Simple and efficient baseline removal method for a smartphone based ECG detection device

2013 ◽  
Author(s):  
Xianxiang Chen ◽  
Zhen Fang ◽  
Ren Ren ◽  
Shanhong Xia ◽  
Yangmin Qian ◽  
...  
Keyword(s):  
Removal Method ◽  
Baseline Removal

A Model-Free, Fully Automated Baseline-Removal Method for Raman Spectra

2011 ◽  
Vol 65 (1) ◽  
pp. 75-84 ◽  
Author(s):  
H. Georg Schulze ◽  
Rod B. Foist ◽  
Kadek Okuda ◽  
André Ivanov ◽  
Robin F. B. Turner
Keyword(s):  
Raman Spectra ◽  
Removal Method ◽  
Model Free ◽  
Baseline Removal

A robust baseline removal method for guided wave damage localization

2014 ◽  
Author(s):  
Chang Liu ◽  
Joel B. Harley ◽  
Mario Bergés ◽  
David W. Greve ◽  
Warren R. Junker ◽  
...  
Keyword(s):  
Guided Wave ◽  
Damage Localization ◽  
Removal Method ◽  
Baseline Removal

Baseline removal in spectrometry gamma by observation of local minima

2021 ◽  
Vol 1 (1) ◽  
pp. 1-12
Author(s):  
Kélian This ◽  
Laurent Le Brusquet ◽  
Adrien Frigerio ◽  
Sébastien Colas ◽  
Pascal Bondon
Keyword(s):  
Gamma Spectrometry ◽  
Statistical Properties ◽  
Local Minima ◽  
Removal Method ◽  
Baseline Removal

This paper presents a Baseline Removal method in the context of spectrometry gamma. The method implements an estimator for the full continuum based on the observation of local minima. This estimator is constructed from the statistical properties of the signal and is therefore easily explainable. The method involves a limited number of fixed parameters, which allows the automation of the process. Moreover, the method is adaptable to any peaks width, which makes it suitable for both HPGe spectrometers and scintillators. Application to real gamma spectrometry measurements are presented, as well as a discussion about the choice of the parameters, for which an adjustment is proposed.

An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

2005 ◽  
Author(s):  
Carl M. Nail
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Success Rate ◽  
Mechanical Damage ◽  
Test Equipment ◽  
High Success Rate ◽  
Automated Test Equipment ◽  
Removal Method ◽  
Automated Test ◽  
Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

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