scholarly journals 3D FEM temperature distribution analysis of the human eye exposed to laser radiation

2010 ◽  
Author(s):  
M. Cvetković ◽  
D. Čavka ◽  
D. Poljak ◽  
A. Peratta
Keyword(s):  
Laser Radiation ◽  
Temperature Distribution ◽  
Distribution Analysis ◽  
3D Fem ◽  
Human Eye

A New System For Optomanual Semiautomatic Quantitative Image Analysis

1977 ◽  
Vol 35 ◽  
pp. 210-211
Author(s):  
H.P. Rohr
Keyword(s):  
Image Analysis ◽  
Volume Density ◽  
List Type ◽  
Distribution Analysis ◽  
Type Number ◽  
Point Counting ◽  
Human Eye ◽  
Quantitative Image ◽  
Point Density ◽  
Electronic Counting

Today, in image analysis the broadest possible rationalization and economization have become desirable. Basically, there are two approaches for image analysis: The image analysis through the so-called scanning methods which are usually performed without the human eye and the systems of optical semiautomatic analysis completely relying on the human eye.The new MOP AM 01 opto-manual system (fig.) represents one of the very promising approaches in this field. The instrument consists of an electronic counting and storing unit, which incorporates a microprocessor and a keyboard for choice of measuring parameters, well designed for easy use.Using the MOP AM 01 there are three possibilities of image analysis:the manual point counting,the opto-manual point counting andthe measurement of absolute areas and/or length (size distribution analysis included).To determine a point density for the calculation of the corresponding volume density the intercepts lying within the structure are scanned with the light pen.

Characterization of volcanic thermal anomalies by means of sub-pixel temperature distribution analysis

2005 ◽  
Vol 68 (7-8) ◽  
pp. 641-651 ◽  
Author(s):  
Valerio Lombardo ◽  
Maria Fabrizia Buongiorno ◽  
Stefania Amici
Keyword(s):  
Temperature Distribution ◽  
Distribution Analysis ◽  
Thermal Anomalies

Effect of tissue and atmosphere's parameters on human eye temperature distribution

2015 ◽  
Vol 47 ◽  
pp. 51-58 ◽  
Author(s):  
Mohammad Sadegh Firoozan ◽  
Soheil Porkhial ◽  
Ali Salmani Nejad
Keyword(s):  
Temperature Distribution ◽  
Human Eye ◽  
Eye Temperature

Electrothermal analysis of integrated circuits: a realization by infrared thermography

2021 ◽  
Author(s):  
Farnoos Farrokhi
Keyword(s):  
Temperature Distribution ◽  
Integrated Circuits ◽  
Power Dissipation ◽  
Electronic Device ◽  
Power Measurement ◽  
Device Under Test ◽  
Distribution Analysis ◽  
Ir Thermography ◽  
Temperature Dependent ◽  
Run Time

The International Technology Roadmap for Silicon (ITRS) predicted that by the year 2016, a high-performance chip could dissipate as much as 300 W/cm² of heat. Another more noticeable thermal issue in IC's is the uneven temperature distribution. Increased power dissipation and greater temperature variation highlight the need for electrothermal analysis of electronic components. The goal of this research is to develop an experimental infrared measurement technique for the thermal and electrothermal analysis of electronic circuits. The objective of the electrothermal analysis is to represent the behavior of the temperature dependent characteristics of electronic device in near real work condition. An infrared (IR) thermography setup to perform the temperature distribution analysis and power dissipation measurement of the device under test is proposed in this reasearch. The system is based on a transparent oil heatsink which captures the thermal profile and run-time power dissipation from the device under test with a very fine degree of granularity. The proposed setup is used to perform the thermal analysis and power measurement of an Intel Dual Core E2180 processor. The power dissipation of the processor is obtained by calculating and measuring the heat transfer coefficient of the oil heatsink. Moreover, the power consumption of the processor is measured by isolating the current used by the CPU at run time. A three-dimensional fininte element thermal model is developed to simulate the thermal properties of the processor. The results obtained using this simulation is compared to the experimental results from IR thermography. A methodology to perform electrothermal analysis on integrated circuits is introduced. This method is based on coupling a standard electrical simulator, which is often used in the design process, and IR thermography system through an efficient interface program. The proposed method is capable of updating the temperature dependent parameters of device in near real time. The proposed method is applied to perform electrothermal analysis of a power MOSFET to measure the temperature distribution and the device performance. The DC characteristics of the device are investigated. The obtained results indicated that the operating point, I-V characteristics and power dissipation of the MOSFET vary significantly with temperature.

scholarly journals FETD COMPUTATION OF THE TEMPERATURE DISTRIBUTION INDUCED INTO A HUMAN EYE BY A PULSED LASER

2011 ◽  
Vol 120 ◽  
pp. 403-421 ◽  
Author(s):  
Mario Cvetković ◽  
Dragan Poljak ◽  
Andres Peratta
Keyword(s):  
Temperature Distribution ◽  
Pulsed Laser ◽  
Human Eye

scholarly journals Temperature distribution analysis of different technologies of PV modules using infrared thermography

2018 ◽  
Vol 49 ◽  
pp. 00044 ◽  
Author(s):  
Slawomir Gulkowski ◽  
Natalia Zytkowska ◽  
Piotr Dragan
Keyword(s):  
Temperature Distribution ◽  
Infrared Thermography ◽  
Power Production ◽  
Distribution Analysis ◽  
Copper Indium Gallium Diselenide ◽  
Pv Systems ◽  
Copper Indium ◽  
Long Time ◽  
High Level ◽  
Continuous Power

Photovoltaic systems are designed to operate for a very long time according to the modules’ warranty that guarantees at least of 80% of the nominal power production after 20 years of use. In order to assure the continuous power production with a high level for a long time, thermographic analysis should be performed to detect incipient anomalies in individual modules and junction boxes. This safe, convenient and noncontact method allows carrying out the inspection for working system without any contact with live wiring and without disconnecting the PV systems. Temperature distribution of the module surface can reveal many different types of anomalies, i.e. hot spots caused by local shading, microcracking or cell breakage. This paper shows the results of the infrared thermography analysis of the operating PV systems consisting of different technological modules: polycrystalline silicon (pc-Si), copper indium gallium diselenide (CIGS) and cadmium telluride (CdTe). The average working temperature of each different kind of technological module as well as overheated areas were investigated in this study. Temperature of the MC4 connectors was also analysed.

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