Heat-Transfer in Loop Heat Pipes Capillary Wick: Effect Effective Thermal Conductivity

2007 ◽  
Vol 21 (1) ◽  
pp. 134-140 ◽  
Author(s):  
Chuan Ren ◽  
Qing-Song Wu
2011 ◽  
Vol 134 (1) ◽  
Author(s):  
Karthik K. Bodla ◽  
Jayathi Y. Murthy ◽  
Suresh V. Garimella

Porous sintered microstructures are critical to the functioning of passive heat transport devices such as heat pipes. The topology and microstructure of the porous wick play a crucial role in determining the thermal performance of such devices. Three sintered copper wick samples employed in commercial heat pipes are characterized in this work in terms of their thermal transport properties––porosity, effective thermal conductivity, permeability, and interfacial heat transfer coefficient. The commercially available samples of nearly identical porosities (∼61% open volume) are CT scanned at 5.5 μm resolution, and the resulting image stack is reconstructed to produce high-quality finite volume meshes representing the solid and interstitial pore regions, with a conformal mesh at the interface separating these two regions. The resulting mesh is then employed for numerical analysis of thermal transport through fluid-saturated porous sintered beds. Multiple realizations are employed for statistically averaging out the randomness exhibited by the samples under consideration. The effective thermal conductivity and permeability data are compared with analytical models developed for spherical particle beds. The dependence of effective thermal conductivity of sintered samples on the extent of sintering is quantified. The interfacial heat transfer coefficient is compared against a correlation from the literature based on experimental data obtained with spherical particle beds. A modified correlation is proposed to match the results obtained.


Author(s):  
Sean W. Reilly ◽  
Ivan Catton

Biporous evaporator wicks, generated by sintering copper particles into semi-uniform clusters, were demonstrated to achieve high flux, heat transfer performance for use in heat pipes by Semenic (2007). The effective thermal conductivity of thick biporous wicks at high heat fluxes was found to be reduced because the region next to the wall dried out prematurely allowing the wall interface temperature to rise well above the saturation temperature. The region above the dried out portion of the wick continued to work with the large pores between the clusters being primarily occupied with vapor and the small pores between the particles being occupied with the liquid. In this work, we report our efforts to reduce the size of the wall-wick interface dry-out region by sintering a thin layer of uniform size particles on the wall as originally suggested in a thesis by Seminic (2007). The boiling curve for this “double layer” wick diverges from a standard “single layer” biporous wick at the point of nucleation by reducing the wall temperature, and concurrently the overall temperature drop across the wick needed to drive a given heat flux. The temperature drop across the wick is reduced because the thin layer of particles between the biporous wick and the wall reduces the wall-wick interface resistance and also provides additional capillary channels underneath the biporous wick. Experimental data supports this hypothesis by showing a clear divergence between measured wall temperatures for the double layer wick from its single layer counterpart. The presumed point of nucleation in both wicks is similar, with the heat flux increasing much more rapidly than the liquid superheat and it is clear that this slope is much steeper for the double layer wick. This finding has great potential to expand the performance capabilities of heat pipes and vapor chambers because the new double layered wick can transfer more heat with less superheat thereby increasing the effective thermal conductivity of the wick and decreasing the wall-wick interface temperature for a given heat flux.


Author(s):  
Gongming Xin ◽  
Lin Cheng

In this study, a series of sintered nickel-copper wicks with different ratios of copper powders in the mixture of wicks were fabricated, with the effective thermal conductivities (ETC) experimentally investigated by using the steady-state method. The ETC of wick with composition of 60% nickel and 40% copper presents the lowest value among the tested range. Comparisons of some existing models for predication of porous effective thermal conductivity to experiment results were performed, but no reasonable accurate predictions were found for the tested Ni-Cu wicks.


Author(s):  
Ayushman Singh ◽  
Srikanth Rangarajan ◽  
Leila Choobineh ◽  
Bahgat Sammakia

Abstract This work presents an approach to optimally designing a composite with thermal conductivity enhancers (TCEs) infiltrated with phase change material (PCM) based on figure of merit (FOM) for thermal management of portable electronic devices. The FOM defines the balance between effective thermal conductivity and energy storage capacity. In present study, TCEs are in the form of a honeycomb structure. TCEs are often used in conjunction with PCM to enhance the conductivity of the composite medium. Under constrained composite volume, the higher volume fraction of TCEs improves the effective thermal conductivity of the composite, while it reduces the amount of latent heat storage simultaneously. The present work arrives at the optimal design of composite for electronic cooling by maximizing the FOM to resolve the stated trade-off. In this study, the total volume of the composite and the interfacial heat transfer area between the PCM and TCE are constrained for all design points. A benchmarked two-dimensional direct CFD model was employed to investigate the thermal performance of the PCM and TCE composite. Furthermore, assuming conduction-dominated heat transfer in the composite, a simplified effective numerical model that solves the single energy equation with the effective properties of the PCM and TCE has been developed. The effective thermal conductivity of the composite is obtained by minimizing the error between the transient temperature gradient of direct and simplified model by iteratively varying the effective thermal conductivity. The FOM is maximized to find the optimal volume fraction for the present design.


2009 ◽  
Vol 38 (11) ◽  
pp. 2218-2223 ◽  
Author(s):  
Alex Sandro Campos Maia ◽  
Roberto Gomes da Silva ◽  
João Batista Freire de Souza Junior ◽  
Rosiane Batista da Silva ◽  
Hérica Girlane Tertulino Domingos

The objective of the present study was to assess the effective thermal conductivity of the hair coat (k ef, mW.m-1.K-1) of Holstein cows in a tropical environment, as related to conduction and radiation in the absence of free convection. The average k ef was 49.72 mW.m-1.K-1, about twice the conductivity of the air (26 mW.m-1.K-1) and much less than that of the hair fibres (260 mW.m-1.K-1). The low k ef values were attributed mainly to the small cross area of individual hairs, ρef/ρf (17.2% and 21.3% for black and white hairs, respectively). White coats were denser, with longer hairs and significantly higher k ef (53.15 mW.m-1.K-1) than that of the black hairs (49.25 mW.m-1.K-1). The heritability coefficient of the effective thermal conductivity was calculated as h²=0.18 the possibility was discussed of selecting cattle for increased heat transfer through the hair coat.


1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.


2019 ◽  
Vol 141 (1) ◽  
Author(s):  
Yuntao Cui ◽  
Yujie Ding ◽  
Shuo Xu ◽  
Yushu Wang ◽  
Wei Rao ◽  
...  

Gallium-based liquid metal (LM) inherits excellent thermophysical properties and pollution-free characteristics. However, it has long been a fatal problem that LM would cause serious corrosion and embrittlement on the classical substrate made of aluminum alloys in constructing chip cooling device. Here, anodic oxidation treatment was introduced on processing the aluminum alloy aiming to tackle the corrosion issues. The prepared anodic oxidation aluminum (AAO) coatings were composed of nanopore layers and barrier layers on a high-purity alumina matrix that were manufactured electrochemically. According to the measurement, the effective thermal conductivity of the anodized aluminum alloy increases with the total thickness of sample increasing. When the total thickness L exceeds 5 × 10−3 m, effects of the porous media on effective thermal conductivity are negligible via model simulation and calculation. It was experimentally found that aluminum alloy after surface anodization treatment presented excellent corrosion resistance and outstanding heat transfer performance even when exposed in eutectic gallium–indium (E-GaIn) LM over 200 °C. The convective heat transfer coefficient of LM for anodized sample reached the peak when the heat load is 33.3 W.


2016 ◽  
Vol 846 ◽  
pp. 500-505
Author(s):  
Wei Jing Dai ◽  
Yi Xiang Gan ◽  
Dorian Hanaor

Effective thermal conductivity is an important property of granular materials in engineering applications and industrial processes, including the blending and mixing of powders, sintering of ceramics and refractory metals, and electrochemical interactions in fuel cells and Li-ion batteries. The thermo-mechanical properties of granular materials with macroscopic particle sizes (above 1 mm) have been investigated experimentally and theoretically, but knowledge remains limited for materials consisting of micro/nanosized grains. In this work we study the effective thermal conductivity of micro/nanopowders under varying conditions of mechanical stress and gas pressure via the discrete thermal resistance method. In this proposed method, a unit cell of contact structure is regarded as one thermal resistor. Thermal transport between two contacting particles and through the gas phase (including conduction in the gas phase and heat transfer of solid-gas interfaces) are the main mechanisms. Due to the small size of particles, the gas phase is limited to a small volume and a simplified gas heat transfer model is applied considering the Knudsen number. During loading, changes in the gas volume and the contact area between particles are simulated by the finite element method. The thermal resistance of one contact unit is calculated through the combination of the heat transfer mechanisms. A simplified relationship between effective thermal conductivity and loading pressure can be obtained by integrating the contact units of the compacted powders.


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