scholarly journals Production of Al2O3 particle/Al-4.5%Cu alloy composite by transient liquid phase sintering process.

1997 ◽  
Vol 47 (9) ◽  
pp. 481-486 ◽  
Author(s):  
Masayoshi OZAWA ◽  
Kouei YOSHIHARA ◽  
Tadashi MOMONO ◽  
Hiroshi G. KATAYAMA
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Al2o3 Particle ◽  
Liquid Phase Sintering ◽  
Sintering Process ◽  
Alloy Composite ◽  
Cu Alloy ◽  
Transient Liquid Phase Sintering

scholarly journals Production of Al-4.5mass%Cu alloy by transient liquid phase sintering.

1996 ◽  
Vol 46 (4) ◽  
pp. 171-176 ◽  
Author(s):  
Masayoshi OZAWA ◽  
Hiroshi KIMURA ◽  
Tadashi MOMONO ◽  
Hiroshi G. KATAYAMA
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Cu Alloy ◽  
Transient Liquid Phase Sintering

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

2021 ◽  
Author(s):  
Gilad Nave ◽  
Clifton Buxbaum ◽  
F. Patrick McCluskey
Keyword(s):  
Electrical Conductivity ◽  
Additive Manufacturing ◽  
Melting Point ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Laser Sintering ◽  
Liquid Phase Sintering ◽  
Metal Powders ◽  
Sintering Process ◽  
Transient Liquid Phase Sintering

Abstract Additive manufacturing is rapidly revolutionizing the way products are designed and built. Its advantages in terms of mobile manufacturing, mass customization, part reduction, waste reduction, and just-in-time sparing are causing it to be considered for many electronics applications. Many of these applications require high thermal and electrical conductivity and high strength in harsh environments. Such applications would benefit greatly from additive manufacturing of metals. However, the number of metal systems that can be successfully manufactured this way is small, with some of the highest conductivity metals (e.g. Cu, Ag) being particularly difficult. Two ways of depositing metals dominate the market. The first is direct ink writing (DIW). The other common technique is laser sintering, including direct metal laser sintering (DMLS). While the DIW process is fine in principle, the inks typically used are not optimized for harsh applications, and produce a voided and porous layer that limits the thermal and electrical conductivity. Laser sintering must be done in vacuum and requires that the laser raise the temperature of the powder to around 500°C which can result in damage to the substrate. Furthermore, this process is expensive, lacks mobility, and consumes significant energy. This paper will discuss a new form of metal additive manufacturing that addresses the shortcomings of current direct writing and laser sintering approaches by making use of the transient liquid phase sintering process. During the TLPS process, low melting point semimetal powder of Indium will be melted at a temperature of 300°C. This liquid will then surround and diffuse with high melting temperature metal powders forming intermetallic compounds at the solid-liquid interface. These intermetallics possess a higher melting point than the low temperature semimetal. The paper will demonstrate the use of this technique to make reliable 2D lines and 3D structures. It will also discuss the deposition and sintering process and its effect on the adhesion strength, thermal conductivity, and electrical resistivity of the resulting structures.

Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process

2021 ◽  
Author(s):  
Steffen Hadeler ◽  
Henning Seefisch ◽  
Rico Ottermann ◽  
Yangyang Long ◽  
Folke Dencker ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Sintering Process ◽  
Transient Liquid Phase Sintering ◽  
Silver Sintering

Transient liquid-phase sintering using silver and tin powder mixture for die bonding

2016 ◽  
Vol 55 (4S) ◽  
pp. 04EC14 ◽  
Author(s):  
Masahisa Fujino ◽  
Hirozumi Narusawa ◽  
Yuzuru Kuramochi ◽  
Eiji Higurashi ◽  
Tadatomo Suga ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Powder Mixture ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Die Bonding ◽  
Transient Liquid Phase Sintering

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

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