scholarly journals Solid-state bonding of A6061/high-tensile steel plate by metal salt generation bonding technique with acetic acid

2019 ◽  
Vol 69 (11) ◽  
pp. 548-552
Author(s):  
Shinji Koyama ◽  
Kohei Ozawa ◽  
Takako Muraoka
Keyword(s):  
Acetic Acid ◽  
Solid State ◽  
Steel Plate ◽  
Metal Salt ◽  
Solid State Bonding ◽  
Bonding Technique

Adhesion mechanisms in the solid-state bonding technique using submicrometer aromatic thermosetting copolyester adhesive

2004 ◽  
Vol 92 (6) ◽  
pp. 3843-3856 ◽  
Author(s):  
Kun Xu ◽  
John C. Selby ◽  
Mark A. Shannon ◽  
James Economy
Keyword(s):  
Solid State ◽  
Solid State Bonding ◽  
Bonding Technique

A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

2014 ◽  
Vol 783-786 ◽  
pp. 2450-2455
Author(s):  
Shinji Koyama
Keyword(s):  
Solid State ◽  
Formic Acid ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Copper Surface ◽  
Solid State Bonding ◽  
Bonded Joint ◽  
Set Up ◽  
Bonding Method ◽  
Aluminum Surfaces

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.

Solid-State Bonding Technique for Template-Stripped Ultraflat Gold Substrates

Langmuir ◽  
2006 ◽  
Vol 22 (6) ◽  
pp. 2437-2440 ◽  
Author(s):  
David W. Mosley ◽  
Brian Y. Chow ◽  
Joseph M. Jacobson
Keyword(s):  
Solid State ◽  
Solid State Bonding ◽  
Gold Substrates ◽  
Bonding Technique

Fe/Ni diffusion behavior in the shear-extrusion solid state bonding process

2021 ◽  
Vol 67 ◽  
pp. 35-45
Author(s):  
Shuangjie Zhang ◽  
Wei Wang ◽  
Shibo Ma ◽  
Qiang Li
Keyword(s):  
Solid State ◽  
Bonding Process ◽  
Diffusion Behavior ◽  
Solid State Bonding

Monitoring the microbial community during solid-state acetic acid fermentation of Zhenjiang aromatic vinegar

2011 ◽  
Vol 28 (6) ◽  
pp. 1175-1181 ◽  
Author(s):  
Wei Xu ◽  
Zhiyong Huang ◽  
Xiaojun Zhang ◽  
Qi Li ◽  
Zhenming Lu ◽  
...  
Keyword(s):  
Acetic Acid ◽  
Microbial Community ◽  
Solid State ◽  
Acid Fermentation ◽  
Acetic Acid Fermentation

Solid-state bonding between vanadium alloys and alumina

1991 ◽  
Vol 179-181 ◽  
pp. 1166
Author(s):  
K. Abe ◽  
T. Higuchi ◽  
Y. Fujino
Keyword(s):  
Solid State ◽  
Vanadium Alloys ◽  
Solid State Bonding
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