Experimental Characterization of a Lanthanum Hexaboride Hollow Cathode for Five-Kilowatt-Class Hall Thrusters

2016 ◽  
Vol 32 (6) ◽  
pp. 1557-1561 ◽  
Author(s):  
Daniela Pedrini ◽  
Riccardo Albertoni ◽  
Fabrizio Paganucci ◽  
Mariano Andrenucci
Keyword(s):  
Hollow Cathode ◽  
Lanthanum Hexaboride ◽  
Hall Thrusters ◽  
Experimental Characterization

Experimental characterization of a ns-pulsed micro-hollow cathode discharge (MHCD) array in a N2/Ar mixture

2019 ◽  
Vol 28 (3) ◽  
pp. 035003 ◽  
Author(s):  
S Kasri ◽  
L William ◽  
X Aubert ◽  
G Lombardi ◽  
A Tallaire ◽  
...  
Keyword(s):  
Hollow Cathode ◽  
Hollow Cathode Discharge ◽  
Experimental Characterization

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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