Aircraft Skin-Cooling System for Thermal Management of Onboard High-Power Electronics

1999 ◽  
Vol 13 (4) ◽  
pp. 529-536 ◽  
Author(s):  
Ab Hashemi ◽  
Elizabeth Dyson ◽  
Jay Nigen
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Cooling System ◽  
Skin Cooling ◽  
Aircraft Skin

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

2017 ◽  
Author(s):  
Michal Talmor ◽  
Jamal Yagoobi
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Cooling System ◽  
Thermal Control ◽  
Small Scale ◽  
Dielectric Fluid ◽  
Performance Characterization ◽  
Micro Scale ◽  
Coupled Equations ◽  
Moving Parts

As technological advances lead to miniaturization of high power electronics, the concentration of heat generating components per area increases to the point of requiring innovative, integrated cooling solutions to maintain operational temperatures. Traditional coolant pumps have many moving parts, making them susceptible to mechanical failure and requiring periodic maintenance. Such devices are too complex to be miniaturized and embedded in small scale systems. Electrohydrodynamic (EHD) conduction pumps offer an alternative way of generating fluid flow in small scales for use in modern thermal control systems for high power electronics, both for terrestrial and aerospace applications. In EHD conduction, the interaction between an applied electrical field and the dissociation of electrolyte species in a dielectric fluid generates an accumulation of space charge near the electrodes, known as heterocharge layers. These layers apply electric body forces in the fluid, resulting in a flow in the desired direction based on the pump characteristics. EHD conduction pumps work with dielectric fluids and have simple, flexible designs with no moving parts. These pumps have very low power consumption, operate reliably for longer periods than mechanical pumps, and have the ability to operate in microgravity. EHD conduction pumps have been previously proven effective for heat transfer enhancement in multiple size scales, but were only studied in a flush ring or flush flat electrode configurations at the micro-scale. This study provides the pressure and flow rate generation performance characterization for a micro-scale pump with perforated electrodes, designed to be manufactured and assembled using innovative techniques, and incorporated into an evaporator embedded in an electronic cooling system. The performance of the pump is numerically simulated based on the fully coupled equations of the EHD conduction model, showcasing the distinctive heterocharge layer structure and subsequent force generation unique to this innovative design.

Thermal management in high-power electronics cooled down using capillary pump

2003 ◽  
Author(s):  
Boguslaw Wiecek ◽  
Tomasz Wajman ◽  
Mariola Felczak ◽  
Marek Berlinski
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
High Power

Simulations of Metal Foam Cooling of High-Power Electronics Using the Equivalent Thermal Conductivity

2003 ◽  
Author(s):  
Nihad Dukhan ◽  
Pable D. Quinones
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Metal Foam ◽  
Maximum Temperature ◽  
Transfer Model ◽  
Aluminum Foams ◽  
Equivalent Thermal Conductivity

A one-dimensional heat transfer model for open-cell metal foam is presented. The model includes both the conduction and the convection in the ligaments and in the pores of the foam. It uses the typical foam parameters provided by the manufacturers. Three aluminum foams having different relative surface areas, relative densities, ligament diameters, and number of pores per inch are analyzed and an effective thermal conductivity is determined. The heat transfer increases with the number of pores per inch. The resulting improvement in heat transfer can be as high as 57 percent over solid aluminum. The model is general enough such that it can handle other types of foam and geometries. For simulations using packages for thermal management, the foam can be modeled as a solid having an equivalent conductivity with an effective convection heat transfer on its outer surfaces. This eliminates the need to model the microscopic flow and heat transfer in and around the pores. It also allows quick feasibility studies and comparisons of different arrangements using aluminum foams for thermal management systems of high-power electronics. A few such simulations are presented in this work. The simulations show a big promise for using the foam in place of the traditional heat sinks for cooling high-power electronics: they reduce the cooling system’s weight substantially and reduce the maximum temperature significantly.

scholarly journals Flow Boiling of Low-Pressure Water in Microchannels of Large Aspect Ratio

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2689
Author(s):  
Liang Chen ◽  
Xingchen Li ◽  
Runfeng Xiao ◽  
Kunpeng Lv ◽  
Xue Yang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Power Electronics ◽  
Thermal Management ◽  
High Power ◽  
Flow Boiling ◽  
Width Ratio ◽  
Bubble Behavior ◽  
Uniform Wall Temperature ◽  
Pressure Water ◽  
Uniform Wall

Flow boiling heat transfer in microchannels can provide a high cooling rate, while maintaining a uniform wall temperature, which has been extensively studied as an attractive solution for the thermal management of high-power electronics. The depth-to-width ratio of the microchannel is an important parameter, which not only determines the heat transfer area but also has dominant effect on the heat transfer mechanisms. In the present study, numerical simulations based on the volume of fraction models are performed on the flow boiling in very deep microchannels. The effects of the depth-to-width ratio on the heat transfer coefficient and pressure drop are discussed. The bubble behavior and heat transfer characteristics are analyzed to explain the mechanism of heat transfer enhancement. The results show the very deep microchannels can effectively enhance the heat transfer, lower the temperature rise and show promising applications in the thermal management of high-power electronics.

Experimental Study on Thermosyphon for Shipboard High-Power Electronics Cooling System

2014 ◽  
Vol 35 (11-12) ◽  
pp. 1077-1083 ◽  
Author(s):  
Qiusheng Liu ◽  
Katsuya Fukuda ◽  
Purwono F. Sutopo
Keyword(s):  
Experimental Study ◽  
Power Electronics ◽  
High Power ◽  
Cooling System ◽  
Electronics Cooling
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