
Xue Jun Xie
Keyword(s):  
Material Selection ◽  
Selection Process ◽  
Selection Problem ◽  
Topsis Method ◽  
Attribute Weight ◽  
Multi Attribute Decision Making ◽  
Judgment Matrix ◽  
Optimal Material ◽  
Selection Of ◽  
Better Than

The selection of an optimal material is an important aspect of design for mechanical, electrical, thermal, chemical or other application. Many factors (attributes) need to be considered in material selection process, and thus material selection problem is a multi-attribute decision making (MADM) problem. This paper proposes a new MADM method for material selection problem. G1 method does not need to test consistency of the judgment matrix. Thus it is better than AHP. In this paper, firstly, we use the G1 method to determine the attribute weight. Then TOPSIS method is used to calculate the closeness of the candidate materials with respect positive solution. A practical material selection case is used to demonstrate the effectiveness and feasibility of the proposed method.

ОСОБЕННОСТИ ПРОЦЕССОВ СБОРКИ БЕСКОРПУСНЫХ МИКРОСХЕМ В ТЕХНОЛОГИИ ИЗГОТОВЛЕНИЯ МИКРОСБОРОК НА ОСНОВЕ ВНУТРЕННЕГО МОНТАЖА

2020 ◽  
Vol 96 (3s) ◽  
pp. 396-406
Author(s):  
Д.В. Вертянов ◽  
В.Н. Сидоренко ◽  
И.А. Беляков
Keyword(s):  
Material Selection ◽  
Adhesive Properties ◽  
Carrier Materials ◽  
Optimal Material ◽  
Level Production ◽  
Attachment Process

Статья посвящена технологическим особенностям этапа установки кристаллов на временный носитель в технологии внутреннего монтажа, применяемой для создания высокоинтегрированных микросборок, многокристальных модулей и электронных модулей уровня «система в корпусе». Представлены результаты обзора и выбора материала в качестве временного носителя. Проведен обоснованный выбор материала из различных растворов полиамидокислот (ПАК) для фиксации кремниевых кристаллов активной стороной вниз на временный носитель. Представлены результаты исследований адгезионных свойств различных растворов ПАК. The paper is devoted to features of die to temporary carrier attachment process using embedded mounting technology applied for highly-integrated microassemblies, multi-chip modules and electronic modules of ‘system in package’ level production. The paper presents a review of existing temporary carrier materials and the results of research for carrier optimal material selection. Reasonable material selection has been performed from different polyamidoacids solutions (PAA) for fixing silicon dies on temporary carrier with active side down. The results of adhesive properties research for different PAA solutions have also been presented.

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