scholarly journals Aerodynamic Analyses and Database Development for Ares I Vehicle First-Stage Separation

2012 ◽  
Vol 49 (5) ◽  
pp. 864-874 ◽  
Author(s):  
Bandu N. Pamadi ◽  
Jing Pei ◽  
Jeremy T. Pinier ◽  
Scott D. Holland ◽  
Peter F. Covell ◽  
...  
Keyword(s):  
Database Development ◽  
Stage Separation ◽  
Ares I

Aerodynamic Database Development for Lift-off/Transition and Ascent of the Ares I Vehicle

2012 ◽  
Vol 49 (4) ◽  
pp. 586-595
Author(s):  
Bandu N. Pamadi ◽  
Jing Pei ◽  
Peter F. Covell ◽  
Clyde R. Gumbert ◽  
Jeremy L. Hanke ◽  
...  
Keyword(s):  
Database Development ◽  
Aerodynamic Database ◽  
Lift Off ◽  
Ares I

scholarly journals Ares I and Ares I-X Stage Separation Aerodynamic Testing

2012 ◽  
Vol 49 (5) ◽  
pp. 842-852
Author(s):  
Jeremy T. Pinier
Keyword(s):  
Stage Separation ◽  
Ares I

Withdrawal: Ascent Aerodynamic Force and Moment Database Development for the Space Launch System

2019 ◽  
Author(s):  
Patrick R. Shea ◽  
Jeremy T. Pinier ◽  
Heather P. Houlden ◽  
Amber L. Favaregh ◽  
Michael J. Hemsch ◽  
...  
Keyword(s):  
Aerodynamic Force ◽  
Database Development ◽  
Space Launch

Yield Enhancement Study: Process Variation and Design Margins Leading to Timing Issues in the RAM

2000 ◽  
Author(s):  
Srikanth Perungulam ◽  
Scott Wills ◽  
Greg Mekras
Keyword(s):  
Cross Sections ◽  
Digital Signal Processor ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Random Access ◽  
Digital Signal ◽  
Yield Enhancement ◽  
Final Conclusion ◽  
Stage Separation ◽  
Study Process

Abstract This paper illustrates a yield enhancement effort on a Digital Signal Processor (DSP) where random columns in the Static Random Access Memory (SRAM) were found to be failing. In this SRAM circuit, sense amps are designed with a two-stage separation and latch sequence. In the failing devices the bit line and bit_bar line were not separated far enough in voltage before latching got triggered. The design team determined that the sense amp was being turned on too quickly. The final conclusion was that a marginal sense amp design, combined with process deviations, would result in this type of failure. The possible process issues were narrowed to variations of via resistances on the bit and bit_bar lines. Scanning Electron Microscope (SEM) inspection of the the Focused Ion Beam (FIB) cross sections followed by Transmission Electron Microscopy (TEM) showed the presence of contaminants at the bottom of the vias causing resistance variations.

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