Composite Materials. Blind Via Hole Drilling for Multi-Layers Printed Wiring Board Using Laser Beam. Comparison between Aramid and Glass Fiber Reinforced PWB.
1999 ◽
Vol 48
(5)
◽
pp. 467-472
◽
Keyword(s):
Via Hole
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2017 ◽
Vol 93
(1-4)
◽
pp. 953-965
◽
2004 ◽
Vol 64
(7-8)
◽
pp. 945-954
◽
Keyword(s):
2013 ◽
Vol 750
◽
pp. 142-146
◽